TW200626042A - Punching process method for flexible PCB - Google Patents
Punching process method for flexible PCBInfo
- Publication number
- TW200626042A TW200626042A TW094141162A TW94141162A TW200626042A TW 200626042 A TW200626042 A TW 200626042A TW 094141162 A TW094141162 A TW 094141162A TW 94141162 A TW94141162 A TW 94141162A TW 200626042 A TW200626042 A TW 200626042A
- Authority
- TW
- Taiwan
- Prior art keywords
- punching
- lower die
- flexible pcb
- dust
- insulation layer
- Prior art date
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
This invention relates to a flexible PCB. It discharges the punching dusts from a lower die taper part one after another without flying out the dust on the surface of the lower die. Even though using a die with a stroke so short, a punching- process through punch inserted in the die does not reach a position. It projects to the lower die taper part from its punch hole at the shape work such as removal of blind through-holes or unused portions of a flexible PCB. A flexible PCB 14 has circular lands formed on both sides of an insulation layer 17 with copper foils 16a, 16b. When punching a portion surrounded by the dashed line A, the copper foil of a part 18 inside the dashed line A is previously etched to expose the insulation layer 17. The part of the dashed line A is punched by a punching-through punch to make the inside portion 18 of the punching dust easy to bend, as this portion is of only the insulation layer 17. Moreover, it relaxes the repulsion force of the punching dust and the lower die. Eventually, it prevents the dust from flying out of the lower die.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005001738A JP4369874B2 (en) | 2005-01-06 | 2005-01-06 | Punching method for flexible printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200626042A true TW200626042A (en) | 2006-07-16 |
TWI301735B TWI301735B (en) | 2008-10-01 |
Family
ID=36797761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094141162A TW200626042A (en) | 2005-01-06 | 2005-11-23 | Punching process method for flexible PCB |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4369874B2 (en) |
CN (1) | CN100548087C (en) |
TW (1) | TW200626042A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100546441C (en) * | 2006-07-19 | 2009-09-30 | 比亚迪股份有限公司 | A kind of manufacture method of multi-layer flexible circuit board |
CN101188909B (en) * | 2006-11-16 | 2010-06-16 | 比亚迪股份有限公司 | A flexible circuit board and its copper plating method |
CN102170748B (en) * | 2010-02-26 | 2013-03-27 | 佳必琪国际股份有限公司 | Adhesive flexible circuit board, its manufacturing method and strip light with the circuit board |
JP5753976B2 (en) * | 2011-06-09 | 2015-07-22 | パナソニックIpマネジメント株式会社 | Punch material punching method, punching device and printed circuit board |
CN105072807A (en) * | 2015-07-07 | 2015-11-18 | 安徽中大印制电路有限公司 | Circuit board production process |
CN104972511A (en) * | 2015-07-08 | 2015-10-14 | 沪士电子股份有限公司 | Drilling method improving PCB plate counter-drilling precision |
-
2005
- 2005-01-06 JP JP2005001738A patent/JP4369874B2/en not_active Expired - Fee Related
- 2005-11-23 TW TW094141162A patent/TW200626042A/en not_active IP Right Cessation
- 2005-12-28 CN CNB2005100974118A patent/CN100548087C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI301735B (en) | 2008-10-01 |
JP2006190835A (en) | 2006-07-20 |
CN100548087C (en) | 2009-10-07 |
CN1802070A (en) | 2006-07-12 |
JP4369874B2 (en) | 2009-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |