TW200537770A - Engineering method of joint connection of solder ball for electric connector - Google Patents
Engineering method of joint connection of solder ball for electric connector Download PDFInfo
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- TW200537770A TW200537770A TW93113791A TW93113791A TW200537770A TW 200537770 A TW200537770 A TW 200537770A TW 93113791 A TW93113791 A TW 93113791A TW 93113791 A TW93113791 A TW 93113791A TW 200537770 A TW200537770 A TW 200537770A
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- solder ball
- solder
- terminal
- connecting piece
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 118
- 238000012407 engineering method Methods 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
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- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
200537770200537770
發明之技術領域 特別係指一種電連接 本發明係有關於一種電連接器 器之搭接錫球工法。 先前技術 f ^閱圖1,係為一種習知之電連接器之搭接錫球構 =,其包括有一座體10及複數之端子15,該座體10設有複 f之端子槽11’該複數之端子15設於該複數之端子槽,該 端子之一端設有一接觸部16,端子之另一端設有一水平之 連接片17,該連接片17中間凹陷而呈杯體, 球1 9。 上述構造有以下缺失: 1 ·其係於連接片1 7上塗上錫膏,再將錫球置於其上,經加 熱後錫球即與連接片結合,其僅藉由錫膏熔接於該連接片 1 7 ’並未達到很牢固之結合效果。 2·該錫球19係下端熔接於呈水平之連接片17上,由於熔接 點在下方,故為使在加熱時易於受熱,座體丨〇在錫球i 9之 周圍不能設有周壁來定位錫球(若設有周壁則會阻熱,不 利於加熱熔接),僅能藉由該連接片丨7中間略為凹陷呈杯 體而使錫球置於其上,然此種定位錫球之方式不夠穩定, 尤其當連接器之錫球接點愈密集,使得錫球及連接片之杯 體愈小時,則更顯現錫球置於連接片丨7上之定位效果不FIELD OF THE INVENTION The present invention relates in particular to an electrical connection. The present invention relates to a method of lapping solder balls for an electrical connector. The prior art f ^ refer to FIG. 1, which is a conventional solder ball structure of an electrical connector. It includes a body 10 and a plurality of terminals 15, and the seat 10 is provided with a plurality of terminal slots 11 ′. A plurality of terminals 15 are provided in the plurality of terminal slots. One end of the terminal is provided with a contact portion 16, and the other end of the terminal is provided with a horizontal connecting piece 17. The connecting piece 17 is recessed in the middle to form a cup, and the ball 19. The above structure has the following defects: 1 It is coated with solder paste on the connection piece 17 and then the solder ball is placed on it. After heating, the solder ball is combined with the connection piece, and it is only welded to the connection by the solder paste. Sheet 1 7 'did not achieve a very strong bonding effect. 2. The lower end of the solder ball 19 is welded to the horizontal connecting piece 17. Since the welding point is below, in order to make it easy to be heated during heating, the seat body cannot be provided with a peripheral wall around the solder ball i 9 for positioning. The solder ball (if it is provided with a peripheral wall, it will block heat, which is not conducive to heating and welding). The solder ball can only be placed on the connecting piece 丨 7 in the middle of the cup, which is slightly recessed, but this way of positioning the solder ball Not stable enough, especially when the solder ball contacts of the connector are denser, the smaller the solder ball and the cup of the connecting piece, the more obvious the positioning effect of the solder ball on the connecting piece is.
