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TW200626042A - Punching process method for flexible PCB - Google Patents

Punching process method for flexible PCB

Info

Publication number
TW200626042A
TW200626042A TW094141162A TW94141162A TW200626042A TW 200626042 A TW200626042 A TW 200626042A TW 094141162 A TW094141162 A TW 094141162A TW 94141162 A TW94141162 A TW 94141162A TW 200626042 A TW200626042 A TW 200626042A
Authority
TW
Taiwan
Prior art keywords
punching
lower die
flexible pcb
dust
insulation layer
Prior art date
Application number
TW094141162A
Other languages
Chinese (zh)
Other versions
TWI301735B (en
Inventor
Hirohiko Okamoto
Keisuke Yamaguchi
Yuichi Shinohara
Kenji Suzuki
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200626042A publication Critical patent/TW200626042A/en
Application granted granted Critical
Publication of TWI301735B publication Critical patent/TWI301735B/zh

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

This invention relates to a flexible PCB. It discharges the punching dusts from a lower die taper part one after another without flying out the dust on the surface of the lower die. Even though using a die with a stroke so short, a punching- process through punch inserted in the die does not reach a position. It projects to the lower die taper part from its punch hole at the shape work such as removal of blind through-holes or unused portions of a flexible PCB. A flexible PCB 14 has circular lands formed on both sides of an insulation layer 17 with copper foils 16a, 16b. When punching a portion surrounded by the dashed line A, the copper foil of a part 18 inside the dashed line A is previously etched to expose the insulation layer 17. The part of the dashed line A is punched by a punching-through punch to make the inside portion 18 of the punching dust easy to bend, as this portion is of only the insulation layer 17. Moreover, it relaxes the repulsion force of the punching dust and the lower die. Eventually, it prevents the dust from flying out of the lower die.
TW094141162A 2005-01-06 2005-11-23 Punching process method for flexible PCB TW200626042A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005001738A JP4369874B2 (en) 2005-01-06 2005-01-06 Punching method for flexible printed circuit board

Publications (2)

Publication Number Publication Date
TW200626042A true TW200626042A (en) 2006-07-16
TWI301735B TWI301735B (en) 2008-10-01

Family

ID=36797761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141162A TW200626042A (en) 2005-01-06 2005-11-23 Punching process method for flexible PCB

Country Status (3)

Country Link
JP (1) JP4369874B2 (en)
CN (1) CN100548087C (en)
TW (1) TW200626042A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100546441C (en) * 2006-07-19 2009-09-30 比亚迪股份有限公司 A kind of manufacture method of multi-layer flexible circuit board
CN101188909B (en) * 2006-11-16 2010-06-16 比亚迪股份有限公司 A flexible circuit board and its copper plating method
CN102170748B (en) * 2010-02-26 2013-03-27 佳必琪国际股份有限公司 Adhesive flexible circuit board, its manufacturing method and strip light with the circuit board
JP5753976B2 (en) * 2011-06-09 2015-07-22 パナソニックIpマネジメント株式会社 Punch material punching method, punching device and printed circuit board
CN105072807A (en) * 2015-07-07 2015-11-18 安徽中大印制电路有限公司 Circuit board production process
CN104972511A (en) * 2015-07-08 2015-10-14 沪士电子股份有限公司 Drilling method improving PCB plate counter-drilling precision

Also Published As

Publication number Publication date
TWI301735B (en) 2008-10-01
JP2006190835A (en) 2006-07-20
CN100548087C (en) 2009-10-07
CN1802070A (en) 2006-07-12
JP4369874B2 (en) 2009-11-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees