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TW200614441A - Method for fabricating thermally enhanced semiconductor package substrate - Google Patents

Method for fabricating thermally enhanced semiconductor package substrate

Info

Publication number
TW200614441A
TW200614441A TW093132681A TW93132681A TW200614441A TW 200614441 A TW200614441 A TW 200614441A TW 093132681 A TW093132681 A TW 093132681A TW 93132681 A TW93132681 A TW 93132681A TW 200614441 A TW200614441 A TW 200614441A
Authority
TW
Taiwan
Prior art keywords
active area
unit
laminated substrate
board
semiconductor package
Prior art date
Application number
TW093132681A
Other languages
Chinese (zh)
Other versions
TWI240387B (en
Inventor
Pao-Hung Chou
Hsin-Ku Huang
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW93132681A priority Critical patent/TWI240387B/en
Application granted granted Critical
Publication of TWI240387B publication Critical patent/TWI240387B/en
Publication of TW200614441A publication Critical patent/TW200614441A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method for fabricating a thermally enhanced semiconductor package substrate is proposed. First, at least two unit boards are provided, with at least one circuit layer having a non-active area being formed on each of the unit boards. The at least two unit boards are compressed to form a laminated substrate, and a plurality of plated though holes are formed in the laminated substrate to interconnect the circuit layers of the unit boards. A circuit layer with a non-active area is formed respectively on both sides of the laminated substrate. An upper opening is formed by non-contact cutting in the non-active area of the upper unit board to expose a portion of the circuit layer of the lower unit board. A solder mask is applied over the upper unit board. An adhesive material is coated on a bottom surface of the laminated board. A lower opening is formed by non-contact cutting in the non-active area of the lower unit board. A heat sink is attached to the adhesive material. The upper and bottom openings of the laminated substrate are fabricated by the non-contact cutting technique such as laser, such that the cost on a cutting tool is reduced and the production speed can be improved.
TW93132681A 2004-10-28 2004-10-28 Method for fabricating thermally enhanced semiconductor package substrate TWI240387B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93132681A TWI240387B (en) 2004-10-28 2004-10-28 Method for fabricating thermally enhanced semiconductor package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93132681A TWI240387B (en) 2004-10-28 2004-10-28 Method for fabricating thermally enhanced semiconductor package substrate

Publications (2)

Publication Number Publication Date
TWI240387B TWI240387B (en) 2005-09-21
TW200614441A true TW200614441A (en) 2006-05-01

Family

ID=37007746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93132681A TWI240387B (en) 2004-10-28 2004-10-28 Method for fabricating thermally enhanced semiconductor package substrate

Country Status (1)

Country Link
TW (1) TWI240387B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780876B (en) * 2021-08-25 2022-10-11 旭德科技股份有限公司 Package carrier and package structure
TWI858353B (en) * 2021-10-27 2024-10-11 大陸商珠海越亞半導體股份有限公司 Signal-heat separation TMV packaging structure and its manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400782B (en) * 2008-11-14 2013-07-01 Packaging substrate with heat-dissipation capability and the manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780876B (en) * 2021-08-25 2022-10-11 旭德科技股份有限公司 Package carrier and package structure
TWI858353B (en) * 2021-10-27 2024-10-11 大陸商珠海越亞半導體股份有限公司 Signal-heat separation TMV packaging structure and its manufacturing method

Also Published As

Publication number Publication date
TWI240387B (en) 2005-09-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees