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TW200707096A - Resist composition - Google Patents

Resist composition

Info

Publication number
TW200707096A
TW200707096A TW095125969A TW95125969A TW200707096A TW 200707096 A TW200707096 A TW 200707096A TW 095125969 A TW095125969 A TW 095125969A TW 95125969 A TW95125969 A TW 95125969A TW 200707096 A TW200707096 A TW 200707096A
Authority
TW
Taiwan
Prior art keywords
resist
resist composition
monoalkoxy
present
enhancing
Prior art date
Application number
TW095125969A
Other languages
Chinese (zh)
Other versions
TWI417651B (en
Inventor
Katsunori Makizawa
Toru Katayama
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chem filed Critical Daicel Chem
Publication of TW200707096A publication Critical patent/TW200707096A/en
Application granted granted Critical
Publication of TWI417651B publication Critical patent/TWI417651B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)

Abstract

The present invention provides a resist composition, which is not only capable of enhancing solubility during the preparation of the resist formulation and enhancing the cling property of resist film during developing, but also is able to raise the stability of the resist. The present resist composition comprises resist components and organic solvents, wherein the said organic solvent is at least one solvent selected from the group consisting of (a1) C3-C6alkandiol, (a2) monoalkoxyC3-C6alkandiol, (b1) C5-C6alkandiolmonoacetate, (b2) monoalkoxy-C3-C6alkandiolmonoacetate, (c1) C5-C6alkandioldiacetate, and (c2) monoalkoxy-C3-C6alkandioldiacetate.
TW095125969A 2005-07-19 2006-07-17 Resist composition TWI417651B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005208533A JP4647418B2 (en) 2005-07-19 2005-07-19 Resist composition

Publications (2)

Publication Number Publication Date
TW200707096A true TW200707096A (en) 2007-02-16
TWI417651B TWI417651B (en) 2013-12-01

Family

ID=37786186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125969A TWI417651B (en) 2005-07-19 2006-07-17 Resist composition

Country Status (4)

Country Link
JP (1) JP4647418B2 (en)
KR (1) KR101318086B1 (en)
CN (1) CN101109899B (en)
TW (1) TWI417651B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502279B (en) * 2011-02-25 2015-10-01 Tokyo Ohka Kogyo Co Ltd Positive resist composition and method of forming resist pattern

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101734543B1 (en) * 2010-07-20 2017-05-12 동우 화인켐 주식회사 Positive photoresist composition
CN103309152B (en) * 2012-03-13 2018-08-28 东京应化工业株式会社 Forming method, pattern forming method, solar cell and the eurymeric corrosion-resistant composition of resist pattern

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284649A (en) * 1988-06-28 1990-03-26 Mitsubishi Kasei Corp Positive photoresist composition
JP3748909B2 (en) * 1993-10-28 2006-02-22 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Photoresist composition
JPH09244231A (en) * 1996-03-08 1997-09-19 Fuji Photo Film Co Ltd Positive type photoresist composition
JP3376222B2 (en) * 1996-10-25 2003-02-10 クラリアント インターナショナル リミテッド Radiation-sensitive composition
JPH10186638A (en) * 1996-12-26 1998-07-14 Clariant Internatl Ltd Radiations sensitive composition for roll coating
JPH10186637A (en) * 1996-12-26 1998-07-14 Clariant Internatl Ltd Radiation sensitive composition for roll coating
KR100788806B1 (en) * 1999-10-29 2007-12-27 후지필름 가부시키가이샤 Positive photoresist composition
JP2001281845A (en) * 2000-03-29 2001-10-10 Daicel Chem Ind Ltd Photoresist resin composition for printed wiring boards
EP1179750B1 (en) * 2000-08-08 2012-07-25 FUJIFILM Corporation Positive photosensitive composition and method for producing a precision integrated circuit element using the same
JP2002122984A (en) * 2000-10-13 2002-04-26 Fuji Photo Film Co Ltd Method for producing photosensitive planographic printing plate
JP4044745B2 (en) * 2001-10-02 2008-02-06 富士フイルム株式会社 Photosensitive resin composition, photosensitive transfer material, liquid crystal display element member and liquid crystal display element
JP3894477B2 (en) * 2002-02-27 2007-03-22 Ａｚエレクトロニックマテリアルズ株式会社 Photosensitive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502279B (en) * 2011-02-25 2015-10-01 Tokyo Ohka Kogyo Co Ltd Positive resist composition and method of forming resist pattern

Also Published As

Publication number Publication date
KR20070011129A (en) 2007-01-24
JP2007025339A (en) 2007-02-01
JP4647418B2 (en) 2011-03-09
CN101109899B (en) 2011-08-17
CN101109899A (en) 2008-01-23
TWI417651B (en) 2013-12-01
KR101318086B1 (en) 2013-10-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees