KR101007722B1 - Flat Panel Display and Manufacturing Method - Google Patents

Abstract

Disclosed are a flat panel display and a method of manufacturing the same, which improve quality and reduce manufacturing cost. The flat panel display includes a main substrate, an organic light emitting diode, a protective layer, and an adhesive layer. The organic light emitting diode includes a first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to generate light according to the flow of current. It is disposed on the main board. The protective layer is disposed on the organic light emitting device to protect the organic light emitting device. The adhesive layer is disposed on the protective layer. Accordingly, by forming the protective layer using an auxiliary substrate, thermal deformation of the organic light emitting diode is prevented, the protective characteristic of the protective layer is improved, and the manufacturing cost is reduced.

Description

Flat display device and manufacturing method thereof {FLAT DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME}

1 is a plan view illustrating a flat panel display device according to a first exemplary embodiment of the present invention.

2 is a cross-sectional view taken along line AA ′ of FIG. 1.

3A to 3D are cross-sectional views illustrating a method of manufacturing a flat panel display device according to a first embodiment of the present invention.

4 is a perspective view illustrating a method of manufacturing a flat panel display device according to a second embodiment of the present invention.

5 is a cross-sectional view illustrating a flat panel display device according to a third exemplary embodiment of the present invention.

6A to 6D are cross-sectional views illustrating a method of manufacturing a flat panel display device according to a third embodiment of the present invention.

7 is a cross-sectional view illustrating a flat panel display device according to a fourth embodiment of the present invention.

8A to 8D are cross-sectional views illustrating a method of manufacturing a flat panel display device according to a fourth embodiment of the present invention.

9 is a cross-sectional view illustrating a flat panel display device according to a fifth exemplary embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: main board 101a: gate insulating film                 

101b: inorganic insulating film 102: anode electrode

103: storage capacitor 104: bank (Bank)

105a: first drain electrode 105b: first gate electrode

105b ': gate line 105c: first source electrode

105c ': Data line 106: Organic light emitting layer

107: switching transistor 108a: second source electrode

108a ': drain voltage line 108b: second gate electrode

108c: second drain electrode 109: driving transistor

110: cathode electrode 112: adhesive layer

114 and 115: protective layer 116: adhesive layer

118: auxiliary adhesive 120: auxiliary substrate

140: lower roller 142: upper roller

144: lower press 146: upper press

150: organic light emitting device

160, 162, 164, 166: protective film assembly

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display and a method for manufacturing the same. More particularly, the present invention relates to a flat panel display and a method for manufacturing the same.                         

The organic electroluminescent device of an organic electroluminescent display (OELD) includes an anode, a cathode, and an organic luminescent layer. Holes supplied through the anode combine with electrons supplied through the cathode in the emission layer to generate molecules in an excited state. As the molecules in the excited state change into molecules in the ground state, light is generated.

The organic light emitting device has high brightness, wide viewing angle, thinness, low power consumption, and the like. The manufacturing process of the organic light emitting device is simple, so that the manufacturing cost is reduced and the viewing angle is free as an active light emitting device. In addition, when the thickness of the organic light emitting device is thin and the substrate of the organic light emitting device is flexible, a flat panel display device having a flexible property by external force can be manufactured.

However, when the organic light emitting layer of the organic light emitting device is exposed to water or oxygen, the organic light emitting layer easily reacts with water and oxygen, thereby deteriorating electro-chemical properties of the organic light emitting layer. Therefore, in order to isolate the organic light emitting layer from water or oxygen, a closed space or a protective layer for protecting the organic light emitting layer is formed.

A metal can, a glass substrate, or the like is disposed on the organic light emitting device to form the enclosed space. When the organic light emitting layer is disposed in the enclosed space, the manufacturing process of the organic light emitting device is complicated and the manufacturing cost increases. In addition, the thickness of the flat panel display increases due to the enclosed space, thereby reducing the flexibility of the organic light emitting diode.

The protective layer is formed by coating an organic material or depositing an inorganic material. In the case of forming the protective layer, the protective layer is formed at a low temperature to prevent thermal distortion of the organic light emitting diode. The protective layer formed at a low temperature has a lower quality and a higher permeability than the protective layer formed at a high temperature.

In addition, the manufacturing cost of the organic light emitting device increases because the protective layer is to be formed in an environment that is not exposed to water or oxygen.

Although the above has been described with reference to the organic light emitting diode, a person skilled in the art may have the same problem in other flat panel display devices, such as a liquid crystal display (LCD), a plasma flat panel display (PDP), or a touch panel. I can understand that.

SUMMARY OF THE INVENTION A first object of the present invention for solving the above problems is to provide a flat panel display device having improved protection characteristics and reduced manufacturing cost.

It is a second object of the present invention to provide a method for manufacturing the flat panel display.

A flat panel display device according to an embodiment of the present invention for achieving the first object includes a main substrate, an organic light emitting device, a protective layer, and an adhesive layer. The organic light emitting diode includes a first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to generate light according to the flow of current. It is disposed on the main board. The protective layer is disposed on the organic light emitting device to protect the organic light emitting device. The adhesive layer is disposed on the protective layer.

A flat panel display according to another exemplary embodiment of the present invention for achieving the first object includes a main substrate, an organic light emitting diode, a protective layer, and an auxiliary substrate. The organic light emitting diode includes a first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to generate light according to the flow of current. It is disposed on the main board. The protective layer is disposed on the organic light emitting device to protect the organic light emitting device. The auxiliary substrate is disposed on the protective layer.

In the manufacturing method of a flat panel display device according to an embodiment of the present invention to achieve the second object, first, a first electrode, a second electrode facing the first electrode and the first electrode and the first electrode on the main substrate; An organic light emitting diode including an organic light emitting layer disposed between two electrodes to generate light according to the flow of current is formed. Subsequently, an adhesion layer which can be detached is formed on the auxiliary substrate. Thereafter, a protective layer for protecting the organic light emitting device is formed on the adhesive layer. Subsequently, the organic EL device is attached to the protective layer. Finally, the auxiliary substrate is removed from the protective layer using the adhesive layer.

In the method of manufacturing a flat panel display device according to another embodiment of the present invention in order to achieve the second object, the first electrode on the main substrate, the second electrode facing the first electrode and the first electrode and the first An organic light emitting diode including an organic light emitting layer disposed between two electrodes to generate light according to the flow of current is formed. Subsequently, a protective layer is formed on the auxiliary substrate to protect the organic light emitting device. Thereafter, the organic light emitting diode is attached to the protective layer.

The flat panel display device includes an organic light emitting display device. The organic light emitting device includes an active type and a passive type organic light emitting device.

Thus, the protective layer is formed using the auxiliary substrate to prevent thermal deformation of the organic light emitting diode. In addition, the protective layer can be formed at a high temperature, thereby improving the protective characteristics of the protective layer, thereby improving the quality of the flat panel display. Furthermore, the protective layer can be formed in an oxygen atmosphere (Oxygen Atmosphere), thereby reducing the manufacturing cost of the flat panel display.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Example 1

1 is a plan view illustrating a flat panel display device according to a first exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.

1 and 2, the flat panel display includes a main substrate 100, an organic luminescence element 150, and a protection film assembly 160.

The main board 100 may include glass, triacetylcellulose (TAC), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate ( Polyethylenenaphthalate (PEN), Polyvinylalcohol (PVA), Polymethylmethacrylate (PMMA), Cyclo-Olefin Polymer (COP) or combinations thereof and the like.

The organic light emitting diode 150 includes a gate insulating film 101a, an inorganic insulating film 101b, an anode electrode 102, a bank 104, an organic luminescence layer 106, and a switching transistor 107. , A driving transistor 109, and a cathode electrode 110.

The switching transistor 107 includes a first source electrode 105c, a first gate electrode 105b, and a first drain electrode 105a. The first source electrode 105c is electrically connected to the data line 105c 'to receive a data signal output from a driving circuit (not shown). The first gate electrode 105b is disposed on the main board 100 and electrically connected to the gate line 105b 'to receive a gate voltage output from the driving circuit. The first drain electrode 105a is spaced apart from the first source electrode 105c, and a first semiconductor layer pattern (not shown) is formed of the first drain electrode 105a and the first source electrode 105c. ) Is placed between.                     

The driving transistor 109 includes a second source electrode 108a, a second gate electrode 108b, and a second drain electrode 108c. The second source electrode 108a is electrically connected to the drain voltage line 108a 'to receive a drain voltage. The second gate electrode 108b is disposed on the main board 100 and is electrically connected to the first drain electrode 105a of the switching transistor 107 through an auxiliary contact hole. The second drain electrode 108c is disposed to be spaced apart from the second source electrode 108a, and a second semiconductor layer pattern is disposed between the second drain electrode 108c and the second source electrode 108a. do.

When the data voltage and the gate voltage are applied to the data line 105c 'and the gate line 105b', respectively, the data voltage is the first source electrode 105c, the first semiconductor layer pattern, and the first voltage. It is applied to the second gate electrode 108b through the first drain electrode 105a. When the data voltage is applied to the second gate electrode 108b, a channel is formed in the second semiconductor layer pattern, and the drain voltage is applied to the second drain electrode 108c.

The gate insulating layer 101a may include the first gate electrode 105b, the gate line 105b ', and the second gate electrode 108b with the first source electrode 105a, the data line 105c', The first drain electrode 105c, the second source electrode 108a, the drain voltage line 108a ′, and the second drain electrode 108c are electrically insulated from each other. The gate insulating film 101a includes a transparent insulating material such as silicon oxide or silicon nitride.                     

The inorganic insulating layer 101b includes the main substrate on which the switching transistor 107, the driving transistor 109, the gate line 105b ', the data line 105c', and the drain voltage line 108a 'are formed. It is disposed on the 100, and comprises a contact hole (Contact Hole) for electrically connecting the second drain electrode (108c) with the anode electrode (102). The inorganic insulating film 101b includes a transparent insulating material such as silicon oxide or silicon nitride.

A portion of the second gate electrode 108b overlaps with a portion of the drain voltage line 108a 'to form the storage capacitor 103. The storage capacitor 103 maintains the voltage between the anode electrode 102 and the cathode electrode 110 for one frame.

The anode electrode 102 is disposed in an area defined by the drain voltage line 108a ', the gate line 105b', and the data line 105c 'on the main substrate 100. The anode electrode 102 includes a conductive material such as a metal.

The bank 104 is disposed on the inorganic insulating film 101b on which the anode electrode 102 is formed to form a recessed portion in the center of the anode electrode 102.

The organic light emitting layer 106 is formed in the recess formed by the bank 104. In this case, the organic light emitting layer 106 may include Alq3 (tris (8-hydroxy-quinolate) aluminum). The organic light emitting layer 106 includes a red organic light emitting layer, a green organic light emitting layer, and a blue organic light emitting layer. Preferably, the red organic light emitting layer includes impurities such as dichloromethane (DCM), DCJT, DCJTB, and the like. The green organic light emitting layer includes impurities such as Coumarin 6, Quinacridone (Qd), and the like.

The cathode electrode 110 is formed on the organic emission layer 106 and the bank 104, and a common voltage is applied. The cathode electrode 110 includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZO), or the like.

The drain voltage applied to the second drain electrode 108c is applied to the anode electrode 102 through the contact hole. Therefore, a current flows between the anode electrode 102 and the cathode electrode 110 through the organic emission layer 108. In this case, when holes supplied through the anode electrode 102 are coupled to electrons supplied through the cathode electrode 110 in the organic light emitting layer 108, an excited state is formed in the organic light emitting layer 106. State molecules are produced. As the molecules in the excited state change into molecules in the ground state, light is generated.

The protective film assembly 160 includes an adhesive layer 112, a protection layer 114, and an attachable-detachable layer 116, and is disposed on the organic light emitting device 150. do.

The adhesive layer 112 is disposed on the electron transport layer 108 on which the cathode electrode 110 is formed to attach the protective layer 114 to the organic light emitting device 150. The adhesive layer 112 may include a light curable resin or a thermally curable resin. At this time, it is preferable that the photocurable resin includes a resin which cures when ultraviolet rays having a wavelength of 200 nm to 500 nm are irradiated. Moreover, it is preferable that the said thermosetting resin contains resin to harden | cure at the temperature of 25 degreeC-200 degreeC. In this case, the adhesive layer 112 may serve as an auxiliary protective layer that blocks water or oxygen.

Even if the adhesive layer 112 cured by light or heat is again applied with light or heat, the protective layer 114 is not separated from the organic light emitting device 150.

The protective layer 114 is disposed on the entire surface of the adhesive layer 112 to protect the organic light emitting device 150 from impurities or external impact. The protective layer 114 isolates the organic light emitting layer 106 of the organic light emitting device 150 from water or oxygen, and water in the protective layer 114 or in an area adjacent to the protective layer 114. Absorb it.

The protective layer 114 includes an inorganic protective film, an organic protective film, a desiccant, or a composite film in which these are combined.

The inorganic protective film is aluminum (Al), molybdenum (Mo), titanium (Ti), chromium (Cr), gold (Ag), silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), magnesium oxide (MgO), aluminum oxide (AlOx), aluminum nitride (AlNx), titanium oxide (TiOx) or combinations thereof. The organic protective film includes a polymer resin, parylene, or the like.                     

The polymer resin has a low permeability of epoxy, silicon, fluorine resin, acrylic resin, urethane resin, phenolic resin, and polyethylene. (Polyethylene), Polypropylene, Polystyrene, Polymethyl Methacrylate, Polyurea, Polyimide or combinations thereof.

The desiccant includes inorganic silica (Inorganic Silica), silicon carbide (SiC), activated carbon or a combination thereof.

The adhesive layer 116 is disposed on the entire surface of the protective layer 114. The adhesive layer 116 includes an adhesive capable of attaching and detaching by changing an adhesive force according to changes in light, heat, pressure, and the like. In this case, when the pressure-sensitive adhesive includes a photoresist, the adhesive force decreases when light is irradiated. In addition, the pressure-sensitive adhesive is an isocyanate, vinyl acetate, polyester (polyester), polyvinyl alcohol, acrylate (Acrylate), synthetic rubber (synthetic rubber) or thermoplastic resin (Thermoplastic Resin) It may also contain synthetic resins. In particular, the adhesive containing the vinyl acetate (Vinyl Acetate Resin) loses the adhesive strength at a temperature of 40 ℃ or more. As a material of the adhesive layer 116, a self tape of Sekisui Co., Ltd. of Japan may be used.

In this case, the adhesive layer 112 and / or the adhesive layer 116 may serve as an auxiliary protection layer that blocks water or oxygen from entering the organic light emitting device 150.

3A to 3D are cross-sectional views illustrating a method of manufacturing a flat panel display device according to a first embodiment of the present invention.

Referring to FIG. 3A, first, a metal is deposited on the main board 100. Subsequently, a portion of the deposited metal is etched to form the first gate electrode 105b, the gate line 105b ′, and the second gate electrode 108b.

Subsequently, a transparent insulating material is deposited on the main substrate 100 on which the first gate electrode 105b, the gate line 105b ′, and the second gate electrode 108b are formed. Subsequently, a portion of the deposited transparent insulating material is etched to form the gate insulating film 101a having the auxiliary contact hole electrically connecting the first drain electrode 105a to the second gate electrode 108b. .

Subsequently, an amorphous silicon pattern and an N + amorphous silicon pattern are formed on the gate insulating film 101a corresponding to the first gate electrode 105b and the second gate electrode 108b to form the first semiconductor layer pattern and the A second semiconductor layer pattern is formed.

Subsequently, a metal is deposited on the gate insulating film 101a on which the first semiconductor layer pattern and the second semiconductor layer pattern are formed. Subsequently, a portion of the deposited metal is etched to form the first source electrode 105c, the data line 105c ′, the first drain electrode 105a, the second source electrode 108a, and the drain voltage line. 108a ', the second drain electrode 108c, and the storage capacitor 103 are formed. Accordingly, the switching transistor 107 having the first source electrode 105c, the first gate electrode 105b, the first drain electrode 105a, and the first semiconductor layer pattern on the main substrate 100. And the driving transistor 109 having the second source electrode 108c, the second gate electrode 108b, the second drain electrode 108a, and the second semiconductor layer pattern.

Thereafter, the switching transistor 107, the driving transistor 109, the gate line 105b ', the data line 105c', and the drain voltage line 108a 'are formed on the main substrate 100. Deposit a transparent insulating material. Subsequently, the deposited insulating material is etched to form the inorganic insulating film 101b having the contact hole exposing a portion of the second drain electrode 108c.

Subsequently, a metal is deposited on the inorganic insulating film 101b. Thereafter, a portion of the deposited metal is etched to form the anode electrode 102. The anode electrode 102 is electrically connected to the second drain electrode 108c through the contact hole.

Subsequently, an organic material including a photoresist is applied onto the inorganic insulating film 101b on which the anode electrode 102 is formed. Subsequently, a part of the applied organic material is removed through a photographic process to form the bank 104 having the recess. The photographic process includes an exposure step and a developing step.

Thereafter, the organic light emitting layer 106 is formed by dropping an organic light emitting material into the recess using an ink jet method.

Subsequently, a transparent insulating material is deposited on the organic light emitting layer 106 and the bank 104 to form the cathode electrode 110.

Therefore, the gate insulating film 101a, the inorganic insulating film 101b, the anode electrode 102, the bank 104, the organic luminescence layer 106, the switching transistor 107, The organic light emitting diode 150 including the driving transistor 109 and the cathode electrode 110 is formed.

Subsequently, an adhesive material including a photocurable resin is coated on the entire surface of the main substrate 100 on which the organic light emitting diode 150 is formed. The applied adhesive material 112 ′ is non-solidified. In this case, after the protective layer 114 is formed, the adhesive material may be applied onto the protective layer 114 without applying the adhesive material on the organic light emitting device 150.

Referring to FIG. 3B, the adhesive layer 116 is formed by disposing the self tape on the entire surface of the auxiliary substrate 120.

The auxiliary substrate 120 preferably has flexibility. The auxiliary substrate 120 includes glass, conductors, ceramics, triacetylcellulose (TAC), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate ( Polyethyleneterephthalate (PET), Polyethylenenaphthalate (PEN), Polyvinylalcohol (PVA), Polymethylmethacrylate (PMMA), Cyclo-Olefin Polymer (COP) or combinations thereof It includes. The auxiliary substrate 120 is preferably good thermal conductivity.

When light or heat is applied to the adhesive layer 116, the adhesion strength of the adhesive layer 116 is lowered and the adhesive layer 116 is separated from the auxiliary substrate 120.

Subsequently, silicon oxide (SiOx) is deposited on the entire surface of the adhesive layer 116 to form the inorganic protective film. Subsequently, an epoxy having a small moisture permeability is coated on the entire surface of the inorganic protective film to form the organic protective film. Thus, the protective layer 114 including the inorganic protective film and the organic protective film is formed. In this case, the protective layer 114 is formed on the adhesive layer 116 of the auxiliary substrate 120 without directly forming the protective layer 114 on the organic light emitting device 150. It can be formed at high temperatures or in environments with water or oxygen. Therefore, the deposition process of the inorganic protective film or the coating process of the organic protective film may be performed at a high temperature of 200 ° C. or more to form a high-quality protective film having low water permeability. In this case, the inorganic protective film may be formed on the organic protective film.

3C and 3D, the main substrate 100 on which the adhesive material 112 ′ and the organic light emitting diode 150 are formed, the protective layer 114, and the adhesive layer 116 are formed. The auxiliary substrate 120 is compressed between the upper roller 142 and the lower roller 140 to form the flat panel display device. The upper roller 142 rotates in the opposite direction to the lower roller 140, and the distance between the upper roller 142 and the outer circumferential surface of the lower roller 140 is determined by the thickness of the flat panel display device and the auxiliary substrate ( 120) is equal to the sum of the thicknesses.

In this case, light such as ultraviolet rays is radiated between the upper roller 142 and the lower roller 140. When the light is irradiated onto the adhesive layer 116, the adhesive material 112 ′ is cured so that the protective layer 114 is adhered to the organic light emitting device 150, whereas the adhesive layer 116 Adhesion Strength of the) is lowered so that the adhesive layer 116 is separated from the auxiliary substrate 120. In this case, a part of the adhesive layer 116 may remain on the auxiliary substrate 120. That is, when the light is irradiated to the non-solid adhesive material 112 ', the adhesive material 112' is cured to form the adhesive layer 116 and the protective layer 116. The organic light emitting device 150 is attached to the organic light emitting device 150.

Therefore, the protective film assembly 160 including the adhesive layer 116, the protective layer 114, and the adhesive layer 112 is formed on the organic light emitting diode 150 to form the flat panel display device. do.

According to the present exemplary embodiment as described above, after the protective layer 114 is formed on the auxiliary substrate 120, the protective layer 114 is attached on the organic light emitting device 150 and the adhesive layer The auxiliary substrate 120 is removed using 116. Therefore, thermal deformation of the organic light emitting diode 150 may be prevented, permeability of the protective layer may be reduced, and the protective layer may be formed in an oxygen atmosphere.

In the present embodiment as described above with reference to the organic light emitting device, a person of ordinary skill in the art, such as a flat panel display such as a liquid crystal display (LCD), a plasma flat panel display (PDP) or a touch panel It will be appreciated that a thin film such as an organic layer, an inorganic layer, an overcoating layer, or the like may also be formed using the auxiliary substrate 120.

Example 2

In the present embodiment, the rest of the components except for the crimping method are the same as those of the first embodiment, and thus, detailed descriptions thereof will be omitted.

The flat panel display includes a main substrate 100, an organic luminescence element 150, and a protection film assembly 160.

The organic light emitting diode 150 includes a gate insulating film 101a, an inorganic insulating film 101b, an anode electrode 102, a bank 104, an organic luminescence layer 106, and a switching transistor 107. , A driving transistor 109, and a cathode electrode 110.

The protective film assembly 160 includes an adhesive layer 112, a protection layer 114, and an attachable-detachable layer 116, and is disposed on the organic light emitting device 150. do.

4 is a perspective view illustrating a method of manufacturing a flat panel display device according to a second embodiment of the present invention.

Referring to FIG. 4, the auxiliary substrate 120 on which the adhesive layer 112 and the organic light emitting diode 150 are formed, the protective layer 114, and the adhesive layer 116 are formed. ) Is compressed between the upper press 146 and the lower press 144 to form the flat panel display. The upper press 146 presses against the lower press 144 in a direction opposite to each other, and the distance between the lower surface of the upper press 146 and the upper surface of the lower press 144 is equal to the thickness of the flat panel display device. It is equal to the sum of the thicknesses of the auxiliary substrate 120.

Subsequently, light such as ultraviolet rays is irradiated between the upper press 146 and the lower press 144. In this case, the upper press 146 or the lower press 144 may include a transparent material.

When the light is irradiated onto the adhesive layer 116, the adhesion strength of the adhesive layer 116 is lowered. When the light is irradiated onto the non-solid adhesive material 112 ', the adhesive material 112' is cured to cause the adhesive layer 116 and the protective layer 116 to be It is attached to the organic light emitting device 150.

Thereafter, the upper press 146 and the lower press 144 are depressurized to remove the auxiliary substrate 120 from the adhesive layer 116.

Therefore, the protective film assembly 160 including the adhesive layer 116, the protective layer 114, and the adhesive layer 112 is formed on the organic light emitting diode 150 to form the flat panel display device. do.

According to the present exemplary embodiment as described above, a flat panel display device having excellent characteristics may be easily manufactured using the upper press 146, the lower press 144, and the auxiliary substrate 120.

Example 3

5 is a cross-sectional view illustrating a flat panel display device according to a third exemplary embodiment of the present invention. In the present exemplary embodiment, except that the flat panel display apparatus includes the auxiliary adhesive and the auxiliary substrate, the remaining components are the same as those of the first embodiment, and thus detailed descriptions thereof will be omitted.

Referring to FIG. 5, the flat panel display includes a main substrate 100, an organic luminescence element 150, a protection film assembly 162, and an auxiliary substrate 120. It includes.

The organic light emitting diode 150 includes a gate insulating film 101a, an inorganic insulating film 101b, an anode electrode 102, a bank 104, an organic luminescence layer 106, and a switching transistor 107. , A driving transistor 109, and a cathode electrode 110.

The protective film assembly 160 includes an adhesive layer 112, a protection layer 114, and an auxiliary adhesive layer 118, and is disposed on the organic light emitting device 150. .

The adhesive layer 112 is disposed on the organic light emitting diode 150 to attach the protective layer 114 to the organic light emitting diode 150. The adhesive layer 112 may include a light curable resin or a thermally curable resin.

The protective layer 114 is disposed on the entire surface of the adhesive layer 112 to protect the organic light emitting device 150 from impurities or external impact.

The auxiliary adhesive layer 118 is disposed on the front surface of the protective layer 114. The auxiliary adhesive layer 118 preferably includes the photocurable resin or the thermosetting resin.

The auxiliary substrate 120 is attached to the protective layer 114 through the auxiliary adhesive layer 118. The auxiliary substrate 120 includes glass, conductors, ceramics, triacetylcellulose (TAC), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate ( Polyethyleneterephthalate (PET), Polyethylenenaphthalate (PEN), Polyvinylalcohol (PVA), Polymethylmethacrylate (PMMA), Cyclo-Olefin Polymer (COP) or combinations thereof It includes.

In this case, when the light generated by the organic light emitting diode 150 is guided to the auxiliary substrate 120, the auxiliary substrate 120 includes a transparent material and the auxiliary substrate 120 is optically isotropic. Is preferably. However, when light generated from the organic light emitting diode 150 is directed toward the main substrate 100, the auxiliary substrate 120 may include an opaque material.                     

6A to 6D are cross-sectional views illustrating a method of manufacturing a flat panel display device according to a third embodiment of the present invention.

Referring to FIG. 6A, first, the gate insulating film 101a, the inorganic insulating film 101b, the switching transistor 107, the driving transistor 109, the inorganic insulating film 101b, and the main insulating film 101 on the main substrate 100. An anode 102, the bank 104, the organic emission layer 106, and the cathode electrode 110 are sequentially formed to form the organic light emitting diode 150.

Subsequently, an adhesive material including a photocurable resin is coated on the entire surface of the main substrate 100 on which the organic light emitting diode 150 is formed. The applied adhesive material 112 ′ is non-solidified.

Referring to FIG. 6B, a photocurable resin is coated on the entire surface of the auxiliary substrate 120 and the protective layer 114 is formed on the entire surface of the coated photocurable resin. Subsequently, light is irradiated to the photocurable resin disposed between the auxiliary substrate 120 and the protective layer 114 to cure the photocurable resin and to form the auxiliary adhesive layer 118.

6C and 6D, the main substrate 100 on which the adhesive material 112 ′ and the organic light emitting diode 150 are formed, the protective layer 114, and the auxiliary adhesive layer 118 are formed. The auxiliary substrate 120 is compressed between the upper roller 142 and the lower roller 140 to form the flat panel display device.

At this time, the upper roller 142 and the lower roller 140 is irradiated with light such as ultraviolet rays. When the light is irradiated onto the auxiliary adhesive layer 118, the adhesion strength of the auxiliary adhesive layer 118 does not decrease, so that the auxiliary substrate 120 is not separated from the protective layer 114. When the light is irradiated onto the non-solid adhesive material 112 ', the adhesive material 112' is cured to form the auxiliary substrate 120, the auxiliary adhesive layer 118, and the light. The protective layer 116 is attached to the organic light emitting diode 150.

Accordingly, the protective film assembly 160 including the auxiliary adhesive layer 118, the protective layer 114, and the adhesive layer 112 is formed on the organic light emitting diode 150 to form the flat panel display device. do.

According to the present exemplary embodiment as described above, the flat panel display device includes the auxiliary substrate 120 disposed on the protective layer 114 to protect the organic light emitting diode from water, oxygen, and external shocks. The manufacturing process of the flat panel display device is simplified.

Example 4

7 is a cross-sectional view illustrating a flat panel display device according to a fourth embodiment of the present invention.

In the present exemplary embodiment, except that the adhesive layer is omitted, the other components are the same as those of Embodiment 1, and thus, detailed descriptions thereof will be omitted.

Referring to FIG. 7, the flat panel display includes a main substrate 100, an organic luminescence element 150, and a protection film assembly 164.

The organic light emitting diode 150 includes a gate insulating film 101a, an inorganic insulating film 101b, an anode electrode 102, a bank 104, an organic luminescence layer 106, and a switching transistor 107. , A driving transistor 109, and a cathode electrode 110.

The protective film assembly 164 includes a protection layer 115 and an attachable-detachable layer 116 and is disposed on the organic light emitting device 150.

The protective layer 115 is disposed on the entire surface of the adhesive layer 112 to protect the organic light emitting device 150 from impurities or external impact, and includes a first protective film 115a and a second protective film 115b. .

The first passivation layer 115a is disposed on the organic light emitting diode 150 and includes a photocurable resin or a thermosetting resin. The second passivation layer 115b is disposed on the first passivation layer 115a, and further includes an inorganic passivation layer, an organic passivation layer, or a multilayer film in which the second passivation layer 115b is stacked.

The adhesive layer 116 is disposed on the front surface of the protective layer 115. The adhesive layer 116 includes an adhesive capable of attaching and detaching by changing an adhesive force according to changes in light, heat, pressure, and the like. In this case, the adhesive may include a photoresist.

8A to 8D are cross-sectional views illustrating a method of manufacturing a flat panel display device according to a fourth embodiment of the present invention.

Referring to FIG. 8A, first, the gate insulating film 101a, the inorganic insulating film 101b, the switching transistor 107, the driving transistor 109, the inorganic insulating film 101b, and the main insulating film 101 may be formed on the main substrate 100. The anode 102, the bank 104, the organic emission layer 106, and the cathode electrode 110 are formed to form the organic light emitting diode 150.

Referring to FIG. 8B, the adhesive layer 116 is formed by disposing the self tape on the entire surface of the auxiliary substrate 120. When light or heat is applied to the adhesive layer 116, the adhesion strength of the adhesive layer 116 is lowered so that the adhesive layer 116 is separated from the auxiliary substrate 120.

Subsequently, an inorganic protective film, an organic protective film, or the like is laminated on the adhesive layer 116 to form the second protective film 115b. Next, photocurable resin is apply | coated on the said 2nd protective film 115b. The photocurable resin 115a 'coated on the second protective film 115b is in an uncured state.

8C and 8D, the main substrate 100 on which the organic light emitting diode 150 is formed, the coated photocurable resin 115a ', the second protective film 115b, and the adhesive layer ( The auxiliary substrate 120 having the 116 formed thereon is compressed between the upper roller 142 and the lower roller 140 to form the flat panel display.

In this case, light such as ultraviolet rays is radiated between the upper roller 142 and the lower roller 140. When the light is irradiated onto the adhesive layer 116, the photocurable resin 115a ′ coated on the second passivation layer 115b is cured so that the second passivation layer 115b is the organic light emitting device 150. On the other hand, the adhesion strength of the adhesive layer 116 is lowered so that the adhesive layer 116 is separated from the auxiliary substrate 120.

Therefore, the protective film assembly 164 including the adhesive layer 116 and the protective layer 115 is formed on the organic light emitting diode 150 to form the flat panel display device.

According to the present embodiment as described above, the adhesive layer 112 is omitted and the protective layer 115 is attached to the organic light emitting device 150 using the organic protective film 115a, thereby simplifying the process.

Example 5

9 is a cross-sectional view illustrating a flat panel display device according to a fifth exemplary embodiment of the present invention.

In the present embodiment, except for the adhesive layer and the auxiliary substrate, the remaining components are the same as in Example 1, and thus detailed descriptions thereof will be omitted.

9, the flat panel display includes a main substrate 100, an organic luminescence element 150, a protection film assembly 166, and an auxiliary substrate 120. It includes.

The organic light emitting diode 150 includes a gate insulating film 101a, an inorganic insulating film 101b, an anode electrode 102, a bank 104, an organic luminescence layer 106, and a switching transistor 107. , A driving transistor 109, and a cathode electrode 110.                     

The protective film assembly 166 includes a protection layer 114 and an adhesive layer 112 and is disposed on the organic light emitting device 150.

The protective layer 114 is disposed on the entire surface of the adhesive layer 112 to protect the organic light emitting device 150 from impurities or external impact.

The auxiliary substrate 120 is disposed on the front surface of the protective layer 114. That is, the protective layer 114 is directly attached to the auxiliary substrate 120.

In this case, the flat panel display may include an adhesive layer 116 instead of the auxiliary substrate 120.

A method of manufacturing a flat panel display device according to a fifth embodiment of the present invention is as follows.

First, the gate insulating film 101a, the inorganic insulating film 101b, the switching transistor 107, the driving transistor 109, the inorganic insulating film 101b, the anode electrode 102, on the main substrate 100. The bank 104, the organic light emitting layer 106, and the cathode electrode 110 are formed to form the organic light emitting device 150.

Subsequently, an adhesive material including a photocurable resin is coated on the entire surface of the main substrate 100 on which the organic light emitting diode 150 is formed. The applied adhesive material 112 ′ is non-solidified.

Thereafter, silicon oxide (SiOx) is deposited on the entire surface of the auxiliary substrate 120 to form the inorganic protective layer. Subsequently, an epoxy having a small moisture permeability is coated on the entire surface of the inorganic protective film to form the organic protective film. Thus, the protective layer 114 including the inorganic protective film and the organic protective film is formed. In this case, since the protective layer 114 is not directly formed on the organic light emitting diode 150, but is formed on the auxiliary substrate 120, the protective layer 114 is formed at a high temperature, or water or oxygen is formed. It can be formed in the environment. Therefore, the deposition process of the inorganic protective film or the coating process of the organic protective film may be performed at a high temperature of 200 ° C. or more to form a high-quality protective film having low water permeability. In this case, the organic passivation layer may be first formed on the auxiliary substrate 120, and the inorganic passivation layer may be formed on the organic passivation layer.

Subsequently, an upper roller 142 and a lower roller may be formed on the main substrate 100 on which the adhesive material 112 ′ and the organic light emitting diode 150 are formed, and the auxiliary substrate 120 on which the protective layer 114 is formed. Compression is performed between the 140 to form the flat panel display. In this case, light such as ultraviolet rays is radiated between the upper roller 142 and the lower roller 140. That is, when the light is irradiated onto the non-solid adhesive material 112 ′, the adhesive material 112 ′ is cured so that the protective layer 116 is the organic light emitting device ( 150).

Accordingly, the protective film assembly 160 including the protective layer 114 and the adhesive layer 112 is formed on the organic light emitting device 150 to form the flat panel display device.

According to the present embodiment as described above, the protective layer 114 is directly formed on the auxiliary substrate 120 to simplify the manufacturing process.

According to the present invention as described above, by forming the protective layer using the auxiliary substrate, the thermal deformation of the organic light emitting device can be prevented and the protective layer can be formed at a high temperature to improve the protective properties of the protective layer Thus, the quality of the flat panel display device is improved. In this case, the adhesive layer and / or the adhesive layer may serve as an auxiliary protective layer.

In addition, the protective layer can be formed in an oxygen atmosphere (Oxygen Atmosphere), thereby reducing the manufacturing cost of the flat panel display.

Furthermore, the manufacturing process is simplified by omitting the adhesive layer and / or the adhesive layer disposed between the organic light emitting element and the protective layer.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

Claims (25)

Main Substrate; A first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to generate light according to the flow of current, and disposed on the main substrate. Organic EL device; A protective layer disposed on the organic light emitting device to protect the organic light emitting device; And A flat panel display device comprising an attachable-detachable layer disposed on the protective layer. The flat panel display of claim 1, wherein the adhesive layer changes its adhesive force when light is irradiated. The flat panel display of claim 2, wherein the adhesive layer comprises a photoresist. The flat panel display of claim 1, wherein the adhesive layer varies in adhesion with temperature. The method of claim 4, wherein the adhesive layer isocyanate, vinyl acetate, polyester, polyvinyl alcohol, acrylate, synthetic rubber or thermoplastic A flat panel display comprising a resin (Thermoplastic Resin). The flat panel display of claim 1, wherein the passivation layer further comprises a first passivation layer disposed on the organic light emitting element and a second passivation layer disposed on the first passivation layer. The flat panel display of claim 6, wherein the first passivation layer is an organic passivation layer, and the second passivation layer is an organic passivation layer, an inorganic passivation layer, or a combination layer of the combinations thereof. The flat panel display of claim 7, wherein the organic protective film comprises a photocurable resin or a resin whose properties are changed by heat. The flat panel display of claim 1, further comprising an adhesive layer disposed between the organic light emitting device and the protective layer to attach the protective layer to the organic light emitting device. The flat panel display of claim 9, wherein the adhesive layer comprises a photocurable resin or a thermosetting resin. Main Substrate; A first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to generate light according to the flow of current, and disposed on the main substrate. Organic EL device; A protective layer disposed on the organic light emitting device to protect the organic light emitting device; An adhesive layer disposed between the organic light emitting device and the protective layer to attach the protective layer to the organic light emitting device; And And a sub substrate disposed on the protective layer. delete The flat panel display of claim 11, further comprising an auxiliary adhesive layer disposed between the auxiliary substrate and the protective layer to attach the protective layer to the auxiliary substrate. Organic electroluminescence comprising a first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode on the main substrate to generate light according to the flow of current Forming a device; Forming a detachable adhesive layer on the auxiliary substrate; Forming a protective layer protecting the organic light emitting device on the adhesive layer; Attaching the organic light emitting device to the protective layer; And And removing the auxiliary substrate from the protective layer by using the adhesive layer. The method of claim 14, wherein attaching the organic light emitting device to the protective layer comprises: Pressing the main substrate and the auxiliary substrate disposed opposite the main substrate between two rollers rotating in opposite directions; And And irradiating light between the main substrate and the auxiliary substrate. The method of claim 14, wherein attaching the organic light emitting device to the protective layer comprises: Pressing the main substrate and the auxiliary substrate disposed opposite the main substrate between the upper press and the lower press; And And irradiating light between the main substrate and the auxiliary substrate. The method of claim 14, further comprising forming an adhesive layer on the organic light emitting device. The method of claim 17, wherein attaching the organic light emitting device to the protective layer comprises: Pressing the main substrate and the auxiliary substrate disposed opposite the main substrate between two rollers rotating in opposite directions; And And irradiating light between the main substrate and the auxiliary substrate. The method of claim 14, wherein the adhesive layer is photoresist, isocyanate, vinyl acetate, polyester, polyvinyl alcohol, acrylate, synthetic rubber ) Or a thermoplastic resin (Thermoplastic Resin) manufacturing method of a flat panel display device. The method of claim 14, wherein forming the protective layer, Forming a second passivation layer on the adhesive layer; And And forming a first passivation layer on the second passivation layer. 21. The method of claim 20, wherein the first passivation layer is an organic passivation layer, and the second passivation layer is an organic passivation layer, an inorganic passivation layer, or a composite layer combining them. The method of claim 21, wherein the organic protective film comprises a photocurable resin or a resin whose properties are changed by heat. An organic light emitting device comprising a first electrode, a second electrode facing the first electrode, and an organic light emitting layer disposed between the first electrode and the second electrode to generate light according to the flow of current on a main board Forming a; Forming a protective layer on the auxiliary substrate to protect the organic light emitting device; And And attaching the organic light emitting element to the protective layer. The method of claim 23, further comprising forming an adhesive layer on the organic light emitting device. The method of claim 23, further comprising forming an auxiliary adhesive layer between the auxiliary substrate and the protective layer.

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