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TW200605191A - Exposure apparatus, exposure method, device manufacturing method, and surface shape detecting device - Google Patents

Exposure apparatus, exposure method, device manufacturing method, and surface shape detecting device

Info

Publication number
TW200605191A
TW200605191A TW094109960A TW94109960A TW200605191A TW 200605191 A TW200605191 A TW 200605191A TW 094109960 A TW094109960 A TW 094109960A TW 94109960 A TW94109960 A TW 94109960A TW 200605191 A TW200605191 A TW 200605191A
Authority
TW
Taiwan
Prior art keywords
position command
exposure
surface shape
shape detecting
multipoint
Prior art date
Application number
TW094109960A
Other languages
English (en)
Inventor
Yasuhiro Hidaka
Nobutaka Magome
Hideo Mizutani
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200605191A publication Critical patent/TW200605191A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/14—Relay systems
    • H04B7/15—Active relay systems
    • H04B7/155—Ground-based stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094109960A 2004-03-30 2005-03-30 Exposure apparatus, exposure method, device manufacturing method, and surface shape detecting device TW200605191A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004099530 2004-03-30

Publications (1)

Publication Number Publication Date
TW200605191A true TW200605191A (en) 2006-02-01

Family

ID=35064061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109960A TW200605191A (en) 2004-03-30 2005-03-30 Exposure apparatus, exposure method, device manufacturing method, and surface shape detecting device

Country Status (4)

Country Link
US (1) US20070247640A1 (zh)
JP (2) JPWO2005096354A1 (zh)
TW (1) TW200605191A (zh)
WO (1) WO2005096354A1 (zh)

Cited By (1)

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CN110530291A (zh) * 2019-08-26 2019-12-03 珠海博明视觉科技有限公司 一种光栅投影法高度重建的自动对焦算法

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TWI749514B (zh) 2015-02-23 2021-12-11 日商尼康股份有限公司 測量裝置、微影系統、以及元件製造方法
CN107278279B (zh) 2015-02-23 2020-07-03 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
CN105988305B (zh) * 2015-02-28 2018-03-02 上海微电子装备（集团）股份有限公司 硅片预对准方法
CN106997151B (zh) * 2016-01-22 2019-05-31 上海微电子装备（集团）股份有限公司 光斑布局结构、面形测量方法及曝光视场控制值计算方法
JP6742783B2 (ja) * 2016-04-01 2020-08-19 株式会社ミツトヨ 撮像システム及び撮像方法
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KR20210143725A (ko) * 2019-12-26 2021-11-29 난징 리안 세미컨덕터 리미티드 반도체 산업에서 웨이퍼 기하학적 구조 측정을 위한 툴 아키텍처
CN112729158B (zh) * 2019-12-26 2022-12-27 南京力安半导体有限公司 晶圆几何参数的测量方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110530291A (zh) * 2019-08-26 2019-12-03 珠海博明视觉科技有限公司 一种光栅投影法高度重建的自动对焦算法

Also Published As

Publication number Publication date
JPWO2005096354A1 (ja) 2008-02-21
WO2005096354A1 (ja) 2005-10-13
US20070247640A1 (en) 2007-10-25
JP2011101056A (ja) 2011-05-19
JP5464155B2 (ja) 2014-04-09

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