TW200537771A - Structure and engineering method of joint connection of solder ball for electric connector - Google Patents
Structure and engineering method of joint connection of solder ball for electric connector Download PDFInfo
- Publication number
- TW200537771A TW200537771A TW93113792A TW93113792A TW200537771A TW 200537771 A TW200537771 A TW 200537771A TW 93113792 A TW93113792 A TW 93113792A TW 93113792 A TW93113792 A TW 93113792A TW 200537771 A TW200537771 A TW 200537771A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder ball
- terminal
- connecting piece
- patent application
- scope
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 131
- 238000012407 engineering method Methods 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 10
- 230000005484 gravity Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000015243 ice cream Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
200537771 五、發明說明(1) 發明之技術領域 ,特別係指一種電連接 本發明係有關於一種電連4妾g 器之搭接錫球構造及其工法。 σ 先前技術 請參閲圖1,係為一種習知之電連接器之搭 造,其包括有一座體10及複數 錫表構 赵夕砝;播彳! #批 數之鈿子15,該座體U設有複 數之鈿子槽11,該複數之端子15設於該複數之 該端子之一端設有一接觸部16,端子之另一槽^平 片…該連接片17中間凹陷而呈杯體,其 賜琢1 y。 上述構造有以下缺失·· 1·其係於連接片17上塗上錫膏,再將锡球19置於其上,經 t =錫球19即與連接片17結合,其僅藉由錫膏溶接於該 連接片1 7,並未達到很牢固之結合效果。 2·該錫球19係下端溶接於呈水平之連接川上,由於溶接 點在下方’故為使在加熱時易於受熱,座體1〇在錫球丨9之 周圍不能設有周壁來定位錫球(若設有周壁則會阻熱,不 利於加熱溶接)’僅能藉由該連接片丨7中間略為凹陷呈杯 體而2錫球置於其上,然此種定位錫球之方式不夠穩定, 尤其當連接器之锡球接點愈密集,使得錫球及連接片之杯 體愈小時’則更顯現錫球置於連接片丨7上之定位效果不 良。 3 ·每一錫球之周圍均未設有阻隔,當錫球間隙甚小時相鄰200537771 V. Description of the invention (1) The technical field of the invention, in particular, refers to an electrical connection. The present invention relates to an overlapped solder ball structure of an electrical 4 妾 g device and its construction method. σ Prior technology Please refer to FIG. 1, which is a build of a conventional electrical connector, which includes a body 10 and a plurality of tin surface structures Zhao Xiqian; sowing! # 批 数 之 钿 子 15, the base U is provided with a plurality of 槽子 槽 11, the plurality of terminals 15 are provided at one end of the plurality of terminals provided with a contact portion 16, the other groove of the terminal ^ flat plate ... The connecting piece 17 is recessed in the middle to form a cup body, which is provided with 1 y. The above structure has the following defects ... 1. It is coated with solder paste on the connecting piece 17, and then the solder ball 19 is placed on it. After t = solder ball 19, it is combined with the connecting piece 17, which is only dissolved by the solder paste. For this connecting piece 17, a very strong bonding effect has not been achieved. 2. The lower end of the solder ball 19 is welded to the horizontal connection channel. Because the weld point is below, so that it is easy to be heated during heating, the base body 10 cannot be provided with a peripheral wall around the solder ball 9 to locate the solder ball. (If there is a peripheral wall, it will block heat, which is not conducive to heating and melting.) 'Only the connecting piece 丨 7 is slightly concave in the middle and a cup is placed on it, and 2 solder balls are placed on it. Especially when the solder ball contacts of the connector are denser, the smaller the cup of the solder ball and the connecting piece is, the more the poor positioning effect of the solder ball placed on the connecting piece 7 appears. 3 · There is no barrier around each solder ball. When the solder ball gap is very small, it is adjacent to each other.
200537771 五、發明說明(2) 之錫球可能會接觸而造成短路 發明内容 本毛月之主要目的在於提供一種電連柱哭 構造,其係可令端 2器之搭接錫球 f月之另一主要目的在於提供一種電 錫球工法,其係可令端子之連接接|§之搭接 結合。 踢球内而成穩固的 本發明之次要目的在於提供一口 構造,其I f X t u連接器之搭接錫球 傅w兵在置入錫球時,錫球之周圍可受至,丨庙胂阁a 能穩固的定位。 门固』又到座體之包圍而 槿、之:要目的在於提供一種電連接器之搭接錫球 =之法,其係成侧向搭接錫球,在加熱時易於受熱, 不致因錫球之周圍受到座體之包圍而難以受熱。 為達上述目的,本發明電連接器之搭接錫球工法,其 ^括以下步驟:提供一座體,該座體間隔排列設有複數之 端子槽;提供複數之端子,其設於該複數之端子槽,該端 子之一端設有一接觸部,端子之另一端設有一連接片,該 連接片設有一凸出之凸部;提供複數之錫球,將每一錫球 與一端子之連接片之凸部接觸;及提供加熱令每一錫球軟 化’使該端子之連接片之凸部嵌入錫球内。 本發明之上述及其他目的、優點和特色由以下較佳實 施例之詳細說明中並參考圖式當可更加明白。200537771 V. Description of the invention (2) The solder balls may come into contact and cause a short circuit. SUMMARY The main purpose of this hair month is to provide an electrical post structure, which can make the solder balls of the two terminals overlap. One of the main purposes is to provide an electric solder ball method, which can make the connection of the terminals | The secondary purpose of the present invention, which is stable in kicking the ball, is to provide a mouthful structure. The overlap of the I f X tu connector of the solder ball. When the soldier puts the solder ball, the solder ball can be received around the temple.胂 阁 a can be firmly positioned. "Door door" goes to the base and surrounds it: the purpose is to provide a method of overlapping solder balls of an electrical connector, which is a side overlapping solder ball, which is easy to be heated during heating and not caused by tin. The perimeter of the ball is surrounded by the base and is hardly heated. In order to achieve the above object, the method for laminating solder balls of the electrical connector of the present invention includes the following steps: providing a base body with a plurality of terminal slots arranged at intervals; and providing a plurality of terminals provided on the plurality of terminals. Terminal slot, one end of the terminal is provided with a contact portion, and the other end of the terminal is provided with a connecting piece, the connecting piece is provided with a protruding convex portion; a plurality of solder balls are provided, and each solder ball is connected to a terminal connecting piece. The bumps are in contact; and heating is provided to soften each solder ball so that the bumps of the connecting pieces of the terminal are embedded in the solder balls. The above and other objects, advantages, and features of the present invention will be more clearly understood from the following detailed description of the preferred embodiments with reference to the accompanying drawings.
第6頁 200537771 五、發明說明(3) 實施方式 請參閱圖2及圖3,本發明之電連接器設有一座體2〇、 複數之端子30及複數之錫球40,其中: 該座體20間隔排列設有複數之端子槽21,該端子槽21 設有一底面22 ’該底面22之另一端形成一錫球槽23。 請配合參閱圖5,該複數之端子3〇設於該複數之端子 槽21,該端子設有一固定部31與端子槽21固定,該固定部 31下方往端子槽上方延伸設有一可上下彈動之接觸部32,Page 6 200537771 V. Description of the invention (3) Please refer to FIG. 2 and FIG. 3 for implementation. The electrical connector of the present invention is provided with a body 20, a plurality of terminals 30, and a plurality of solder balls 40, of which: the base body A plurality of terminal grooves 21 are arranged at 20 intervals. The terminal groove 21 is provided with a bottom surface 22 ′, and the other end of the bottom surface 22 forms a solder ball groove 23. Please refer to FIG. 5. The plurality of terminals 30 are provided in the plurality of terminal slots 21. The terminal is provided with a fixing portion 31 fixed to the terminal slot 21, and the fixing portion 31 is provided above the terminal slot to be elastically movable up and down. Of contact 32,
該固定部31下方往端子槽下方端延伸設有一連接片33,該 連接片33伸至該錫球槽23且具有侧向彈動之彈性,該連接 片33接近末端自板面沖壓二侧向凸出之凸部34,該凸部34 成一倒刺狀,其設有一導斜面35及一卡面36。 該錫球40係置入該錫球槽23,該錫球40抵壓該連接片 33之凸部34令連接片呈彈性外張,請參閱圖4,當加熱使 锡球軟化後’該端子之連接片33因回復力而使凸部34嵌入 锡球4 0内。 请參閱圖2及圖3,上述構造之工法包括以下步驟: 二*提供一座體20 ’其上間隔排列設有複數之端子槽21, 该端子槽21設有一底面22,該底面22之另一端形成一錫球 槽23。 >提供複數之端子3〇,其設於該複數之端子槽21,該端 子a有一固定部31與端子槽21固定,該固定部31下方往端 子槽上方端延伸設有一可上下彈動之接觸部32,該固定部 下方往端子槽下方端延伸設有一連接片33,該連接片33A connecting piece 33 extends below the fixing portion 31 toward the lower end of the terminal groove. The connecting piece 33 extends to the solder ball groove 23 and has the elasticity of lateral elasticity. The connecting piece 33 is punched from the surface of the plate to two sides near the end. The protruding convex portion 34 is formed into a barbed shape, and is provided with a guide inclined surface 35 and a latching surface 36. The solder ball 40 is inserted into the solder ball groove 23, and the solder ball 40 presses against the convex portion 34 of the connecting piece 33 to make the connecting piece elastically expand. Please refer to FIG. 4, when the solder ball is softened by heating, the terminal The connecting piece 33 causes the convex portion 34 to be embedded in the solder ball 40 due to the restoring force. Please refer to FIG. 2 and FIG. 3, the construction method of the above structure includes the following steps: Two * Provide a body 20 'on which a plurality of terminal slots 21 are arranged at intervals. The terminal slot 21 is provided with a bottom surface 22 and the other end of the bottom surface 22 Forming a solder ball groove 23. > A plurality of terminals 30 are provided, which are provided in the plurality of terminal slots 21. The terminal a has a fixing portion 31 fixed to the terminal slot 21. A fixed portion 31 is provided below the terminal slot to an upper end of the terminal slot. The contact portion 32 is provided with a connecting piece 33 extending below the fixing portion toward the lower end of the terminal slot. The connecting piece 33
200537771 五 '發明說明(4) 呈縱向伸至该錫球槽2 3且具有側向彈動之彈性,該連接片 33接近末端自板面沖壓二侧向凸出之凸部34,該凸部34成 一倒刺狀’其設有一導斜面3 5及一卡面3 6。 提供複數之錫球40,將每一錫球4〇沿著該連接片33之 凸部34之導斜面35置入一錫球槽23,該錫球40 —側抵壓該 連接片33之凸部34令連接片呈彈性外張。 請參閱圖4,提供加熱令每一錫球4〇軟化,該端子之 連接片33因回復力而使凸部34嵌入錫球40内,如此即可令 錫球穩固的結合於端子之連接片3 3之縱向板面。 另外,請參閱圖6,本實施例提供加熱時可令座體2〇 與水平面呈約75度擺放,如此每一錫球4〇部份熱熔時可流 至端子之連接片33上,更加強化兩者之熔合效果且較不會 影響錫球40之高度(若錫球4〇呈上下方向熔化時,有如冰 淇淋溶化般下陷),再者,座體2〇與水平面仍小於9〇度, 錫球40不致因振動或是在熔化時掉出錫球槽“外。X 由以上之說明,本發明可歸納出以下優點: 1 人端子30之連接片33之凸部34嵌入錫球40内,兩者穩固結 2·該凸部34成側向嵌入錫球4〇内,可使錫球4〇無法 離,而錫球40之側向則受到錫球槽23之框限,故 與連接片33之連結非常牢固,且兩錫球4()間有 ^ 開,避免相接觸造成短路。 I槽隔 3 ·連接片3 3具有側向彈力,可因彈性之回復力 凸部34嵌入表面軟化之錫球。 而加助於其200537771 Five 'invention description (4) The elasticity extends to the solder ball groove 23 longitudinally and has the elasticity of lateral elasticity. The connecting piece 33 is close to the convex portion 34 which is punched from the plate surface and protrudes laterally. 34 into a barbed shape, which is provided with a guide inclined surface 35 and a clamping surface 36. Provide a plurality of solder balls 40, and place each solder ball 40 in a solder ball groove 23 along the guide inclined surface 35 of the convex portion 34 of the connecting piece 33, and the solder ball 40 is pressed against the convexity of the connecting piece 33 on one side. The portion 34 elastically flares the connecting piece. Please refer to FIG. 4, heating is provided to soften each solder ball 40. The connection piece 33 of the terminal causes the convex portion 34 to be embedded in the solder ball 40 due to the restoring force, so that the solder ball can be firmly combined with the connection piece of the terminal. 3 3 of the longitudinal plate surface. In addition, please refer to FIG. 6, this embodiment provides that the base body 20 can be placed at about 75 degrees from the horizontal surface when heated, so that each part of the solder ball 40 can flow to the connecting piece 33 of the terminal when hot-melted. It further strengthens the fusion effect of the two and will not affect the height of the solder ball 40 (if the solder ball 40 melts up and down, it will sink like ice cream). Furthermore, the base 20 and the horizontal plane are still less than 90 degrees. The solder ball 40 does not fall out of the solder ball groove due to vibration or melting. X From the above description, the present invention can summarize the following advantages: The convex portion 34 of the connecting piece 33 of the one-person terminal 30 is embedded in the solder ball 40 Inside, the two are firmly consolidated 2. The convex portion 34 is embedded into the solder ball 40 laterally, so that the solder ball 40 cannot be separated, and the lateral direction of the solder ball 40 is limited by the frame of the solder ball groove 23, so The connection of the connecting piece 33 is very strong, and there is a ^ gap between the two solder balls 4 () to avoid short circuits caused by contact. I slot 3 · The connecting piece 3 3 has lateral elasticity, and the convex portion 34 can be inserted due to the elastic restoring force Surface softened solder balls.
200537771 五、發明說明(5) 請參閱圖7,係本發明之第二實施例,其工法包括以 下步驟: ^供一座體20 ’其上間隔排列設有複數之端子槽21,該端 子槽21設有一底面22,該底面22之另一端形成一錫球槽 23 〇 提供複數之端子30,其設於該複數之端子槽21,該端 子設有一固定部31與端子槽21固定,該固定部31下方往端 子槽上方端延伸設有一可上下彈動之接觸部32,該固定部 31下方往端子槽下方端延伸設有一連接片33,該連接片33 呈縱向伸至該錫球槽2 3且具有侧向彈動之彈性,該連接片 3 3接近末端自板面中間沖壓出一側向凸出之凸部3 4,該凸 部34成一舌片狀,其僅一端與連接片33相連。 提供複數之錫球40,將每一錫球40呈鬆弛狀態置入一 锡球槽2 3。 請參閱圖8,將座體呈45度傾斜,使該錫球4〇藉由本 身之重力抵壓在該連接片33之凸部34上,且不致掉出錫球 槽23。 請參閱圖9,提供加熱令每一錫球4 〇軟化,此時錫球 因本身之重力壓在該端子之連接片33上,故該凸部34即嵌 入錫球40内,且熔錫會侵入連接片33與凸部間之間隙37。 本實施例由於錫球4 0係呈鬆弛放入錫球槽2 3 ,故較易 於放置錫球4 0,當錫球4 0與連接片33結合時,其上下方向 可為該凸部34卡定,而因熔錫侵入間隙37,故其左右方向 亦受到卡定,故可使錫球與連接片33之連結非常牢固。200537771 V. Description of the invention (5) Please refer to FIG. 7, which is the second embodiment of the present invention. The method includes the following steps: ^ Provide a body 20 ′ with a plurality of terminal grooves 21 arranged at intervals thereon. A bottom surface 22 is provided, and a solder ball groove 23 is formed at the other end of the bottom surface 22. A plurality of terminals 30 are provided in the plurality of terminal grooves 21, and the terminal is provided with a fixing portion 31 fixed to the terminal groove 21, and the fixing portion A contact portion 32 is provided underneath 31 to the upper end of the terminal slot. The contact portion 32 can be moved up and down below the fixed portion 31. A connecting piece 33 is extended to the lower end of the terminal slot. The connecting piece 33 extends longitudinally to the solder ball groove 2 3 And has the elasticity of lateral elasticity, the connecting piece 3 3 is near the end punched out from the middle of the plate surface, and a convex portion 34 protruding to one side is formed. The convex portion 34 is in a tongue shape, and only one end thereof is connected to the connecting piece 33. . A plurality of solder balls 40 are provided, and each solder ball 40 is placed in a solder ball groove 23 in a relaxed state. Referring to FIG. 8, the seat body is inclined at 45 degrees, so that the solder ball 40 is pressed against the convex portion 34 of the connecting piece 33 by the gravity of the solder ball 40, and the solder ball groove 23 is not dropped. Referring to FIG. 9, heating is provided to soften each solder ball 40. At this time, the solder ball is pressed on the connection piece 33 of the terminal due to its own gravity, so the convex portion 34 is embedded in the solder ball 40, and the molten solder will The gap 37 between the connecting piece 33 and the convex portion is penetrated. In this embodiment, since the solder ball 40 is loosely inserted into the solder ball groove 23, it is easier to place the solder ball 40. When the solder ball 40 is combined with the connecting piece 33, the up and down direction of the solder ball 40 can be the convex portion 34 card. As the molten tin penetrates into the gap 37, its left-right direction is also locked, so the connection between the solder ball and the connecting piece 33 can be very firm.
第9頁 200537771Page 9 200537771
請參閱圖10及圖11,係本發明之笛一〜 包括以下步驟: 弟二貫施例,其工法 提 其下表 提 子設有 一橫向 下彈動 設有一 有侧向 出之凸 形成一 供一座體20 面之周緣設 供複數之端 一固定部31 部38,該橫 之接觸部3 2 連接片33, 彈動之彈性 部3 4 ^該凸 間隙37。 ’其上間隔排列 有凸緣2 4而形成 子3 〇 ’其設於該 與端子槽21固定 向板3 8連接一往 ’該固定部31下 該連接片33呈縱 ’該連接片33自 部34設有一導斜 〜叹双又端子槽21, 一放置區25。 複數之端子槽21,該端 二該固定部31下方連接 端子槽上方延伸且可上 方往端子槽下方端延伸 向伸'至該放置區25且具 末端彎折形成二側向^ 面35且與連接片33之間 提供一治具45,該治具45套合置於該座體2〇下表面之 放置區25,其設有複數之格子46,該複數之格子饳對應該 複數之端子槽21。 提供複數之錫球40 ’將每一錫球4〇沿著該連接片33之 凸部34之導斜面35置入一格子46,該錫球40下端抵於端子 之橫向板38且一側抵壓該連接片33之凸部34令連接片33呈 彈性外張。 請參閱圖12,提供加熱令每一錫球4 〇軟化,該端子之 連接片33因回復力而使凸部34後入錫球40内,同時溶錫亦 侵入該間隙3 7,如此即可令錫球4 〇穩固的結合於端子之連 接片3 3之縱向板面。 請參閱圖1 3,最後拿開治具4 5,此時錫球4 0穩固的結Please refer to FIG. 10 and FIG. 11, which are the first and second steps of the present invention, including the following steps: The second embodiment of the method, the method of which is described below, the table below is provided with a lateral downward spring, a convex with a side out to form a supply The peripheral edge of the surface of the base 20 is provided with a plurality of fixed portions 31, 38, the horizontal contact portion 3 2 connecting piece 33, and the elastic portion 3 4 ^ the convex gap 37. 'Flanges 2 4 are arranged at intervals thereon to form a child 3 〇' It is provided in the connection with the terminal groove 21 fixed to the plate 3 8 'The connecting piece 33 is vertical under the fixing portion 31' The connecting piece 33 is The part 34 is provided with a slanting channel, a terminal slot 21, and a placement area 25. The plurality of terminal grooves 21, the end two, the fixed portion 31, the upper part of the terminal groove, and the upper part of the terminal groove can be extended upward to the lower end of the terminal groove to the placement area 25, and the end is bent to form two lateral surfaces 35 and A jig 45 is provided between the connecting pieces 33, and the jig 45 fits in the placement area 25 on the lower surface of the base body 20, and is provided with a plurality of lattices 46, and the plurality of lattices correspond to the plurality of terminal slots. twenty one. Provide a plurality of solder balls 40 ′. Each solder ball 40 is placed in a grid 46 along the guide slope 35 of the convex portion 34 of the connecting piece 33. The lower end of the solder ball 40 abuts the lateral plate 38 of the terminal and one side abuts. Pressing the convex portion 34 of the connecting piece 33 causes the connecting piece 33 to elastically expand. Referring to FIG. 12, heating is provided to soften each solder ball 40. The connection piece 33 of the terminal causes the convex portion 34 to enter the solder ball 40 due to the restoring force, and the molten tin also invades the gap 37, so The solder ball 40 is firmly bonded to the longitudinal plate surface of the connecting piece 33 of the terminal. Please refer to Figure 1 3, and finally remove the fixture 4 5 at this time, the solder ball 4 0 is stable.
第10頁 200537771 五、發明說明(7) 合於端子之連接片33。 請參閱圖1 4,係本發明之第四實施例,其大致與第一 實施例相同,其中差異在於該座體2 〇之端子槽2 1—側壁設 有一卡槽26,該端子3 0係為片體上下縱向延伸,其中間為 固定部31卡合於該卡槽26,其向端子槽上方延伸一接觸部 32,其向端子槽下方延伸一連接片33。 "Page 10 200537771 V. Description of the invention (7) The connecting piece 33 connected to the terminal. Please refer to FIG. 14, which is a fourth embodiment of the present invention, which is substantially the same as the first embodiment, and the difference lies in the terminal slot 2 1 of the seat body 20-a side wall is provided with a card slot 26, and the terminal 30 is The sheet body extends longitudinally up and down, and a fixing portion 31 is engaged with the card slot 26 in the middle, and a contact portion 32 extends above the terminal slot, and a connection piece 33 extends below the terminal slot. "
請參閱圖1 5,係本發明之第五實施例,其大致與第一 實施例相同,其中差異在於該端子30之連接片3 3己抵靠於 錫球槽2 3之一壁面’其不具彈性,該錫球置入時係強迫擠 入迫緊端子30之連接片33之凸點34,請參閱圖16,當提供 加熱時,該錫球4 0軟化,該端子之連接片3 3之凸部3 4即歲 入錫球40内。 本發明之端子之連接片3 3設有凸部3 4嵌入錫球4 0内, 應已具備良好之結合效果,然若要使錫球4〇之結合更為牢 固,可於連接3 3之末端塗上錫膏,經加熱後錫膏熔化結合 於連接片3 3和錫球40,可使兩者之結合更為強化。Please refer to FIG. 15, which is a fifth embodiment of the present invention, which is substantially the same as the first embodiment. The difference is that the connecting piece 33 of the terminal 30 has abutted against a wall surface of the solder ball groove 23. Elasticity, the solder ball is forced into the bump 34 of the connecting piece 33 of the pressing terminal 30 when it is placed. Please refer to FIG. 16. When heating is provided, the solder ball 40 is softened, and the connecting piece 33 of the terminal is softened. The protrusions 34 enter the solder balls 40 at the age. The connecting piece 33 of the terminal of the present invention is provided with a convex portion 3 4 embedded in the solder ball 40, which should already have a good bonding effect. However, if the bonding of the solder ball 40 is to be stronger, it can be used to connect the 3 3 The end is coated with solder paste. After heating, the solder paste is melted and bonded to the connecting piece 33 and the solder ball 40, so that the combination of the two can be strengthened.
在較佳實施例之詳細說明中所提出之具體的實施例僅 為了易於說明本發明之技術内容,而並非將本發明狹義地 限制於該實施例’在不超出本發明之精神及以下申請專利 範圍之情況,可作種種變化實施。The specific embodiments proposed in the detailed description of the preferred embodiments are only for easy explanation of the technical content of the present invention, and do not limit the present invention to the embodiment in a narrow sense. 'Without exceeding the spirit of the present invention and the following patent application The scope of the situation can be implemented in various changes.
第11頁 200537771 圖式簡單說明 圖1係習知電遠技吳^ 圖2係本發明第一 j接錫球立體圖。 圖3係本發明第二施例加熱前之立體圖。 圖4係本發明第一熱前之側視剖面圖 圖5係本發明第剖面Ξ。 圖7係本發明:二施例斜放加熱後之側視剖 圖8係本發明第m施例加熱前之侧視剖面圖面圖 β第—較佳實施例加熱前呈斜放之:圖。 圖。 、 之侧視剖面 a 圖9係本發明第二較佳實加側 圖η係太:Λ較佳實施例加熱前之立體圖。 ’、 第二較佳實施例加熱前之側彳& q s _ 圖1 2係本發明筮-h u 〜训祝刮面圖。 圖13係太路日二較實施例加熱後之側視剖面圖。 U ί Ϊ第三較佳實施例加熱後之側視刮面圖。 圖14係本發明第四較佳實施❹熱後之側視剖面圖。 圖1 5係本發明第五較佳實施例加熱前之側視剖面圖。 圖1 6係本發明第五較佳實施例加熱後之側視剖面圖。 標號說明 端子槽21 底面22 錫球槽2 3 放置區25 卡槽26 固定部31 接觸部3 2 連接片33 導斜面35 卡面36 間隙37 錫球40 治具4 5 格子46 座體2 0 凸緣24 端子30 凸部34 松向板3 8Page 11 200537771 Brief description of the drawings Figure 1 is a perspective view of the first electric soldering ball of the present invention. Figure 2 is a perspective view of the first solder ball of the present invention. Fig. 3 is a perspective view of a second embodiment of the present invention before heating. Fig. 4 is a side sectional view before the first heat of the present invention. Fig. 5 is a cross section Ξ of the present invention. Fig. 7 is a side sectional view of the present invention: the second embodiment is placed obliquely and heated, and Fig. 8 is a side sectional view of the m embodiment of the present invention before it is heated. . Illustration. Figure 9 is a side view of the second preferred embodiment of the present invention. Figure η is a perspective view of a preferred embodiment before heating. ′, The side of the second preferred embodiment before heating & q s _ Fig. 12 is a drawing of the present invention 筮 -h u ~ training and greeting. FIG. 13 is a side cross-sectional view of Tailu Nichi Comparative Example after heating. U ίΪSide view of the third preferred embodiment after heating. FIG. 14 is a side cross-sectional view of the fourth preferred embodiment of the present invention after the heat treatment. Fig. 15 is a side sectional view of a fifth preferred embodiment of the present invention before heating. FIG. 16 is a side sectional view of a fifth preferred embodiment of the present invention after heating. Reference sign description Terminal slot 21 Bottom surface 22 Solder ball slot 2 3 Placement area 25 Card slot 26 Fixing portion 31 Contact portion 3 2 Connecting piece 33 Guide slope 35 Card surface 36 Clearance 37 Solder ball 40 Fixture 4 5 Lattice 46 Seat 2 0 Convex Edge 24 Terminal 30 Projection 34 Loose plate 3 8
第12頁Page 12
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93113792A TW200537771A (en) | 2004-05-14 | 2004-05-14 | Structure and engineering method of joint connection of solder ball for electric connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93113792A TW200537771A (en) | 2004-05-14 | 2004-05-14 | Structure and engineering method of joint connection of solder ball for electric connector |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200537771A true TW200537771A (en) | 2005-11-16 |
Family
ID=52348993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93113792A TW200537771A (en) | 2004-05-14 | 2004-05-14 | Structure and engineering method of joint connection of solder ball for electric connector |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200537771A (en) |
-
2004
- 2004-05-14 TW TW93113792A patent/TW200537771A/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9318823B2 (en) | Board to board electrical connector assembly | |
TW544885B (en) | Carrier with metal bumps for semiconductor die packages | |
TWM357745U (en) | Electrical connector assembly | |
JP5614484B1 (en) | Joining member for electrical connector and method for manufacturing the same | |
US5490786A (en) | Termination of contact tails to PC board | |
TW201121157A (en) | Board with connection terminals | |
TWM361658U (en) | Electrical connector assembly and clip thereof | |
TWI290391B (en) | Electrical connector with a solder ball locking structure and method for manufacturing the same | |
CN101553908A (en) | Folded frame carrier for MOSFET BGA | |
TW200537771A (en) | Structure and engineering method of joint connection of solder ball for electric connector | |
CN2724265Y (en) | Lap solder ball device for electrical connector | |
TWM250422U (en) | Electrical connector | |
JPH04162554A (en) | Semiconductor device for electric power use | |
CN201075418Y (en) | electrical connector | |
CN107230644A (en) | Metal column with metal sponge | |
TW200537770A (en) | Engineering method of joint connection of solder ball for electric connector | |
CN222088878U (en) | Electrical connector terminal tinning structure | |
TWI280508B (en) | Module for a data carrier with improved bump counterparts | |
TWM269597U (en) | Stopperr structure of solder ball used in electric connector | |
TWM428533U (en) | Electrical card connector | |
TWI483476B (en) | Terminal strip and electrical connector using the same | |
TWM357722U (en) | Electrical contact and electrical connector using the same | |
CN1734862B (en) | Solder ball blocking and buckling device of electric connector and processing method thereof | |
TWI405373B (en) | Contact of electrical connector and method to place solder ball thereon | |
TWM265820U (en) | Board to board connector |