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TW200641534A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200641534A
TW200641534A TW095106599A TW95106599A TW200641534A TW 200641534 A TW200641534 A TW 200641534A TW 095106599 A TW095106599 A TW 095106599A TW 95106599 A TW95106599 A TW 95106599A TW 200641534 A TW200641534 A TW 200641534A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
carboxylic acid
unsaturated carboxylic
unsaturated
Prior art date
Application number
TW095106599A
Other languages
Chinese (zh)
Other versions
TWI403841B (en
Inventor
Tae-Hoon Yeo
Byung-Uk Kim
Yong-Yon Jo
Hyoc-Min Youn
Ki-Hyuk Koo
Joo Pyo Yun
Ui Cheol Jeong
Dong Myung Kim
Ho Jin Lee
Sang Gak Choi
Hong Dae Shin
Dong Hyuk Lee
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200641534A publication Critical patent/TW200641534A/en
Application granted granted Critical
Publication of TWI403841B publication Critical patent/TWI403841B/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E01C11/22—Gutters; Kerbs ; Surface drainage of streets, roads or like traffic areas
    • E01C11/221—Kerbs or like edging members, e.g. flush kerbs, shoulder retaining means ; Joint members, connecting or load-transfer means specially for kerbs
    • E01C11/222—Raised kerbs, e.g. for sidewalks ; Integrated or portable means for facilitating ascent or descent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/50—Road surface markings; Kerbs or road edgings, specially adapted for alerting road users
    • E01F9/535—Kerbs or road edgings specially adapted for alerting road users
    • E01F9/541—Kerbs

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Liquid Crystal (AREA)

Abstract

To provide a photosensitive resin composition not only excellent in performances such as sensitivity, insulating property and chemical resistance but in particular, significantly improved in transmittance and storage stability, and suitable for forming an interlayer insulating film in the process of manufacturing a LCD. The photosensitive resin composition comprises, in particular: (a) an acrylic copolymer obtained by copolymerizing (I) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture of these, (ii) one or more kinds of epoxy group-containing unsaturated compounds selected from a group consisting of formula (1) to (8), and (iii) an olefin-based unsaturated compound, and then removing monomers not involved in the reaction; (b) a 1,2-quinonediazide compound; and (c) a solvent.
TW095106599A 2005-03-03 2006-02-27 Photosensitive resin composition TWI403841B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050017892A KR101206780B1 (en) 2005-03-03 2005-03-03 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
TW200641534A true TW200641534A (en) 2006-12-01
TWI403841B TWI403841B (en) 2013-08-01

Family

ID=36946871

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106599A TWI403841B (en) 2005-03-03 2006-02-27 Photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP5016828B2 (en)
KR (1) KR101206780B1 (en)
CN (1) CN1828416B (en)
TW (1) TWI403841B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI820205B (en) * 2018-09-10 2023-11-01 日商大賽璐股份有限公司 Copolymer, curable resin composition containing the copolymer, and cured product thereof

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021282B2 (en) * 2006-11-28 2012-09-05 株式会社ダイセル Copolymer containing structural unit having 3,4-epoxytricyclo [5.2.1.02,6] decane ring and process for producing the same
JP5014873B2 (en) * 2007-05-11 2012-08-29 群栄化学工業株式会社 Polymer resin and radiation-sensitive resin composition using the same
KR101373541B1 (en) * 2007-06-01 2014-03-12 주식회사 동진쎄미켐 Photosensitive resin composition
JP4935565B2 (en) * 2007-08-01 2012-05-23 住友化学株式会社 Photosensitive resin composition
JP5075691B2 (en) * 2008-03-14 2012-11-21 株式会社ダイセル Light and / or thermosetting copolymer, curable resin composition, and cured product
KR102025099B1 (en) * 2011-12-13 2019-09-25 주식회사 동진쎄미켐 Photoresist composition
JP5774054B2 (en) * 2012-05-31 2015-09-02 エルジー・ケム・リミテッド Novel polymer and coloring composition containing the same
JP6218393B2 (en) * 2013-02-28 2017-10-25 東京応化工業株式会社 Photosensitive resin composition for interlayer insulation film
KR102235159B1 (en) * 2014-04-15 2021-04-05 롬엔드하스전자재료코리아유한회사 Photosensitive resin composition, and insulating film and electric device using same
TWI778963B (en) * 2016-05-27 2022-10-01 日商住友化學股份有限公司 Resin composition and cured film
KR102655952B1 (en) * 2018-10-31 2024-04-09 주식회사 동진쎄미켐 Positive photosensitive resin composition
KR20220152541A (en) * 2020-03-09 2022-11-16 주식회사 다이셀 Photosensitive resin composition, cured product, color filter, member for display device and display device
JP7483417B2 (en) * 2020-03-09 2024-05-15 株式会社ダイセル Photosensitive resin composition and cured product thereof
JP7483416B2 (en) * 2020-03-09 2024-05-15 株式会社ダイセル Colored photosensitive resin composition, color filter, and member for display device or display device

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
CA2012536C (en) * 1989-03-20 2001-05-08 Hirotoshi Inoue Heat-curable resinous coating composition
US5362597A (en) * 1991-05-30 1994-11-08 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive resin composition comprising an epoxy-containing alkali-soluble resin and a naphthoquinone diazide sulfonic acid ester
JP2961722B2 (en) * 1991-12-11 1999-10-12 ジェイエスアール株式会社 Radiation-sensitive resin composition
JP3055495B2 (en) * 1997-06-23 2000-06-26 日本電気株式会社 Photosensitive resin composition and pattern forming method using the same
JP2000250208A (en) * 1999-03-03 2000-09-14 Jsr Corp Radiation sensitive resin composition
JP2000327877A (en) * 1999-05-17 2000-11-28 Jsr Corp Radiation-sensitive resin composition, use thereof for interlayer insulation film and microlens, and interlayer insulation film and microlens
JP2000347397A (en) * 1999-06-04 2000-12-15 Jsr Corp Radiation sensitive resin composition and its use for interlayer dielectric
TW583510B (en) * 2000-09-14 2004-04-11 Goo Chemical Co Ltd Ultraviolet-curing resin composition and photo solder resist ink containing the same
KR100538655B1 (en) * 2001-07-19 2005-12-23 주식회사 동진쎄미켐 Photosensitive resin composition
KR100784672B1 (en) * 2001-08-20 2007-12-12 주식회사 동진쎄미켐 Photosensitive resin composition
JP3838626B2 (en) * 2001-09-07 2006-10-25 東京応化工業株式会社 Photosensitive resin composition and pattern forming method using the same
KR100809544B1 (en) * 2001-10-24 2008-03-04 주식회사 동진쎄미켐 Photosensitive resin composition containing quinonediazide sulfonic acid ester compound
JP2004272182A (en) * 2002-04-24 2004-09-30 Mitsubishi Chemicals Corp Method for forming image
JP4168443B2 (en) * 2003-07-30 2008-10-22 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI820205B (en) * 2018-09-10 2023-11-01 日商大賽璐股份有限公司 Copolymer, curable resin composition containing the copolymer, and cured product thereof

Also Published As

Publication number Publication date
KR20060098662A (en) 2006-09-19
CN1828416B (en) 2011-06-15
CN1828416A (en) 2006-09-06
KR101206780B1 (en) 2012-11-30
JP2006243726A (en) 2006-09-14
TWI403841B (en) 2013-08-01
JP5016828B2 (en) 2012-09-05

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