200537770 五、發明說明(2) 發明内容 本發明之主要目的在於提供一種電連接器之搭接錫球 工法’其係成側向搭接錫球’在加熱時易於受熱,不致因 錫球之周圍受到座體之包圍而難以受熱。 本發明之次要目的在於提供一種電連接器之搭接錫球 工法,其係成側向搭接錫球,當錫球側向受熱溶化與端子 之連接片結合時,較不會影響錫球之高度。 為達上述目的,本發明電連接器之搭接錫球工法,其 包括以下步驟:提供一座體,該座體間隔排列設有複數之 端子槽,提供複數之端子,其設於該複數之端子槽,該端 子之一端設有一接觸部,端子之另一端設有一呈縱向之連 接片,於複數之端子之連接片末端塗上焊料;提供複數之 錫球’將每一錫球之一侧與呈縱向之該端子之連接片接 觸;及提供加熱令焊料熔化而使錫球熔接於該連接片。 本發明之上述及其他目的、優點和特色由以下較佳實 施例之詳細說明中並參考圖式當可更加明白。 實施方式 本實施例之工法包括以下步驟: 請參閱圖2 ’提供一座體2 0,其上間隔排列設有複數 之端子槽21,該端子槽21設有一底面22,該底面22之另一 端形成一錫球槽23。 知1供複數之端子30,其設於該複數之端子槽21,該端 子設有一固定部31與端子槽21固定,該固定部31下方往端200537770 V. Description of the invention (2) Summary of the invention The main object of the present invention is to provide a method for lapping solder balls of an electrical connector, which is formed as a side lapping solder ball, which is easy to be heated during heating, and not caused by the surrounding of the solder ball. Surrounded by the base and difficult to heat. A secondary object of the present invention is to provide a method for laminating solder balls of an electrical connector, which is a lateral lapping solder ball. When the solder ball is heated by melting in the lateral direction and is combined with the connecting piece of the terminal, the solder ball is less affected. Height. In order to achieve the above object, the method for laminating solder balls of the electrical connector of the present invention includes the following steps: providing a base body, the base body being provided with a plurality of terminal grooves arranged at intervals, providing a plurality of terminals provided on the plurality of terminals; Slot, one end of the terminal is provided with a contact portion, and the other end of the terminal is provided with a connecting piece in a longitudinal direction, and the ends of the connecting piece of the plurality of terminals are coated with solder; a plurality of solder balls are provided to connect one side of each solder ball with The connecting piece of the terminal in the longitudinal direction is in contact; and heating is provided to melt the solder so that the solder ball is welded to the connecting piece. The above and other objects, advantages, and features of the present invention will be more clearly understood from the following detailed description of the preferred embodiments with reference to the accompanying drawings. Implementation method The working method of this embodiment includes the following steps: Please refer to FIG. 2 'provide a body 20, on which a plurality of terminal slots 21 are arranged at intervals. The terminal slot 21 is provided with a bottom surface 22, and the other end of the bottom surface 22 is formed.一 锡 球 槽 23。 One solder ball groove 23. Know 1 for a plurality of terminals 30, which are provided in the plurality of terminal slots 21, the terminal is provided with a fixing portion 31 fixed to the terminal slot 21, and the fixing portion 31 faces downward from the end
200537770 五、發明說明(3) 子槽上方端延 3 1下方往端子 呈縱向伸至該 請參閱圖 料5 5,焊料可 2 0之下表面, 令一端子之連 5 5,如此焊料 請參閱圖 一錫球槽2 3, 請參閱圖 吸附於端子之 固的結合於端 由以上之 ::::可上下彈動之接觸部32 槽下方端延伸設有一連接Η μ # 土 ^ 1 错诂嫵μ 口甘:連接片33,該連接片33 錫球槽23,且其末端略超出錫球槽23。 3,於複數之端子3 〇之速垃η ^ ^ 運接片33末端塗上焊 為錫膏,本實施例採一鋼板50套合置於 該鋼板50上設有複數之穿孔5卜每一穿孔η 接片3 3之末端套入,再於鋼板5 〇上塗刷焊料 5 5即由穿孔5 1附著於連接片3 3之末端。 4’提供複數之錫球40,將每一錫球4〇置入 該錫球40—侧與呈縱向之連接片33接觸。 5,提供加熱令焊料5 5熔化,焊料會下流並 連接片3 3與錫球4 0上,如此即可令錫球4 〇穩 子之連接片3 3之縱向板面。 說明,本發明可歸納出以下優點: 1 ·端子之連接片3 3呈縱向,故成側向與錫球4 0焊接,由於 焊接點在錫球4 0之側邊非在錫球4 0底部,接近外面較為容 易受熱,如此座體2 0可設置錫球槽2 3來定位錫球4 0,使在 加熱前有較佳之定位效果,錫球4 0周邊雖有阻隔仍不致難 以受熱。 2 ·錫球4 0之側向則受到錫球槽2 3之框限,故可使錫球與連 接片3 3之連結非常牢固,且兩錫球4 0間有錫球槽隔開,避 免相接觸造成短路。 3 ·端子3 0之連接片3 3成側向搭接錫球4 0,當錫球側向受熱 熔化與端子之連接片結合時,較不會影響錫球之高度。200537770 V. Description of the invention (3) The upper end of the sub-slot extends 3 1 and the terminal extends vertically to the terminal. Please refer to Figure 5 5. The solder can be 20 lower surface, so that one terminal is connected to 5 5. Fig. 1 Solder ball groove 2 3, please refer to the figure. The solid bonded to the terminal is bonded to the end by the above: :::: the contact part that can be moved up and down. 32 The bottom end of the groove is provided with a connection Η μ # 土 ^ 1 诂妩 μ: The connecting piece 33 has a solder ball groove 23, and its end slightly exceeds the solder ball groove 23. 3. Apply solder as solder paste to the end of the plurality of terminals 3 〇 ^ ^ ^ The terminal 33 is coated with solder as a solder paste. In this embodiment, a steel plate 50 is placed on the steel plate 50 and a plurality of perforations 5 is provided. The end of the through hole η of the connecting piece 3 3 is sleeved, and then the solder 5 5 is coated on the steel plate 50, and the through hole 51 is attached to the end of the connecting piece 33. 4 'provides a plurality of solder balls 40. Each solder ball 40 is placed in the solder ball 40 on one side and contacts the connecting piece 33 in the longitudinal direction. 5. Provide heating to melt the solder 5 5, the solder will flow down and connect the sheet 3 3 and the solder ball 40. In this way, the longitudinal surface of the solder ball 3 0 of the stabilizer sheet 3 3 can be made. Note that the present invention can be summarized as follows: 1. The connecting piece 33 of the terminal is longitudinal, so it is welded laterally to the solder ball 40. Since the soldering point is on the side of the solder ball 40 and not on the bottom of the solder ball 40 It is easier to be heated near the outside. In this way, the base body 20 can be provided with a solder ball groove 23 to locate the solder ball 40, so that it has a better positioning effect before heating. Although the periphery of the solder ball 40 is blocked, it is not difficult to be heated. 2 · The side of the solder ball 40 is limited by the frame of the solder ball groove 23, so the connection between the solder ball and the connecting piece 33 can be very firm, and the two solder balls 40 are separated by a solder ball groove to avoid Phase contact causes short circuit. 3 • The connecting piece 3 of the terminal 30 is a laterally overlapping solder ball 40. When the side of the solder ball is heated and melted and combined with the connecting piece of the terminal, it will not affect the height of the solder ball.
200537770200537770
五、發明說明(4) 請參閱圖6及圖7,係本發明之第二實施例,其大致血 第一實施例相同,其差別在於其係在加熱時將座體2 〇與^ 平面呈約7 5度傾斜置放,使該錫球4 0可藉由本身之重力7 抵壓在該連接片3 3上,如此若加熱較長時間可令每一錫球 40部份熱溶時流至端子之連接片33上,更加強:兩者之= 合效果且較不會影響錫球40之高度(若錫球40呈上下方向 炼化時’有如冰洪淋溶化般下陷)’再者,座體2 〇與水平 面仍小於9 0度,錫球4 0不致因振動或是在熔化時掉出錫球 槽2 3外。V. Description of the invention (4) Please refer to FIG. 6 and FIG. 7, which are the second embodiment of the present invention. The first embodiment is substantially the same as the first embodiment. The difference is that the base body 20 and ^ planes are shown when heated. It is placed at an angle of about 75 degrees, so that the solder ball 40 can be pressed against the connecting piece 33 by its own gravity 7, so that if it is heated for a long time, 40 parts of each solder ball will melt to flow to The connection piece 33 of the terminal is further strengthened: the combination of the two is less effective and does not affect the height of the solder ball 40 (if the solder ball 40 is refining in the up-down direction, it 'sags like ice flood leaching'), The base body 20 and the horizontal plane are still less than 90 degrees, and the solder ball 40 does not fall out of the solder ball groove 23 due to vibration or melting.
請參閱圖8,係本發明之第三實施例,其大致與第一 實施例相同,其差別在於該端子之連接片3 3具有側向彈 性,其略向錫球槽23中心傾斜藉以形成可向外側彈動之空 間’當錫球4 0置入錫球槽2 3時,該連接片3 3可彈性抵緊錫 球4 0,如此在未加熱前錫球4 0之定位效果較佳。 請參閱圖9,係本發明之第四實施例,其大致與第一 實施例相同,其差別在於該端子30之連接片33接近末端設 有一穿孔34,藉此令附著於連接片末端之焊料55可由該穿 孔3 4流到連接錫球4 0之一面。Please refer to FIG. 8, which is a third embodiment of the present invention, which is substantially the same as the first embodiment. The difference is that the connecting piece 33 of the terminal has lateral elasticity, which is slightly inclined toward the center of the solder ball groove 23 to form a When the solder ball 40 is inserted into the solder ball groove 23, the connecting piece 33 can elastically press the solder ball 40, so the positioning effect of the solder ball 40 is better before heating. Please refer to FIG. 9, which is a fourth embodiment of the present invention, which is substantially the same as the first embodiment. The difference is that the connecting piece 33 of the terminal 30 is provided with a through hole 34 near the end, so that the solder adhered to the end of the connecting piece. 55 can flow from this perforation 34 to one side of the solder ball 40.
請參閱圖1 0,係本發明之第五實施例,其大致與第四 實施例相同’其差別在於該端子3 0之連接片3 3設有一通道 3 5連接該穿孔3 4至末端。 請參閱圖11及圖1 2,係本發明之第六實施例,其工法 包括以下步驟: 提供一座體2 0,其上間隔排列設有複數之端子槽2 1,Please refer to FIG. 10, which is a fifth embodiment of the present invention, which is substantially the same as the fourth embodiment. The difference is that the connecting piece 3 3 of the terminal 30 is provided with a channel 3 5 to connect the through hole 34 to the end. Please refer to FIG. 11 and FIG. 12, which are the sixth embodiment of the present invention. The construction method includes the following steps: providing a body 20 with a plurality of terminal slots 21 arranged at intervals thereon,
第8頁 200537770 五、發明說明(5) ^ 其下表面之周緣設有凸緣24而形成一放置區25。 提供複數之端子30,其設於該複數之端子槽21,該端 子設有一固定部31與端子槽21固定,該固定部31下方連接 一橫向部38,該橫向板38連接一往端子槽上方延伸且可上 下彈動之接觸部32,該固定部31下方往端子槽下方端延伸 設有一連接片33,該連接片3 3呈縱向伸至該放置區25。 提供一治具45,該治具套合置於該座體20下表面之放 置區25’其設有複數之格子46之治具45,該複數之格子46 對應該複數之端子槽21。 請參閱圖12,於複數之端子30之連接片33末端塗上焊 料5 5 ’焊料可為錫膏,本實施例採一鋼板5 0套合置於該治 具4 5上’該鋼板5〇上設有複數之穿孔51,每一穿孔5丨令一 端子之連接片3 3之末端套入,再於鋼板5 0上塗刷焊料5 5, 如此焊料5 5即由穿孔5 1附著於連接片3 3之末端。 請參閱圖1 3,提供複數之.錫球4 0,此時將鋼板5 0移 開’再將每一錫球4 〇置入一格子4 6,該錫球4 0下端抵於端 子之橫向板3 8且一側接觸該連接片3 3。 請參閱圖1 4,提供加熱令焊料5 5熔化,焊料5 5會下流 並吸附於端子之連接片3 3與錫球4 〇上,如此即可令錫球4 0 穩固的結合於端子之連接片3 3之縱向板面。 请參閱圖1 5,最後拿開治具4 5,此時錫球4 0穩固的結合於 端子之連接片33。 在較佳實施例之詳細說明中所提出之具體的實施例僅 為了易於說明本發明之技術内容,而並非將本發明狹義地Page 8 200537770 V. Description of the invention (5) ^ The periphery of the lower surface is provided with a flange 24 to form a placement area 25. A plurality of terminals 30 are provided, which are provided in the plurality of terminal grooves 21. The terminals are provided with a fixing portion 31 fixed to the terminal grooves 21, a lower portion 31 is connected to a transverse portion 38, and a transverse plate 38 is connected to the upper side of the terminal grooves. A contact portion 32 is extended and can be moved up and down. A connecting piece 33 is extended below the fixing portion 31 toward the lower end of the terminal groove. The connecting piece 33 extends longitudinally to the placement area 25. A jig 45 is provided, and the jig fits into a placement area 25 'on the lower surface of the base 20, and the jig 45 is provided with a plurality of grids 46 corresponding to the plurality of terminal slots 21. Referring to FIG. 12, the end of the connecting piece 33 of the plurality of terminals 30 is coated with solder 5 5 ′. The solder may be solder paste. In this embodiment, a steel plate 50 is fitted on the fixture 45 and the steel plate 5. A plurality of perforations 51 are provided thereon, and each of the perforations 5 丨 inserts the end of a connection piece 3 3 of a terminal, and then applies solder 5 5 to the steel plate 50, so that the solder 5 5 is attached to the connection by the perforation 5 1 The end of sheet 3 3. Please refer to FIG. 13 and provide a plurality of solder balls 40. At this time, remove the steel plate 50 and then place each solder ball 40 in a grid 4 6. The lower end of the solder ball 40 is in the transverse direction of the terminal. The board 38 and one side contacts the connecting piece 33. Please refer to FIG. 4. Provide heating to melt the solder 5 5, and the solder 5 5 will flow down and be adsorbed on the connection piece 33 and the solder ball 4 〇, so that the solder ball 40 can be firmly connected to the connection of the terminal Sheet 3 3 has a longitudinal plate surface. Please refer to FIG. 15. Finally, the jig 45 is removed. At this time, the solder ball 40 is firmly connected to the connecting piece 33 of the terminal. The specific embodiments proposed in the detailed description of the preferred embodiments are only for easy explanation of the technical content of the present invention, and are not intended to narrow the present invention in a narrow sense.
