[go: up one dir, main page]

TW200700527A - Adhesive sheet for dicing - Google Patents

Adhesive sheet for dicing

Info

Publication number
TW200700527A
TW200700527A TW095112613A TW95112613A TW200700527A TW 200700527 A TW200700527 A TW 200700527A TW 095112613 A TW095112613 A TW 095112613A TW 95112613 A TW95112613 A TW 95112613A TW 200700527 A TW200700527 A TW 200700527A
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
substrate film
cutting
larger
equal
Prior art date
Application number
TW095112613A
Other languages
Chinese (zh)
Other versions
TWI382074B (en
Inventor
Syouji Yamamoto
Kouichi Hashimoto
Toshio Shintani
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200700527A publication Critical patent/TW200700527A/en
Application granted granted Critical
Publication of TWI382074B publication Critical patent/TWI382074B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

An adhesive sheet for dicing which is able to avoid breaking in the expanding process, a processing method of a cutting-body using the adhesive sheet, and a cutting-body wafer obtained by way of the processing method are provided. The characteristics of the adhesive sheet include an adhesive sheet 11, an adhesive layer 2 that can be used during the process of which the cutting-body is performed, and disposed on a substrate film 1. The tensile elastic rate of the substrate film 1 is larger than or equal to 50~250 MPa, a break elongation of that is larger than or equal to 200%, and a cut-resisting degree shown in the following formula of that is larger than or equal to 2.5. The cut-resisting degree=(a break strength of the substrate film 1)/(a tensile strength as the tensile elongation of the substrate film 1 is 30%).
TW095112613A 2005-06-22 2006-04-10 Cutting adhesive sheet TWI382074B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181744A JP4549239B2 (en) 2005-06-22 2005-06-22 Dicing adhesive sheet

Publications (2)

Publication Number Publication Date
TW200700527A true TW200700527A (en) 2007-01-01
TWI382074B TWI382074B (en) 2013-01-11

Family

ID=37582719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112613A TWI382074B (en) 2005-06-22 2006-04-10 Cutting adhesive sheet

Country Status (4)

Country Link
JP (1) JP4549239B2 (en)
KR (1) KR101169479B1 (en)
CN (1) CN1884412B (en)
TW (1) TWI382074B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419217B (en) * 2007-09-14 2013-12-11 Disco Corp Device manufacturing method

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4979063B2 (en) * 2006-06-15 2012-07-18 日東電工株式会社 Manufacturing method of semiconductor device
KR101191121B1 (en) * 2007-12-03 2012-10-15 주식회사 엘지화학 Dicing die bonding film and dicing method
KR100922226B1 (en) * 2007-12-10 2009-10-20 주식회사 엘지화학 Adhesive film, dicing die bonding film, and semiconductor device
JP2009277778A (en) * 2008-05-13 2009-11-26 Disco Abrasive Syst Ltd Method of dividing wafer
JP2010251727A (en) * 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The Tape for semiconductor wafer processing
JP5253322B2 (en) * 2009-08-05 2013-07-31 三菱樹脂株式会社 Film for semiconductor manufacturing process adhesive tape
JP5149888B2 (en) * 2009-12-04 2013-02-20 リンテック株式会社 Stealth dicing adhesive sheet and method for manufacturing semiconductor device
JP2012079936A (en) * 2010-10-01 2012-04-19 Nitto Denko Corp Dicing, die-bonding film and method for manufacturing semiconductor device
KR101883648B1 (en) * 2011-05-17 2018-07-31 린텍 코포레이션 Film and adhesive sheet
JP6084819B2 (en) * 2012-11-14 2017-02-22 矢崎総業株式会社 Foam and foam manufacturing method
JP6084818B2 (en) * 2012-11-14 2017-02-22 矢崎総業株式会社 Foam and foam manufacturing method
KR20150099768A (en) * 2012-12-28 2015-09-01 린텍 가부시키가이샤 Dicing-sheet substrate film and dicing sheet
JP6211771B2 (en) * 2013-02-08 2017-10-11 日東電工株式会社 Adhesive tape
JP6167024B2 (en) * 2013-11-22 2017-07-19 リンテック株式会社 Dicing sheet base film and dicing sheet
JP6295132B2 (en) * 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
JP6295135B2 (en) * 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
JP6490459B2 (en) * 2015-03-13 2019-03-27 古河電気工業株式会社 Wafer fixing tape, semiconductor wafer processing method, and semiconductor chip
TWI692519B (en) 2015-06-11 2020-05-01 日商三井化學東賽璐股份有限公司 Electronic parts protection film, electronic parts protection member, electronic parts manufacturing method and packaging manufacturing method
WO2017002610A1 (en) 2015-06-29 2017-01-05 三井化学東セロ株式会社 Film for manufacturing semiconductor parts
JP6196751B1 (en) 2016-03-31 2017-09-13 三井化学東セロ株式会社 Film for parts production and method for producing parts
WO2017169747A1 (en) 2016-03-31 2017-10-05 三井化学東セロ株式会社 Film for component manufacture and component manufacturing method
KR101943705B1 (en) 2016-06-27 2019-01-29 삼성에스디아이 주식회사 Adhesive film, optical member comprising the same and optical display apparatus comprising the same
CN109906504B (en) * 2016-11-02 2023-04-14 琳得科株式会社 Adhesive sheet for stealth dicing
WO2018139612A1 (en) 2017-01-30 2018-08-02 三井化学東セロ株式会社 Component-manufacturing film, component-manufacturing tool, and component-manufacturing method
CN110582839B (en) * 2017-12-27 2023-06-06 古河电气工业株式会社 Radiation-curable adhesive tape for dicing
CN109207080A (en) * 2018-09-06 2019-01-15 陈裕旺 A kind of polyolefin facestock UV adhesive tape and preparation method thereof
CN109233659A (en) * 2018-09-06 2019-01-18 陈裕旺 A kind of PO plane materiel UV adhesive tape and preparation method thereof
JP6915675B2 (en) * 2019-01-22 2021-08-04 住友ベークライト株式会社 Adhesive tape and base material for adhesive tape
JPWO2020158770A1 (en) * 2019-01-31 2021-12-02 リンテック株式会社 Expanding method and manufacturing method of semiconductor devices
JP7328807B2 (en) * 2019-06-26 2023-08-17 日東電工株式会社 Dicing tape and dicing die bond film
JP7633008B2 (en) * 2019-11-07 2025-02-19 日東電工株式会社 Dicing tape and dicing die bond film
TW202200684A (en) * 2020-03-30 2022-01-01 日商琳得科股份有限公司 Base material film, and workpiece machining sheet
CN113618840B (en) * 2020-05-07 2023-06-02 复扬电子(苏州)有限公司 Forming method of process film

