TW200533983A - Flat panel display apparatus - Google Patents

Abstract

A flat panel display apparatus includes a main plate, an organic light emitting element, a protecting layer and an attachable-detachable layer. The organic light emitting element includes a first electrode, a second electrode corresponding to the first electrode, and an organic light emitting layer disposed between the first and second electrodes to generate a light based on a current that flows between the first and second electrodes through the organic light emitting layer. The organic light emitting element is on the main plate. The protecting layer is on the organic light emitting element to protect the organic light emitting element. The attachable-detachable layer is on the protecting layer. Therefore, an image display quality is improved, and a manufacturing cost is decreased.

Description

200533983 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a flat display device and a method for manufacturing the flat display device. More specifically, the present invention relates to a flat display device capable of improving image display quality and reducing manufacturing cost, and a method of manufacturing the flat display device. [Prior Art]-An organic light emitting element of an organic light emitting display (OLED) device includes an anode, a cathode, and an organic light emitting layer. The hole provided by the anode and the electron provided by the anode are combined with the organic light emitting layer to generate an exciton having an excited state. When the exciton self-excited state becomes the -ground state, the light-emitting layer generates light. 〇LED devices have various characteristics, such as high brightness, wide viewing angle, low power consumption and so on. The 0LED device has a simpler structure than other display devices such as cathode ray tubes (CR, etc.). Therefore, the manufacturing cost of the 0LED device is lower than the manufacturing cost of the CRT device. In addition, the ⑽D device is a light-emitting device Therefore, high-quality images can be displayed regardless of the angle of view. In addition, the LED device can be a rich panel, which can be bent in a direction that is approximately perpendicular to the surface of the board. Field, machine lx light layer is exposed to water or oxygen In the middle, the organic light-emitting layer will react with water or milk gas, thereby destroying the electrochemical characteristics of the organic light-emitting layer. In order to isolate the organic light-emitting layer from water or oxygen, the organic light-emitting layer is in a closed state. The '0LED device may include a protective layer that protects the organic light-emitting layer from the effects of cultural water and oxygen. 98542.doc 200533983 A metal can, a glass substrate, etc. may be located on the organic light-emitting element to form the enclosed space. #The organic When the light-emitting layer is in the closed space, it will complicate the manufacturing process of the OLED device, and increase the manufacturing cost of the OLED device. In addition, the increase in the thickness of the OLED device causes the flexibility of the OLED device. Low.% An organic material is coated on the organic light-emitting element to form the protective layer. Alternatively, an organic material can be deposited on the organic light-emitting element to form a protective layer. When the molecular weight of the polymer in the protective layer increases The permeability of the protective layer is increased. In addition, cracks may be formed in the compound when a protective layer with a polymer is formed at a high temperature. ♦ When the inorganic layer is directly formed on the organic light emitting element, the light element It may be deteriorated by the heat generated during the deposition process: due to the fact that the layer in contact with the organic light-emitting element should be formed at low temperature. However, when the organic layer is formed at warm temperature, the permeability of the organic layer will be increased. Tian Zai This organic or inorganic layer can form a protective layer or touch of a flat display device such as a liquid crystal (LCD) device, a display panel (PDP) display device, etc .: display panel. [Summary of the Invention] The present invention provides- A flat display device capable of improving the image display quality and reducing the cost. The present invention also provides a method for manufacturing the flat display device. According to the aspect of the present invention, the flat The display device includes: an organic light-emitting element, a protective layer, and an _attachable_ separable layer ^, k ^ ^ Wang Caifan, there are 98542.doc 200533983 organic light-emitting elements include ... The sub-electrode should be located between the first electrode and the second electrode of the first electrode so as to flow between the first electrode and the second electrode through the organic light emitting layer. The current comes to the light-emitting layer. The financial light-emitting element is located on the main board. The 4 layers of security are located on the organic light-emitting diode and the organic light-emitting element is protected. The additional-detachable layer is located on the protective layer. : In another aspect of the invention, a flat display device includes a board, an organic light emitting element, and a protective layer element includes a 1 d auxiliary board. The organic light emitting "diode" pole, a second electric one electrode corresponding to the first-electrode, and the coin-jade stack /, the di-electrode are used to The current generates the first organic light-emitting layer. The organic light-emitting element has a protective layer located on the organic light-emitting element .... The auxiliary board is located on the protective layer. "Organic light-emitting element. The flat display device according to still another aspect of the present invention includes a panel, an organic light emitting element, and a light emitting element including a first electrode and an S 4 layer. The organic respect "°" should be between the second private electrode of the first electrode and a electrode located between the first electrode + the first + ~ ~ electrode based on a flow between the L electrodes through the An organic light-emitting layer that generates light with the current t of the organic light-emitting layer. The organic light-emitting layer is located on the main board of the organic light-emitting layer. The ancient buffer a is particularly useful. The synthetic buffer layer includes a Γ layer and a plurality of layers. The inorganic insulating particles in the organic layer. Two layers are located on the synthetic buffer layer to protect the organic light-emitting element. According to the aspect of the present invention, a method for manufacturing the plane 98542.doc 鬌 200533983 is provided as follows. Formed on the main board-the element includes a first electrode, the element, the organic light emitting electrode, and a second electric-electrode and a second electrode located between the first electrode and the corresponding electrode: a is used to First, the organic light-emitting layer is produced by passing the current of the organic light-emitting layer in 5th hour. An auxiliary light-emitting component can be formed on the auxiliary plate. An organic light-emitting element is combined with the protective layer. Using this attachable σ Knife separation layer moves up from the protective layer The auxiliary plate: ==: a kind of 'provided-a kind of manufacturing such flat display and light emitting elements as follows: a first electrode, a light element, the organic ° corresponding to the second electrode of the first electrode and the The organic light-emitting layer between the first electrode and the second electrode is based on-flowing between the two electrodes through the organic light-emitting layer. A protective layer is formed on the -auxiliary plate. The mu organic light-emitting element and the protection are formed. According to another aspect of the present invention, a method for providing a display device is provided. A light emitting element of a bevel plane on a main board includes: a flute, organic light emitting elements, which have two respectable poles, one corresponding In the first position of the first electrode, two one is located between the first electrode and the second electrode to generate a current flowing through the organic light emitting layer between the two electrodes based on one to form an organic light emitting layer. An organic light-emitting element is formed on the organic light-emitting element: the layer j synthetic buffer layer includes an organic layer and a plurality of organic insulating particles located on the organic light-emitting element. A protective layer is formed on the synthetic buffer layer to protect the organic light-emitting element. The flat display device includes— 98 ^ 2.d〇c 200533983 oled devices are classified into—active OLED devices and—passive OLED devices. ”This is the use of auxiliary boards to form the protective layer of the flat display device to reduce J There is a thermal budget for a matte element. In addition, the protective layer can be formed at a high temperature to increase the permeability of the protective layer, thereby improving the 11 display quality of the flat display device. Moreover, it can be formed under an oxygen atmosphere. A protective layer to reduce the manufacturing cost of the flat display device. In addition, flat display devices such as Hai include an organic buffer layer with inorganic insulating particles to protect the organic light-emitting element from impurities from the outside world or organic light emission. The impact of the device reduces the thermal budget of the organic light emitting device. [Embodiments] It should be understood that the exemplary embodiments of the invention described below can be changed or modified in many different ways without departing from the principles of the invention disclosed herein, so the scope of the invention is not limited to the specific embodiments described below . Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art by way of example and not limitation. Hereinafter, the present invention will be explained in detail with reference to the drawings. FIG. 1 is a plan view showing a flat display device according to an exemplary embodiment of the present invention. Fig. 2 is a cross-sectional view taken along the center line M of the figure. 1 and 2, the flat display device includes a main board 100, an organic light emitting element 150, a storage capacitor 103, and a protective film assembly 16 (). The main board 100 includes glass, triethyl cellulose (TAC), polycarbonate (PC) t_blocker (PES), polyethylene terephthalate (pet), polyphenylene 98542.doc 10 200533983 Ethylene glycol ester (PEN), ethylene glycol (PVA), polymethyl methacrylate (PMMA), cycloolefin polymer (cop), etc., or a combination thereof. The organic light emitting element 150 includes a gate electrode insulating layer 101a, an inorganic insulating layer UHb, an anode 102, a slope 104, an organic light emitting layer ⑽, a switching transistor 107, a driving transistor 109, and One cathode 1]: 0. The switching transistor 107 includes a first source electrode 10A, a first gate electrode 105b, a -drain electrode 1 () 53, and a first semiconductor layer pattern. The first source electrode 5e is electrically connected to the data line core, so that the drive integrated circuit (not shown) outputs a data signal to the first source electrode 10 red via the data line 05c. The first gate electrode 105b is located on the main board 100, and the first gate electrode is electrically connected to the -gate line 105b, so that the driving integrated circuit outputs the -gate voltage to the first gate electrode via the closed-pole line 105b '. i coffee. The first electrode theory is separated from the first source electrode 105c. The first semiconductor layer pattern is located between the first drain electrode 105a and the first source electrode 105c. The driving transistor 109 includes a second source electrode 108a, a second inter electrode 嶋, a second drain electrode, and a second semiconductor layer pattern. The second source electrode iOh is electrically connected to an electrodeless voltage line 10 仏 to receive an electrodeless voltage. The second electrode is located on the main board, and the second gate electrode is via the auxiliary: the contact hole is electrically connected to the first drain electrode of the switching transistor 107, and the first drain electrode 108 and the second source are difficult to connect. The electrodes 108a are separated. The second semiconductor layer pattern is located between the second drain electrode and the second source electrode. When the data voltage and the gate voltage are applied to the data line 105 respectively. And gate gate 105b, the lean voltage is applied to the second gate electrode 10k through the first source electrode 10a, the first semiconductor layer pattern, and the first drain electrode 105a. When the data voltage 98542.doc -11-200533983 is applied to the second gate electrode 108, a channel is formed in the second semiconductor layer pattern, so that the drain voltage is applied to the second drain electrode. . The gate electrode insulating layer 101a electrically insulates the first gate electrode 105b, the gate line 105b, and the second gate electrode 108b from the first source electrode 105a, the data line 110, and the first; and The electrode 105c, the second source electrode 108a, the drain voltage line 108a, and the second and / or the pole 108c. The gate electrode insulating layer a includes a transparent insulating material, such as silicon oxide, silicon nitride, and the like. The inorganic insulating layer 101b is located on the main board 100. The main board 100 includes: a switching transistor 107, a driving transistor 109, a gate line 105b, a data line 10b, and a drain voltage line 108a. The inorganic insulating layer 10lb includes a contact hole through which the second drain electrode 108c is electrically connected to the anode 102. The inorganic insulating layer 101b includes a transparent insulating material, such as silicon oxide, silicon nitride, and the like. The second gate electrode 108b and the drain voltage line 108a partially overlap to form a storage capacitor 103. The storage capacitor 103 maintains a frame voltage difference between the anode 102 and the cathode 110. The anode 102 is located on the main board 100-in an area defined by a drain voltage line 108b, a gate line 105b ', and a lean line 105c'. Anode 102 includes a conductive material, such as a metal. Alternatively, the drain electrode may be located on the organic light emitting layer, and the cathode may be located on the inorganic insulating layer and electrically connected to the second drain electrode. The slope 104 is located on the inorganic insulating layer ⑺ "having the anode 102 to form a recessed portion in a central portion of the anode 102. The organic light emitting layer 106 is located in the recessed portion formed by the slope 104. In 1 example embodiment, 'The organic light-emitting layer 106 includes _ (tri-group: 98542.doc-12- 200533983 phosphonate) aluminum). The organic light-emitting layer 106 includes a red organic light-emitting portion, a green organic light-emitting portion, and a blue organic light-emitting portion. In this exemplary embodiment, the red light-emitting portion includes chloroform (DCM), 4- (dinitrilemethyl) _2-methyl 6 (1,1,7,7, -tetramethyl) Lonidine_9-yl) -411- ° biran (DCJT), 4- (dinitrilemethyl) _2 · methyl_6 (1,1,7,7, _tetramethylexodonidine _9_ group> 4H-Chran (DCJB), etc., and the green light emitting part includes coumarin 6, dihydroxy selenium and acridine (Qd), etc. The cathode 110 is located on the organic light emitting layer 106 and the slope 104 To receive a common voltage. The cathode 110 includes a transparent conductive material, such as indium tin oxide (ITO), tin oxide (TO), indium zinc oxide (ιζο), zinc oxide (z〇), and the like. An electrode voltage of a drain electrode 108 is applied to the anode 102 through the contact hole. Therefore, a current flows between the anode 102 and the cathode 112 through the organic light emitting layer 108. The hole provided by the anode 102 and the cathode The electrons provided by 1 丨 〇 are combined in the organic light-emitting layer 108 to generate molecules having an excited state. When the state of these molecules changes from the excited state to the ground state, the molecules generate light. The protective film assembly 160 It includes an adhesive layer 112, a protective layer 114, and an attachable-detachable layer 116. The protective film assembly 160 is located on the organic light emitting element 150. The adhesive layer 112 is located on the cathode 110, so that the protective layer 114 and organic light-emitting The elements 1 50 are combined. In this exemplary embodiment, the adhesive layer 2 includes a photo-curable resin or a heat-curable resin. When ultraviolet rays having a wavelength of about 200 nm to about 500 nm are irradiated into the photo-curable resin, The photo-curable resin is cured. The thermo-curable resin is cured at a temperature of about 25 ° C to about 200 ° C. The adhesive layer 112 98542.doc -13- 200533983 can be used as an auxiliary protective layer to protect the organic light emitting element 15. Protected from water or oxygen Although ultraviolet or heat may be applied to the cured adhesive layer 112, the cured adhesive layer may not be liquefied so that the protective layer 114 is combined with the organic light emitting element 150. The protective layer 114 is located on the adhesive layer 112 to protect the organic The light-emitting element 150 is protected from impurities from the outside or from being hit by the organic light-emitting element 150. The protective layer 114 separates the organic light-emitting layer 106 of the organic light-emitting element 150 from water or oxygen, and the protective layer 114 may Absorb water. The protective layer 114 includes an inorganic protective layer, an organic protective layer, a moisture-absorbing layer, etc. or a synthetic layer having a mixture thereof. Inorganic protective layer includes aluminum (A1), molybdenum (Mo), titanium (Ti), chromium (Cr), gold (Ag), oxide stone, nitride stone, oxynitride stone, oxide lock, aluminum oxide, nitride Ming, titanium oxide, etc. or a combination thereof. The organic protective layer includes a polymer tree, a parylene resin, and the like. The polymer resin has low permeability. The purpose of the polymer tree includes epoxy resin, silicone resin, fluorinated resin, acrylic resin, urethane resin, resin, polyethylene resin, polypropylene resin, polystyrene resin, and polymethyl methacrylate. Ester resin, polyurea resin, polyfluorene, or a combination thereof. The hygroscopic layer includes inorganic particles, carbonized hair, activated carbon #, or a combination thereof. The attachable-detachable layer 116 is on the protective layer 114. The adhesion of the attachable and detachable layer 116 can be changed according to light and heat. Therefore, the attachable and detachable layer 116 may be separated. For example, when the attachable; 98542.doc 200533983 separation layer 116 includes a photoresist and when light is irradiated onto the attachable-detachable layer 116, the adhesiveness of the attachable-detachable layer 116 decreases. Alternatively, the attachable-detachable layer 116 may include isocyanate, vinyl acetate resin, polyester, polyvinyl alcohol, acrylate, epoxy resin, synthetic rubber, thermoplastic resin, and the like. For example, when the attachable-detachable layer 116 includes a vinyl acetate resin, if the temperature is higher than about 401 ° C, its adhesion is greatly reduced. In this exemplary embodiment, the attachable-detachable layer 6 includes an r selfa tape manufactured by Japan's Sekisui Company. The adhesive layer 112 and / or an additional detachable layer 6 can be used as an auxiliary protection layer to protect the organic light emitting element 150 from water or oxygen. 3 to 6 are sectional views showing a method for manufacturing a flat display device according to an exemplary embodiment of the present invention. > Consider FIG. 3, and deposit a metal on the motherboard 100. The deposited material is partially etched to form the first gate electrode 105b, the gate line 105b, and the second gate electrode 108b. A transparent insulating material is deposited on the main board having a first gate electrode 105b, a gate line 105b, and a second gate electrode 8b. Part of the deposited transparent yttrium material is used to form a gate electrode insulation layer 10a with auxiliary contact holes,

Through the auxiliary contact Kong Qinchu ^ ^ L 蜩 蜩 弟 β dip electrode 105a can be electrically connected to the second gate electrode 10 8 b. The pattern and the N + amorphous fragment pattern j located on the amorphous cut patterns are formed on the insulating layer 101a corresponding to the first gate electrode 1 and the second gate electrode j to form the first gate electrode. A semiconductor layer pattern and the second semiconductor layer pattern. 98542.doc 200533983 sinks a #bei metal on a gate electrode insulating layer having a first and a second semiconductor layer pattern. The deposited metal is partly carved to form a first source electrode 105c, a data line i05c ', a first drain electrode 105a, a second source electrode 10, and a storage capacitor 103. Therefore, a switching transistor 107 having a first source electrode 105c, a first gate electrode 105b, a first drain electrode 105a, and a first semiconductor layer pattern and a second source electrode are formed on the motherboard 100. 108c, the second gate electrode 108b, the first drain electrode 108a, and the driving transistor 109 of the second semiconductor layer pattern. A transparent insulating material is deposited on the main board having the switching transistor 107, the driving transistor 109, the gate line 105b ', the data line 105c, and the drain voltage line 108a. The deposited transparent insulating material is partially etched to form an inorganic insulating layer 10lb having a contact hole, and the second drain electrode 108c is partially exposed through the contact hole. A metal is deposited on the inorganic insulating layer 101b. The deposited metal is partially etched to form the anode 102. The anode 102 is electrically connected to the second drain electrode 108c via the contact hole. An organic material having a photoresist is coated on an inorganic insulating layer 101b having an anode 102. The applied organic material is partially removed by an optical process to form a slope 104 having a recessed portion. The optical process includes an exposure step and a development step. A material forming the organic light emitting layer 106 is dropped into the recessed portion through an inkjet process to form the organic light emitting layer 100. A transparent conductive material is deposited on the organic light emitting layer 106 and the slope 104 to form a cathode 110. 98542.doc 16 200533983 In this way, organic light emission having a gate electrode insulating layer 101 &, an inorganic insulating layer ια, an anode 102, a slope 104, an organic light emitting layer 106, a switching transistor 107, a driving transistor 109, and a cathode 110 is made. Component 15 is complete. An adhesive layer having a photo-curable resin is coated on a motherboard 100 having an organic light emitting element '150. The coated adhesive material 112 is not cured. Alternatively, the adhesive material 112 may be coated on the protective layer U4 formed on the attachable / detachable ^ 116. Referring to FIG. 4, a "Selfa tape" is formed on the auxiliary plate 120 to form an attachable-detachable layer 116. In the exemplary embodiment, the auxiliary plate 120 is a flexible plate. Auxiliary plate 12 () & glass including conductive material m, triethyl cellulose (TAC), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET) , Polyethylene wax terephthalate (pEN), polyethylene fluorene a), polymethyl methacrylate (PMMA), cycloolefin polymer (cop), etc., or a combination thereof. The auxiliary plate 120 may have a thermally conductive material. • When light or heat is radiated to the attachable-detachable layer U6, the adhesion of the attachable-detachable layer 116 is reduced, so that it can be attached. The separable layer η 6 can be separated from the auxiliary plate 120. An oxygen cut is deposited on the attachable-detachable layer 116 to form an inorganic protective layer. An epoxy resin is coated on the protective layer of the coin machine to form an organic protective layer.口 本 保 4 层! 14 Includes—a double-layer structure with an inorganic protective layer and an organic protective layer. A protective layer 1 14 is formed on the attachable / detachable layer ι6 located on the auxiliary plate 120 so that it can be used in ancient, wk γ A 4, and ^ In a disaster, a protective layer 114 is formed under a dish, water, gas, or oxygen atmosphere. Because & 'can deposit silicon oxide at a temperature higher than about 20 CTC on the attachable layer 1 16 of 98542.doc -17- 200533983, and can be higher than about 200. A% oxygen resin is coated on the inorganic protective layer at a temperature of 0 to reduce the permeability of the protective layer 114. Another option is to form another inorganic protective layer on the organic protective layer. Fig. 5 and Fig. 6 'The main board 100 with the organic light-emitting element 150 and the adhesive layer 110 is combined with the auxiliary board 120 with the attachable and detachable layer 116 and the protective layer 14 to make the adhesive material of Fig. 3 , Facing the protective layer η #. The combined plates 100 and 120 are squeezed between an upper roller 142 and a lower roller 140. Fortunately, the wheel 142 is rolled in a direction opposite to the lower roller 4o. In this exemplary embodiment, the distance between the outer surface of the upper roller 142 and the outer surface of the lower roller 14o is substantially equal to the total thickness of the main board 100, the light emitting element 150, and the auxiliary board 120. Ultraviolet rays are irradiated between the upper roller 142 and the lower roller 140. When the ultraviolet ray is irradiated into the attachable-detachable layer Π6 and the bonding material 112 in FIG. 3, the bonding material 112 in FIG. 3 is cured, so that the protective layer 114 is combined with the organic light-emitting element 15o, otherwise, it can be attached- The adhesiveness of the separation layer U6 is reduced, so that the attachable-detachable layer can be separated from the auxiliary plate 120 by φ. That is, when ultraviolet rays are irradiated into the uncured bonding material 2 in FIG. 3, the bonding material 112 ′ in FIG. 3 is cured, so that the detachable layer 116 and the protective layer 114 can be combined with the organic light-emitting element 150. . Alternatively, the attachable-detachable layer 116 and the auxiliary plate 120 can be removed from the protective layer 1-4. Therefore, a protective film assembly 160 having an attachable-detachable layer 116, a protective layer 114, and an adhesive layer 112 is formed on the organic light emitting device 15 to complete the flat display device. According to an exemplary embodiment, after the protective layer 114 of 98542.doc -18-200533983 is formed on the auxiliary board 120, the protective film 114 is attached to the organic light emitting element 15 and then self-protected using the attachable-detachable layer 116 The auxiliary board 120 is removed from the layer 114. Therefore, the thermal budget of the organic light emitting element 150 can be reduced, and the permeability of the protective layer ι4 can be reduced. In addition, the protective layer 114 may be formed under an oxygen atmosphere. The auxiliary board 120 can also be used to form a thin film or a touch panel for other flat display devices such as a liquid crystal display (LCD) device, a plasma display panel (PDP) display device, and the like, such as an organic layer, an inorganic layer, and a coating layer. FIG. 7 is a perspective view showing a method of constructing a flat display device according to another exemplary embodiment of the present invention. The flat display device of FIG. 7 is the same as the flat display device of FIGS. 1 to 6 except that it is compressed. Therefore, the same reference numbers will be used in the text to refer to the same or similar parts as those in Figures 丨 to 6 and further explanation will be omitted. 1 to 7, the flat display device includes a main board 100, an organic light emitting element 150, a storage capacitor 103, and a protective film assembly 160. The organic light-emitting element 150 includes a gate electrode insulating layer IOia, an inorganic insulating edge layer 101b, an anode 102, a slope 104, an organic light-emitting layer 106, a switching transistor 107, a driving transistor 109, and A cathode 110. The protective film assembly 160 includes an adhesive layer 112, a protective layer 114, and an attachable-detachable layer 116. The protective film assembly 160 is located on the organic light emitting element 150. Referring to FIG. 7, the main board 100 having the organic light-emitting element 150 and the adhesive layer 110 is combined with the auxiliary board 120 having the attachable-detachable layer 116 and the protective layer 114. Therefore, the adhesive material 112 of FIG. 3 faces Protective layer 114. The bonded plates 100 and 120 are pressed between an upper press 146 and a lower press 144. The upper 98542.doc -19-200533983 press 146 presses the joint plates 100 and 120 in the opposite direction to the down press M4. In this exemplary embodiment, the distance between the outer surfaces of the upper press 146 and the lower press 144 is substantially equal to the sum of the thicknesses of the main board 100, the light emitting element 150, and the auxiliary board 120. Ultraviolet rays are irradiated between the upper and lower presses 146 and 144. Alternatively, the upper press 146 and the lower press 144 can be heated so that the bonding layer 116 and the attachable-detachable layer 12 can be heated. When ultraviolet rays are irradiated into the attachable and irreversible layer 116 and the adhesive material π 2 ', the adhesive material 112 is cured so that the protective layer 114 is combined with the organic light-emitting element 15o. Otherwise, it can be attached_ separable The adhesion of the layer 116 is reduced, so that the attachable / detachable layer 6 is separated from the auxiliary plate 120. The upper press 146 is lowered to separate the auxiliary plate 120 from the attachable-detachable layer 116. Therefore, a protective film assembly 160 having an attachable / detachable layer 116, a protective layer 114, and an adhesive layer 112 is formed on the organic light emitting element 15 to form a flat display device. According to this exemplary embodiment, the use of the upper press 46, the lower press 44, and the auxiliary plate 120 can simplify the manufacturing process of the flat display device. In addition, the image display quality of the flat display device can be improved. FIG. 8 is a cross-sectional view showing a flat display device according to another exemplary embodiment of the present invention. The flat display device of FIG. 8 is the same as the flat display device of FIG. 1 and FIG. 2 except for the auxiliary adhesive layer and the auxiliary plate. Therefore, the same reference numerals will be used in the text to refer to the same or similar parts as those in Fig. 丨 and Fig. 2 and the further explanation will be omitted. 98542.doc > 20-200533983 With reference to FIGS. 1 and 8, the flat display device includes a main board 100, an organic light emitting element 150, a storage capacitor 103, a protective film assembly 162, and an auxiliary board 120. The organic light emitting element 150 includes a gate electrode insulating layer 101a, an inorganic insulating layer 101b, a cathode 110 ′, a slope 104, an organic light emitting layer 106, a switching transistor 107, and a driving transistor. 109 and an anode 102. The cathode 110 'is located on the inorganic insulating layer 10lb and includes a transparent conductive material such as indium tin oxide (ITO), tin oxide (TO), indium zinc oxide (IZ0), ® oxide (Z0), and the like. The anode 102 'is located on the organic light-emitting layer 106 and includes a conductive material, such as a metal. Alternatively, the cathode may be located on the organic light emitting layer and the anode may be located on the inorganic insulating layer and electrically connected to the second drain electrode of the driving transistor. The protective film assembly 162 includes an adhesive layer 112, a protective layer 114, and an auxiliary adhesive layer 118. The protective film assembly 162 is located on the organic light emitting element 150. The bonding layer 112 is located on the anode 102, so that the protective layer U4 is combined with the organic light emitting φ element I50. The bonding layer 112 includes a photo-curable resin or a thermo-curable resin. The protective layer 114 is located on the bonding layer 112 to protect the organic light-emitting element 15 () from foreign impurities or impact on the organic light-emitting element i50. The auxiliary adhesion layer 118 is located on the protective layer 114. The auxiliary adhesion layer 118 includes a photo-curable resin or a heat-curable resin. Use the auxiliary adhesive layer 11 8 to make the auxiliary plate 120 and the protective layer!丨 4 combination. The auxiliary plate 120 includes glass, triethyl cellulose (TAC), polycarbonate (PC), stone test wind (PES), polyethylene terephthalate (pEbutyl), polybenzene 98542 j〇c 21 200533983 Diacid glycol (PEN), polyvinyl alcohol (PVA), polymethyl methacrylate (PMMA), cycloolefin polymer (coP), etc., or a combination thereof. When the light generated by the organic light-emitting element 150 is guided into the auxiliary plate 200, the auxiliary plate 120 has a transparent material and the auxiliary plate 20 is optically isotropic. However, when the light generated by the organic light emitting element 150 is guided into the main board 100, the auxiliary board 120 may have an opaque material. 9 to 12 are sectional views' showing a method of manufacturing a flat display device according to another exemplary embodiment of the present invention. * Referring to FIG. 9, a gate electrode insulating layer 10u, an inorganic insulating layer 10lb, a switching transistor 107, a driving transistor 107, a cathode 110, a slope 104, and an organic light emitting layer are formed on the main board 100. ι〇6 and anode 102, to complete the organic light emitting element 150. An adhesive material having a photo-curable resin is coated on a motherboard having an organic light-emitting element 150. The applied bonding material 122 is not cured. As shown in Fig. 10, a photo-curable material is coated on the auxiliary plate 120, and a protective layer 114 is formed on the coated photo-curable material. Light is irradiated into the coated photo-curable material to cure the photo-curable material, thereby forming an auxiliary adhesion layer 118. Figure 11 and Figure 12 show the combination of a motherboard 100 with an organic light emitting element 150 and an adhesive material 122 'and an auxiliary plate 120 with an auxiliary adhesive layer 118 and a protective layer U4, so that the adhesive material 112 faces the protection. Layer 114. The bonded plates 100 and 120 are pressed between the upper roller 142 and the lower roller 140. Ultraviolet rays are irradiated between the upper roller 142 and the lower roller 140. When ultraviolet rays are applied to the auxiliary adhesive layer 118 and the adhesive material 112, the adhesive material 112, 98542.doc -22- 200533983 is cured to bond the protective layer 114 to the organic light emitting element 15o. Otherwise, the auxiliary adhesive layer 118 The adhesiveness is not changed so that the protective layer 114 is combined with the auxiliary plate 120. Therefore, a protective film assembly 162 having an auxiliary adhesive layer 118, a protective layer 114, and an adhesive layer 112 is formed on the organic light-emitting element 15 so that The plane display is not complete. According to this exemplary embodiment, the flat display device includes an auxiliary plate 120 on the protective layer 114 to protect the organic light emitting element 15 from the impact of water, oxygen, and the outside on the flat display device. In addition, the flat display device manufacturing process Simplified. Fig. 13 is a sectional view showing a flat display device according to another exemplary embodiment of the present invention. The flat display device of FIG. 13 is the same as the flat display device of FIG. I and FIG. 2 except for an adhesive layer. Therefore, the same reference numbers will be used in the text to refer to the same or similar parts as those in Fig. 1 and Fig. 2 and further explanation will be omitted. 1 and 13, the flat display device includes a main board 100, an organic light emitting element 150, a storage capacitor 103, and a protective film assembly 164. The organic light-emitting element 150 includes a gate electrode insulating layer 10u, an inorganic insulating layer 101b, an anode 102, a slope 104, an organic light-emitting layer, "a switching transistor 107, a driving transistor 109, and A cathode. The protective film assembly 164 includes a protective layer 115 and an attachable / detachable layer 116. The protective film assembly 160 is located on the organic light emitting element 150. The protective layer 115 is located on the organic light emitting element 150 to protect the organic The light-emitting element 150 is protected from contamination by impurities from the outside or hitting the organic light-emitting element 150. 98542.doc -23- 200533983. The compliance layer 115 includes a protection part 115 and a second protection part 115b. First protection The portion 115a is located on the organic light emitting element 15 and includes a photo-curable resin or a heat-curable resin. The second protection portion 15b is located on the first protection portion 115a. The second protection layer 115 may include an inorganic protection layer or An organic protective layer. Another option is that the second protective layer n5 may have a multilayer structure having an inorganic protective layer and an organic protective layer. The attachable-detachable layer 116 is located on the protective layer 115. The attachable-separate layer The adhesiveness of the layer 116 can be changed by light, heat or pressure, so it can be attached. The separable layer 116 can be attached or separated. The attachable-detachable layer U6 can include a photoresist. Figures 14 to 17 are cross sections The figure shows a method for manufacturing a flat display device according to another exemplary embodiment of the present invention. Consider FIG. 14 and form a gate electrode insulating layer 10u, an inorganic insulating layer 101b, and a switching transistor 107 on a main board 100. , Driving transistor 109, inorganic insulating layer 101b, anode 102, slope 104, organic light emitting layer 106, and cathode u0 to complete the organic light emitting element 150. Referring to FIG. 15, "Selfa tape" is located on the auxiliary board 120 to form an attachable-detachable layer 116. When light or heat is irradiated into the attachable-detachable layer 1 丨 6, the adhesion of the attachable-detachable layer 116 is reduced, and the attachable-detachable layer 116 is separated from the auxiliary plate 120. An inorganic protective layer and an organic protective layer are formed on the additional separable can layer 116 to form the protective portion 11 5 b. A photo-curable resin was coated on the second protective portion 11 $ 7. Coated photocurable resin U5a, uncured. 98542.doc -24- 200533983 Referring to FIG. 16 and FIG. 17, the main board loo with the organic light-emitting element 150 and the auxiliary board with the photocurable resin 115a, the second protective layer 115b, and the separable layer 116 can be added. 120 is combined so that the organic light emitting element 150 faces the coated photocurable resin 115a. The bonded plates 100 and 120 are pressed between the upper roller 142 and the lower roller 140. Ultraviolet rays are irradiated between the upper roller 142 and the lower roller 140. When ultraviolet rays are irradiated to the attachable-detachable layer 116 and the photocurable resin U5a has been coated, the photocurable resin n5a has been coated and cured, so that the protective layer 115 is combined with the organic light emitting element 150, and vice versa, The adhesion of the attachable / detachable layer 116 is reduced, so that the attachable-detachable layer 116 is separated from the auxiliary plate 120. Therefore, a protective film assembly 164 having an attachable-detachable layer 116 and a protective layer 115 is formed on the organic light emitting element 150 to complete the flat display device. According to this exemplary embodiment, an adhesive layer can be omitted, and the protective layer i 15 can be directly attached to the organic light emitting element 15 to simplify the manufacturing process of the flat display device. FIG. 18 is a sectional view showing a flat display device according to another exemplary embodiment of the present invention. The flat display device of FIG. 18 is the same as the flat display device of FIG. 丨 and FIG. 2 except that a detachable layer and an auxiliary plate can be added. Therefore, the same reference numerals will be used in the text to refer to the same or similar parts as those in Figures 丨 and 2 and the further explanation will be omitted. Referring to Fig. 1 and Fig. 18, the flat display device includes-a main board 100, an organic light emitting element 15G, an i storage capacitor ⑻,-a protective film assembly 166 and 98542.doc -25-200533983 an auxiliary board 120. The organic light emitting element 150 includes a gate electrode insulating layer 101a, an inorganic insulating layer 101b, an anode 102, a slope 104, an organic light emitting layer 106, a switching transistor 107, a driving transistor 10, and a cathode.丨 丨 〇. The compliance film assembly 16 6 includes a protective layer π 4 and an adhesive layer 112. The protective film assembly 166 is located on the organic light emitting element 150. The protective layer 114 is located on the adhesive layer 112 to protect the organic light emitting element 15 from contamination from external impurities or the impact on the organic light emitting element 15. The auxiliary board 120 is located on the protective layer 114, and the auxiliary board 120 contacts the protective layer 114. Alternatively, the auxiliary board 120 may be omitted, and a detachable layer (not shown) may be located on the protective layer 114. . Thereafter, a flat display device according to another exemplary embodiment of the present invention is manufactured as follows. On the main board 100, a gate electrode insulating layer 101a, an inorganic insulating layer 10lb, a switching transistor 107, a driving transistor 109, an anode 102, a slope 10, an organic light emitting layer 106, and a cathode U are formed. The organic light-emitting element 15 is complete. On the main board 100 having the organic light emitting element 150, an adhesive material having a photocurable resin is applied. The applied material (not shown) is not cured. An oxygen cut is deposited on the auxiliary plate 12G_h to form an inorganic protective layer. An epoxy resin with low permeability is coated on the inorganic protective layer to form an organic protective layer. Therefore, a protective layer m with a double-layer structure composed of an inorganic protective layer and an organic protective layer is formed on the auxiliary plate 12G, thereby forming a silk protective layer 114 98542.doc -26- 200533983 at a local temperature, water atmosphere or oxygen atmosphere It does not damage the organic light emitting element 150 as it is formed. In this exemplary embodiment, the protective layer n 4 is formed at a temperature higher than about 200 C to reduce the permeability of the protective layer 114. Alternatively, an organic protective layer may be formed on the auxiliary plate 120, and an inorganic protective layer may be formed on the organic protective layer. The main board iOO with the organic light-emitting element 150 and a bonding material (not shown) is combined with the auxiliary board 120 with the protective layer 114 so that the bonding material (not shown) faces the protective layer 114. The bonded plates 100 and 120 are squeezed between the upper roller 142 and the lower roller 14o as shown in FIG. Ultraviolet rays were irradiated between the upper roller 142 and the lower roller 14o as shown in FIG. When ultraviolet rays are irradiated into the auxiliary bonding layer 118 and the bonding material (not shown), the bonding material (not shown) is cured, so that the protective layer 114 is combined with the organic light-emitting element 150. Therefore, a protective film assembly 66 having a protective layer 114 and an adhesive layer 112 is formed on the organic light emitting element 150 to complete the flat display device. According to the four exemplary embodiments, the protective layer 114 is formed directly on the auxiliary board to simplify the manufacturing process of the flat display device. Fig. 19 is a plan view showing a flat display device according to another exemplary embodiment of the present invention. FIG. 20 is a cross-sectional view taken along the line Π-Π in FIG. 19. Except for the organic layer and auxiliary board, the flat display device of FIG. And FIG. 20 are the same as the flat display of FIG. 1 and FIG. 2 ”, ..., and the clothes. Therefore, the same reference numbers are used in the text to refer to The same or similar parts in Fig. 1 and Fig. 2 are omitted and further explanation is omitted. With reference to Figs. 19 and 20, the flat display device includes a main board and a 98542.doc -27- 200533983 machine. Light-emitting element 150, a synthetic buffer layer u3, and a protective layer IK. The organic light-emitting element 150 includes an electrode insulating layer 10u, an inorganic insulating layer crane, an anode 102, a slope 104, and an organic light-emitting layer. A switching transistor 107 and a driving transistor; [09 and a cathode Η 〇. The switching transistor 107 includes a first source electrode 105c, a first gate electrode 1a, a -th-current drain m05a, and A first-semiconductor layer pattern. The first: the source electrode 105C is electrically connected to the data line I to drive the integrated circuit (not shown) to output the data signal to the first source electrode 10 via the data line W5C. One

The gate electrode 5b is located on the main board _ so that the first gate electrode is electrically connected to the idler line lG5b ', so that the driving integrated circuit outputs the gate voltage to the first gate electrode 105b through the closed electrode line contact. The first drain electrode 101 is separated from the first source electrode 105c. The first semiconductor layer pattern is located between the first drain electrode 105a and the first source electrode 105c. The driving transistor 109 includes a second source electrode 108a, a second gate electrode 108b, a second drain electrode 108 (), and a second semiconductor layer pattern. The second source electrode 108a is electrically connected to the drain voltage line 108a to receive a drain voltage. The second gate electrode 108b is located on the main board 100, and the second gate electrode 10b is electrically connected to the first drain electrode 105a of the switching transistor 107 via an auxiliary contact hole. The second drain electrode 108c is separated from the second source electrode 108a. The second semiconductor layer pattern is located between the second drain electrode 08c and the second source electrode 088. * When the material pressure and gate voltage are applied to the data line i 05c and the gate line 105b ', respectively, the data voltage is applied through the first source electrode 10 电极, the first semiconductor pattern, and the first drain electrode 105a. To the second gate electrode 丨 〇8b. When the data voltage is applied to the second gate electrode 1081, a pass 98542.doc -28-200533983 is formed in the pattern of the second semiconductor layer, so that the drain voltage is applied to the second drain electrode 108c. The gate electrode insulating layer 1Gla electrically insulates the first gate electrode 1G5b, the gate electrode ㈣, and the second gate electrode 108b from the first source electrode 丨 5a, the data line 丨 05c, the first drain electrode 105c, and the second source electrode 1 〇8a, the drain voltage line 108 and the second drain electrode 108c. The gate electrode insulating layer 101a includes a transparent insulating material, such as silicon oxide, silicon nitride, and the like. The inorganic insulating layer 101b is located on the main board 100. The main board 100 has a switching transistor 107 to drive the private crystal 109, a gate line 105b ', a data line 105c, and a drain voltage line 108a. The inorganic insulating layer 10lb includes a contact hole through which the contact hole is first; and the pen electrode is electrically connected to the anode 1. The inorganic insulating layer 101b includes a transparent insulating material, such as oxidized stone and nitrided stone. The second gate electrode 108b partially covers the drain voltage line 108a to form a storage capacitor 103. The storage capacitor 103 maintains a frame-to-frame voltage difference between the anode 102 and the cathode 110. The anode 102 is located in the area defined by the drain voltage line 108 and the gate line 105b1 and the data line 105c 'on the main board 100. The anode 102 includes a conductive material such as a metal. Another option, anode! 〇2 may include a transparent conductive material, such as indium tin oxide (ITO), tin oxide (το), indium oxide (IZO), zinc oxide (ζ〇), and the like. The slope 104 is located on the inorganic insulating layer 101 | 3 having the anode 102 to form a recessed portion in the central portion of the anode 102. The organic light emitting layer 106 is located in a recessed portion formed by the slope 104. The cathode 110 is located on the organic light emitting layer 106 and the slope 104 to receive a common voltage. The cathode 110 includes a transparent conductive material, such as indium tin oxide 98542.doc -29 · 200533983 (ITO), tin oxide (TO), indium oxide (IZ0), oxide rhenium, and the like. The drain voltage applied to the second drain electrode 108c is applied to the anode 102 through the contact hole. Therefore, the current flows to the anode! The organic light-emitting layer 108 flows between 02 and the cathode i0 to generate light in the organic light-emitting layer 108. The synthetic buffer layer 113 includes a plurality of inorganic insulating particles and an organic insulating layer 113a. The inorganic insulating particles U3b are located in the organic layer. The synthetic buffer layer 113 having the inorganic insulating particles 113b and the organic layer ii3a has a lower permeability than the buffer layer without the inorganic insulating particles 113b. The synthetic buffer layer 113 has only about 5% of the inorganic insulating particles 11313. When the synthetic buffer layer 113 has only about 5% of the inorganic insulating particles 113b by volume, the flexibility and adhesion of the synthetic buffer layer 113 will be reduced, so that the synthetic buffer layer 113 can communicate with The organic light emitting element 150 is separated. The inorganic insulating particles 113b include silicon carbide, lithium oxide, magnesium oxide, calcium oxide, silicon oxide, silicon gel, aluminum oxide, titanium oxide, silicon oxynitride, silicon nitride, aluminum nitride, or the like, or a combination thereof. In this exemplary embodiment, the size of each inorganic insulating particle is about 5 nm to about 10 μm. When the size of each inorganic insulating particle is increased, the penetration of the synthetic buffer layer 113 is increased. When the size of each inorganic insulating particle 113b is greater than 104, the synthetic buffer layer 113 has a permeability substantially equal to that of the buffer layer without inorganic insulating particles U3b. When each inorganic insulating particle 113b When the size of the particles 113b is less than about 5 nm, the manufacturing cost of the inorganic insulating particles will greatly increase. Another option is that the size of each inorganic insulating particle may be greater than about 10 μχη or less than about 5 nm. Restrictions, but the following will explain one of the possible reasons why the synthetic buffer layer 113 has a lower permeability than the buffer layer without inorganic insulating particles 113b according to one of the structures of the synthetic buffer layer 98542.doc -30- 200533983 The organic layer 113a has a linear shape or a mesh shape, so the organic layer "M has a plurality of holes. When the inorganic insulating particles 1131) are mixed with the organic layer U3a, the inorganic insulating particles 113b fill the holes of the organic layer 113a, thereby reducing the permeability of the synthetic buffer layer 113. The organic layer 113a has low permeability. Organic layer including epoxy resin, polysiloxane resin, monofluorinated resin, acrylic resin, urethane resin, phenolic resin, polyethylene resin, polypropylene resin, polystyrene resin, polymethacrylic acid An ester resin, a polyurea resin, a polyimide resin, a polymer resin, or the like, or a combination thereof. The permeability of the synthetic buffer layer 113 is determined by the type and number of the inorganic insulating particles, the type of the sun, the type of the organic layer 113a, the thickness of the synthetic buffer layer 113, and the like. The permeability of the 'synthetic buffer layer 113 in this exemplary embodiment is about 0.1 g / m2 days to 100 g / m2 days. The protective layer 114 is located on the synthetic buffer layer 113 to protect the organic light-emitting element 150 from external pollution or impact on the organic light-emitting element 150. The protective layer 114 isolates the organic light emitting layer 106 of the organic light emitting element 150 from water or oxygen, and the protective layer 114 can absorb water. The protective layer 114 includes an inorganic protective layer, an organic protective layer, a hygroscopic layer, etc. or a composite layer having a combination thereof. 21 to 23 are sectional views showing a method of manufacturing a flat display device according to another exemplary embodiment of the present invention. Referring to FIG. 21, a gate electrode insulating layer i0ia, an inorganic 9S542.doc -31-200533983 insulating layer 10lb, a switching transistor 107, a driving transistor 109, an anode 102, a slope 104, an organic layer, and an organic layer are formed on the main board 100. The light emitting layer 106 and the cathode 11 are completed to complete the organic light emitting element 150. Referring to Fig. 22, a synthetic buffer layer 113 having inorganic insulating particles 113b and an organic layer 113a is formed on the organic light emitting element 15o. The material forming the organic layer 113a to form the synthetic buffer layer 113 'is mixed with the inorganic insulating particles 113b. The mixture of the material forming the organic layer 113a and the inorganic insulating particles 113b has fluidity. Alternatively, the mixture of the material forming the organic layer 113a and the inorganic insulating particles 1131) may be heated or irradiated with light, so that the mixture of the material forming the organic layer 113a and the inorganic insulating particles may be fluid. A mixture of a material forming the organic layer U3a and the inorganic insulating particles 113b is coated on the organic light-emitting element 15o. The coated mixture of the material forming the organic layer 113a and the inorganic insulating particles Ub is cured to form a synthetic buffer layer 113. Alternatively, a synthetic buffer layer 113 may be formed on the auxiliary plate 120 shown in FIG. 4 and FIG. 5 so that the synthetic buffer layer 113 can be combined with the organic light emitting element ⑼ through the adhesive layer 112 shown in FIG. 6. Referring to FIG. 23, silicon oxide is deposited on the synthetic buffer layer 113 to form an inorganic hafnium layer 'to form a protective layer 114. Alternatively, an epoxy resin may be coated on the inorganic protective layer to form the protective layer 114. The protective layer 114 is not directly formed on the organic light-emitting element 15 (), but is formed on a synthetic buffer layer. The protective layer 114 can be formed in a still temperature, water atmosphere, or oxygen atmosphere. The protective layer 114 formed below has a lower permeability than the accompanying protective layer formed at a lower temperature. Guarantee of a According to the exemplary embodiment, the flat display device includes a synthetic buffer layer 113 having inorganic particles 98542.doc -32- 200533983 edge particles 113b to protect the organic light-emitting element 15 from contamination from external impurities or against The impact of the organic light emitting element 150. In addition, it will reduce the thermal budget of the organic light emitting element 150. Fig. 24 is a sectional view showing a flat display device according to another exemplary embodiment of the present invention. The flat display device of FIG. 24 is the same as the flat display device of FIGS. 10 and 11 except for a protective layer. Therefore, the same reference numerals will be used in the text to denote the same or similar parts as those in FIG. 10 and FIG. 11 and omits further explanation. 10 and 24, the flat display device includes a main board 100, an organic light emitting element 150, a synthetic buffer layer U3, and a protective layer 115. The organic light emitting element 150 includes a gate electrode insulating layer 10u, an inorganic insulating layer 101b, an anode 102, a slope 104, an organic light emitting layer 106, a switching transistor 107, a driving transistor 109, and a cathode.丨 丨 〇. The synthetic buffer layer 113 is located on the organic light emitting element 150 to protect the organic light emitting element 150 from the heat generated during the formation of the protective layer 115 and the external pollution of the organic light emitting element 150. The synthetic buffer layer 113 includes a plurality of inorganic insulating particles 3b and an organic layer 113a. The inorganic insulating particles 113b are located in the organic layer 113a. The protective layer 115 is located on the synthetic buffer layer 3 to protect the organic light-emitting element 150 from impurities from the outside or to impact the organic light-emitting element 150. The protective layer 115 separates the organic light emitting layer 106 of the organic light emitting element 150 from water or oxygen, and the protective layer 115 can absorb water. The protective layer 115 includes an inorganic protective portion 15c and an organic protective portion 115d located on the inorganic protective portion 115c. Another option is the protective layer 98542.doc -33-200533983 ^ In the example of the 50th century, the inorganic protection and inorganic silica, and the organic protection part 115d includes a cross section of Figures 2 to 28, showing — Q It shows a method for manufacturing a flat display device according to another exemplary embodiment of the present invention. "" Referring to FIG. 25 ′ On the main board 1GG, a gate electrode insulating layer 101a, an inorganic transistor 01b switching transistor 107, a driving transistor 107, and an anode are formed.

102, the slope 104, the organic light emitting layer 106, and the cathode 11 to complete the organic light emitting element 150. > With reference to Fig. 26, a synthetic buffer layer 13 having inorganic insulating particles 113b and an organic layer 113a is formed on the organic light-emitting element 15o.

It may further include a hygroscopic portion 115c including oxidized stone and epoxy resin. Referring to FIG. 27, silicon oxide is deposited on the synthetic buffer layer 113 to form an inorganic protective portion 115c. The inorganic protective portion 115c is not directly formed on the organic light-emitting element 150, but is formed on the synthetic buffer layer n3 so that the inorganic protective portion 115c can be formed under high temperature, water gas or oxygen gas. Alternatively, a moisture-absorbing layer (not shown) may be formed on the inorganic protective portion 115c. Referring to FIG. 28, an epoxy resin is coated on the inorganic protective portion 115c to form an organic protective portion 115d. Therefore, the protective portion 115 having a double-layered structure having an inorganic protective portion 115c and an organic protective portion 115d can be completed. Alternatively, the protective layer 115 may have a multilayer structure having a plurality of inorganic protective portions and organic protective portions. According to this exemplary embodiment, the protective layer 115 includes an inorganic protective portion 115c and an organic protective portion 115d to reduce the permeability of the protective layer 115. Fig. 9 is a sectional view showing a plane display device 98542.doc -34- 200533983, which is another exemplary embodiment of the present invention. The planar baby mask of Fig. 29 is the same as the flat display device of Figs. 10 and 11 except for the protective layer and the synthetic buffer layer. Because, dagger, will be used in the text

The same reference numerals refer to the same or similar parts as those in Fig. 1Q, IS11 and Fig. 11 and omit further explanation. Referring to FIG. 29) and FIG. 29, the flat display device includes a main board ⑽, an organic light emitting element 150, and a synthetic buffer layer 113 ′. The organic light emitting element 150 includes a gate electrode insulating layer 10u, an inorganic insulator

The edge layer 嶋, an anode 102, _ ramp 〇4, an organic light emitting layer ⑽, a switching transistor 107, a driving transistor 109, and a cathode 丨 丨. The synthetic buffer layer ⑴ on the organic light emitting element 150 is used to protect the organic light emitting element 15G from heat generated during the formation of the protective layer 115 and contamination of the organic light emitting element 150 from the outside with impurities. The impurities may be water or oxygen. The synthetic buffer layer 113 includes a plurality of inorganic insulating particles and an organic layer H3a. The inorganic insulating particles 113b are located in the organic layer. In this example, the inorganic insulating particles 3b include stone oxide, and the organic layer 113a protects the epoxy resin. Alternatively, the inorganic insulating particles may include a hygroscopic material, such as inorganic silica, silica, activated carbon, and the like. The synthetic buffer layer 113 is used as a protective layer, so that the flat display device can not cover any outer protective layer. The synthetic buffer layer 1 1 3 is thicker than the synthetic buffer layer 113 shown in FIGS. 10 and 11. 30 to 31 are sectional views showing a method of manufacturing a flat display device according to another exemplary embodiment of the present invention. Referring to FIG. 30, a gate electrode insulating layer 101a, an inorganic 98542.doc -35- 200533983 insulating layer 101b, a switching transistor 107, a driving transistor 10, an anode 102 slope 104, and organic light emitting are formed on a main board 100. Layers and cathodes to complete the organic light emitting element 150. Referring to FIG. 31, a synthetic buffer layer 113 'having an inorganic insulating particle 113b and an organic layer 113a is formed on the organic light emitting element 15o. According to this exemplary embodiment, a synthetic buffer layer 113 is used as a protective layer to simplify the manufacturing process of flat screens and display clothing and reduce the manufacturing cost of flat display devices. 0 According to the present invention, a flat display is formed using an auxiliary board The protective layer of the device to reduce the thermal budget of the organic light emitting element. In addition, the protective layer can be formed at a high temperature to increase the permeability of the protective layer, thereby improving the image display quality of the flat display device. In addition, an attachable-detachable layer can be used as an auxiliary protective layer. Further, the protective layer can be formed under an oxygen atmosphere to reduce the manufacturing cost of the flat display device. In addition, the flat display device includes an organic buffer layer having inorganic insulating particles to protect the organic light-emitting element from impurities from the outside or the impact of the organic light-emitting element, thereby reducing the thermal pre-difference of the organic light-emitting element. . Moreover, the adhesive layer, the separable layer or the protective layer can be omitted, thereby reducing the manufacturing process of the flat display device. The present invention has been described herein with reference to these exemplary embodiments, however, it is apparent that those skilled in the art will readily be able to make various modifications and changes based on the above explanations. Accordingly, this invention includes all such modifications and alterations which fall within the spirit and scope of the appended patent claims. [Brief description of the drawings] 98542.doc -36- 200533983 By referring to these drawings in detail, the above-mentioned and other advantages of the present invention will be more apparent in the exemplary embodiments of the invention. FIG. 1 is a plan view showing a flat display device of an example of a wf wang yoke example of the present invention; FIG. 2 is a cross-sectional view taken along the line W in FIG. 1; an exemplary embodiment is shown in FIGS. 3 to 6 7 is a cross-sectional view showing a method for manufacturing a flat display device according to the present invention; FIG. 7 is a perspective view, JL display + habitat, ..., which is not according to another-exemplary embodiment of the present invention to manufacture a flat display device Method; FIG. 8 is a cross-sectional view of a planar display device showing another example of a steam yoke according to the present invention; FIG. 8 is a cross-sectional view of FIG. 9 to 12 as an example. An example of a method for manufacturing a flat display device; FIG. 13 is a cross-sectional view showing a flat display device according to another embodiment of the present invention, which is only one embodiment; FIG. 14 to 17 are cross-sectional views showing an example according to the present invention. A method for manufacturing a flat display device according to another example of the invention; a flat display device according to one of the exemplary embodiments; FIG. 18 is a cross-sectional view showing another embodiment of the present invention; FIG. 19 is another example of the present invention; One of the examples of the real shellfish J Γ raw shell display Fig. 20 is a cross-sectional view taken along line η_π in Fig. 19; Figs. 21 to 23 are cross-sectional views showing jealousy, "", and "Be" according to another exemplary embodiment of the present invention. A method for manufacturing a flat display device; 98542.doc -37- 200533983 Fig. 24 is a cross-sectional view showing another example of the present invention; Figs. 25 to 28 are cross-sectional views showing another example according to the present invention. Method for manufacturing a flat display device; FIG. 29 is a cross-sectional view showing another embodiment of the present invention; FIG. 30 and FIG. 31 are cross-sectional views. Method for manufacturing a flat display device.

[Description of main component symbols] 100 Main board 101a Gate electrode insulating layer 101b Inorganic insulating layer 102 Anode 102, Anode 103 Storage capacitor 104 Slope 105a First drain electrode 105b First gate electrode 105bf Gate line 105c First source electrode 105cf Data line 106 Organic light emitting layer 107 Switching transistor 108a Second source electrode

Plane display device, example implementation Plane display device, an example example 98542.doc -3ΰ-200533983

108af Drain voltage line 108b Second gate electrode 108c Second drain electrode 109 Driving transistor 110 Cathode 110f Cathode 112 Cathode 112? Bonding material 113 Synthetic buffer layer 113f Synthetic buffer layer 113a Organic insulating layer 113b Inorganic insulating particles 114 Protective layer 115 Protection Layer 115a first protective portion 115af photocurable resin 115b second protective portion 115c inorganic protective portion 115d organic protective portion 116 attachable-detachable layer 118 auxiliary bonding layer 120 auxiliary plate 140 lower roller 142 upper roller 98542.doc- 39- 200533983 144 Down press 146 Up press 150 Organic light emitting element 160 Protective film assembly 162 Protective film assembly 164 Protective film assembly 166 Protective film assembly 98542.doc -40-

Claims (1)

200533983 X. Patent application scope ·· 1 · A flat display device, comprising: a main board;-a second electrode of the electrode, and-located in the section: corresponding to the section to be based on-in the section _ + The current generation of the organic light-emitting layer between the second electrode and the second electrode of the second electrode and the second electrode-organic light-emitting layer of light = formed on the main board through the element; * 3, the organic light-emitting element is located on the organic light-emitting element A protective layer; and a rectifiable layer on the protective layer of the organic light-emitting element, and an additional and detachable layer on the 9 layer. • According to the adhesiveness of the k-plane display device—Qiao Zhao, 8 μ can be added-separable layer change. It can be changed by adding light in the separable layer. 3. The flat display device according to π month term 2 includes a photoresist. ， TW HAI can be attached-separable layer 4. According to the ten-face display device of claim 1, the adhesiveness of Xi Zhongxi is based on this attachable Λ 丁 γ τ 5 Hai can be attached-separable layer I added and separable Fish &amp; evening, w 5. It is changed according to the item 4-9 / dish. Ten faces are not installed, and the middle m.日 0days,-polyester, polyethylene;)% rolling resin, a synthetic rubber or a thermoplastic, 1 including-isocyanate,-acetic acid ...: in 4 can be added-separable layer alcohol, an acrylate 、 一 / 、 said,-polyester, a polyethene rubber. 6 · According to claim 1, the flat display device, Dou Zhongxi # “In the organic light-emitting element — /, the protective layer includes a &lt; brother of the first-protection part and-located in the first place 98542.doc 200533983 The second protection part on the protection part. 7 · According to the request, the flat display device of Jg &amp; member 6, wherein the first protection part is an organic material, and the second protection part includes ::: the protection part includes an inorganic material or one of the protection parts. Mixture. Seven materials, a flat display device according to claim 7, where the organic material is light-curable mistletoe, and the material includes a dagger tree or a heat-curable resin. 9. According to the request! Plane A display device having an adhesive layer between the organic light-emitting element and the protective layer, which is located in combination with the organic light-emitting element. The protective layer is provided. 10. The flat display device according to claim 9, the light-curable resin or a thermal Cured resin. ". The layer includes a flat display device, which includes a main board, an organic light emitting element, and a second i-electrode, which corresponds to the first gate and is located on the first-electrode and The second electrode is used to generate a current based on the current between the first electrode and the second electrode * organic light-emitting layer. _ :: The element is formed on the main board; 彳 U layer, the organic light-emitting: located on the organic A protection layer on the light-emitting element to protect the organic light-emitting element; and 12. an adhesive layer on the protective layer supporting the planar display of the organic light-emitting element and the protective layer light-emitting element according to claim 11. Help board. The device further comprises a protective layer and the organic layer that are located between the protective layer and the organic layer 98542.doc 200533983 1 3 according to claim 11 and further includes an auxiliary board and the protection. X-gates are used between layers to make the protective layer and the auxiliary auxiliary bonding layer. 14. A flat display device comprising: a main board; an organic light emitting element, which includes a first electrode, a second electrode corresponding to the first electrode of the first electrode, and-located in the The gate of the first-electrode and the second-electrode is based on a current flowing between the first-electrode and the second-electrode through the organic light-emitting layer to generate a water-light organic light-emitting layer. The organic light-emitting element is formed on On the main board; χ-a synthetic buffer layer on the organic light-emitting element, which includes an organic layer and a plurality of inorganic insulating particles in the organic layer; and a protection layer hx 位于 on the organic light-emitting element Layer 0 15 · According to the plan display of claim 14, the inorganic insulating particles are included ... The particles all include carbonized carbide, lithium oxide, oxidized town, oxidized office, minus stone, / glue, oxidized oxide, titanium oxide, At least one of oxy-nitrogen cut, nitrided stone cut, gasification cut, or a combination thereof. 16 · According to the plan of claim 14, the plan is to stay in the air — to remove it, not to shoulder it, wherein the size of each of the inorganic insulating particles is about 5 nm to about 10 μm. 1 7 · The flat display is unloaded in accordance with claim 14 ", and the members are not disposed, wherein the organic layer includes an epoxy resin, a polysilica resin, a fluorinated resin, an acrylic resin, and Urethane resin, a secret tree moon purpose, a polyethylene resin, a polypropylene resin, a polystyrene resin, a polyacrylic acid f㈣ 98542.doc 200533983 one less Combination of 18 · Plane display according to claim 14 ", and not broken, wherein the protective layer includes a helmet protective layer, an organic protective sound sheet, or an inorganic protective portion and an organic protective portion Of multiple layers. 19. According to claim 14, the flat display of Qitian. ,,, and other personnel, wherein the protective layer includes an organic _. ^^ Qianbaoli layer with inorganic insulating particles, and the organic protective layer and The β forms a buffer layer. 20 · —A method for manufacturing a flat display garment, the method includes: forming an organic hairpin branch on the main board, first 70 pieces, the organic light-emitting element has a brother and an electrode, —corresponding to the first— Located between the first electrode and the first electrode, and a polar plate of the -electron ...: based on-flowing between the -electrical scare /, Leyi and the innocent electrode ^ L moving through the organic light Layer of organic light-emitting layer; that is, the motor is produced on an auxiliary board to form an attachable-detachable layer; a protective layer is formed on the attachable and detachable layer, so that the organic light-emitting element and the protective layer Combining; and using the attachable-detachable layer from the protective layer 21. According to the method of claim 20, a straight, μ, and auxiliary plate. First, the hunting is combined by the main component and the protective layer in the following manner: The organic light emitting device rotates in two opposite directions to each other corresponding to the auxiliary board of the main board; and &quot; the main board and the A light is radiated between the main board and the auxiliary board. 22. According to the method of claim 20, 1 the organic light emitting hunter combines the 98542.doc 200533983 element with the protective layer by: 1-between the upper press and a god machine corresponding to the upper press Squeeze the main board and the auxiliary board corresponding to the main board; and irradiate the main board with the auxiliary layer and the protective layer with a light. << _ Addition_Releasable 23. According to the method of claim 20, a cohesive layer is formed. Included in the organic light-emitting element 24. According to the method of claim 23, the love element is combined with the protective layer ... The two wheels that rotate the organic light-emitting device in opposite directions from each other correspond to the Auxiliary board; &amp; ^ $ Main board and light-irradiate the main layer and the adhesive layer of the main board and the auxiliary board. Attachment-can be from 25. According to the method of claim 20, it has an additional &quot; separable layer sentence; ^ a lice acid ester, a vinyl acetate resin, a dagger ", the lack of this day, a Polyvinyl alcohol, at least one of-synthetic rubber, an epoxy resin, and propylene. "Ke Yueyue or its group 26. The method according to claim 20, wherein: Forming the protection on the attachable-detachable layer to form a second protection. Forming a first-protection part trowel on the second protection part, and 27. the method according to claim 26, wherein the first-protection part : Organic materials, materials, and the second protective part includes an organic and inorganic material or a mixture thereof 98542.doc 200533983 28. According to the method of claim 27, re-hit the organic pine resin or a heatable Cured resin. Materials include a photo-curable 29.-a kind of flat display device is formed on-the main board-organic hair: components the :: includes: a first electrode, a corresponding-organic light emitting device, side brother _Electrode one is on the first A second electrode and a second electrode, and an encapsulation electrode between the electrode and the second electrode flow through the soil in an organic light-emitting layer in the first electro-optic; the current of the first layer is generated in an auxiliary plate A protective layer is formed on top; and the organic light-emitting element is combined with the protective layer. 30. According to the method of claim 29, the method is repeated—forming an adhesive layer on top of the organic light-emitting element 31. According to the request 29 The method includes repeatedly forming an auxiliary adhesive layer between the auxiliary plate and the companion board. 32. A method for manufacturing a flat display device, the method includes: forming an organic hair on a main board; In the prior art, the organic light-emitting element has a first electrode, a second electrode corresponding to the first electrode, and a second electrode located between the first electrode and the second electrode to be based on a Flow through between the first electrode and the second electrode # 士 ^ The current passing through the organic light-emitting layer generates a light organic light-emitting layer; a synthetic buffer layer is formed on the organic light-emitting element, and the synthetic buffer layerThe layer includes an organic layer and a plurality of inorganic insulating particles located in the organic layer; and forming a 1a, &amp; &amp; ^ Baoda layer on the synthetic buffer layer to protect the organic Luminescence 98542.doc 200533983 The method for forming the composition is 33. The method according to claim 32, wherein the layer is punched by: mixing a material forming the organic layer with the inorganic insulating particles, and heating to form the organic layer A mixture of a material and the inorganic insulating particles; and coating the heated mixture on the organic light emitting element. 98542.doc