第9頁 200537770 五、發明說明(6) 限制於該實施例,在不超出本發明之精神及以下申請專利 範圍之情況,可作種種變化實施。 第10頁 200537770 圖式簡單說明 圖1係習知電 圖2係本發明 圖3係本發明 圖4係本發明 圖5係本發明 圖6係本發明 圖7係本發明 圖8係本發明 圖9係本發明 圖1 0係本發明 圖11係本發明 之側視剖面圖 圖1 2係本發明 圖1 3係本發明 圖1 4係本發明 圖1 5係本發明 面圖。 標號說明 座體20 凸緣24 接觸部3 2 橫向板38 鋼板50 連接器之連接錫球立體圖。 第一較佳實施例之鋼板分離 第一較佳實施例塗上焊料之 第一較佳實施例置入錫球之 第一較佳實施例加熱後之側 第二較佳實施例斜放加熱前 第二較佳實施例斜放加熱後 第二較佳實施例加熱前之側 第四較佳實施例之端子立體 第五較佳實施例之端子立體 第六較佳實施例之座體、治 〇 第六較佳實施例塗上焊料之 第六較佳實施例置入錫球之 第六較佳實施例加熱後之側 第六較佳實施例加熱後並移 之側視剖面圖。 側視剖面圖。 側視剖面圖。 視剖面圖。 之側視剖面圖。 之側視剖面圖。 視剖面圖。 圖〇 圖。 具、及鋼板分離 側視剖面圖。 側視剖面圖。 視剖面圖。 開治具之側視剖 錫球槽2 3 固定部3 1 通道35 格子46 端 子 槽 21 底 面 22 放 置 區 25 端 子 30 連 接 片 33 穿 孔 34 錫 球 40 治 具 45 穿 孔 51 焊 料 55Page 9 200537770 V. Description of the invention (6) It is limited to this embodiment, and it can be implemented with various changes without departing from the spirit of the invention and the scope of the following patent applications. Page 10 200537770 Brief Description of Drawings Figure 1 is a conventional electric picture 2 is the present invention 3 is the present invention 4 is the present invention 5 is the present invention 6 is the present invention 7 is the present invention 8 is the present invention 9 is the present invention, FIG. 10 is the present invention, FIG. 11 is a side sectional view of the present invention, FIG. 12 is the present invention, FIG. 13 is the present invention, FIG. 14 is the present invention, and FIG. 15 is the front view of the present invention. Description of reference numerals Base 20 Flange 24 Contact portion 3 2 Transverse plate 38 Steel plate 50 Connector connection perspective view of solder balls. Steel plate separation of the first preferred embodiment. First preferred embodiment. First coated with solder. First preferred embodiment. Solder ball. First preferred embodiment. Side after heating. Second preferred embodiment. The second preferred embodiment is placed on the side after the second preferred embodiment is heated before the second preferred embodiment. The terminal of the fourth preferred embodiment is three-dimensional. The terminal of the fifth preferred embodiment is the base of the sixth preferred embodiment. Sixth preferred embodiment The sixth preferred embodiment with solder applied The sixth preferred embodiment with solder balls placed on the heated side The sixth preferred embodiment is a side sectional view of the heated and moved side. Side view profile view. Side view profile view. View section. Side sectional view. Side sectional view. View section. Figure 〇 Figure. Tool and steel plate side view. Side view profile view. View section. Side view of the fixture. Solder ball slot 2 3 Fixing part 3 1 Channel 35 Lattice 46 Terminal slot 21 Bottom surface 22 Placement area 25 Terminal 30 Connection piece 33 Perforation 34 Tin ball 40 Fixture 45 Perforation 51 Solder 55
第11頁Page 11
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW93113791A TW200537770A (en) | 2004-05-14 | 2004-05-14 | Engineering method of joint connection of solder ball for electric connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW93113791A TW200537770A (en) | 2004-05-14 | 2004-05-14 | Engineering method of joint connection of solder ball for electric connector |
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Publication Number | Publication Date |
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TW200537770A true TW200537770A (en) | 2005-11-16 |
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TW93113791A TW200537770A (en) | 2004-05-14 | 2004-05-14 | Engineering method of joint connection of solder ball for electric connector |
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