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2618491B2 (en) * 1989-08-05 1997-06-11 古河電気工業株式会社 Radiation curable adhesive tape
JPH04196342A (en) * 1990-11-28 1992-07-16 Mitsui Toatsu Chem Inc Film for semiconductor wafer dicing use
TW311927B (en) 1995-07-11 1997-08-01 Minnesota Mining & Mfg
US6184109B1 (en) * 1997-07-23 2001-02-06 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
JP4510954B2 (en) * 1998-08-10 2010-07-28 リンテック株式会社 Dicing tape and dicing method
JP4545379B2 (en) * 2003-01-06 2010-09-15 グンゼ株式会社 Dicing adhesive sheet
JP4413499B2 (en) * 2003-01-24 2010-02-10 古河電気工業株式会社 Adhesive tape for fixing semiconductor wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419217B (en) * 2007-09-14 2013-12-11 Disco Corp Device manufacturing method

Also Published As

Publication number Publication date
KR20060134790A (en) 2006-12-28
JP2007005436A (en) 2007-01-11
KR101169479B1 (en) 2012-07-27
CN1884412A (en) 2006-12-27
TWI382074B (en) 2013-01-11
JP4549239B2 (en) 2010-09-22
CN1884412B (en) 2012-01-25

Similar Documents

Publication Publication Date Title
TW200700527A (en) Adhesive sheet for dicing
TW200636846A (en) Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function
TW200702416A (en) Waterproof and airtight double-sided pressure-sensitive adhesive tape
MY165350A (en) Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
TW200726821A (en) Pressure-sensitive adhesive sheet and method of processing articles
TW200710195A (en) Pressure-sensitive adhesive sheet, production method thereof and method of processing articles
TW200702417A (en) Waterproof and airtight pressure-sensitive adhesive tape
WO2010059868A3 (en) Method and apparatus for trench and via profile modification
SG143125A1 (en) Chromium-free etching solution for si-substrates and sige-substrates, method for revealing defects using the etching solution and process for treating si-substrates and sige-substrates using the etching solution
WO2007024402A3 (en) Method and apparatus for breaking semiconductor wafers
SG136030A1 (en) Method for manufacturing compound material wafers and method for recycling a used donor substrate
TW200702427A (en) Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant
TW200707538A (en) Semiconductor device and method of manufacturing the same
ATE435755T1 (en) METHOD FOR PRODUCING A STRETCHABLE COMPOSITE
TW200715398A (en) Resist removing method and resist removing apparatus
TW200710610A (en) Stripper
MY151354A (en) Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
WO2009126443A8 (en) Method and apparatus for debonding a submounted substrate
EP2096153A3 (en) Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same
TW200705719A (en) Thin-film semiconductor-body
TW200731380A (en) Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus
TW200802992A (en) Process for preparing a semiconductor light-emitting device for mounting
SG10201805129UA (en) Dicing tape-combined adhesive sheet
WO2008146438A1 (en) Sticking device, method for preventing adhesive from dissolving, and method for sticking
TW200640283A (en) Method of manufacturing an organic electronic device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees