TW200524104A - Package structure and package method for semiconductor sensor chip - Google Patents

Abstract

The invention provides a package structure and package method for semiconductor sensor chip. The invented method comprises installing a sensor chip on a substrate to expose the sensing area; installing a frame with an opening window on the substrate to frame the sensor chip and expose the sensing area from the opening window; and connecting electricity between the sensor chip and substrate and covering the electric connecting structure by package glue. Therefore, the invention provides a simple, rapid and high yield process for packaging sensor chip. It can achieve the effect of high quality and low price. The invention has the advantage of operating simply and integrating the module easily.

Description

200524104

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to the packaging of a semiconductor wafer, and more particularly to a packaging structure and a packaging method for a fingerprint sensing wafer having an exposed area, wherein the wafer-type fingerprint of the present invention There are many principles of sensor sensing, such as the capacitive type and pressure type disclosed by Zheng San et al. In the following patent applications: 2 thermal induction types: 1. • Republic of China Patent Application No. 0911〇68〇6, application The name of the invention is April 3, 2002, and the name of the invention is "capacitive fingerprint reading chip." 2. The Republic of China Invention Patent Application No. 091111〇443, and the name of the invention was May 17, 2002. "Pressure fingerprint reading chip = its manufacturing method"; 3. Republic of China invention patent application number 090113755, application date 200 July 1, 2001, the invention name is "Design of temperature difference induction fingerprint recognition chip", temporarily Quasi-patent; and 4. The Republic of China invention patent application number 091118142, the application date is August 13, 2002, the invention name is "capacitive pressure micro-sensing element and its fingerprint reader chip surname ... [first Art. " According to the above, the sensor chip manufactured by semiconductor technology must be appropriately packaged to provide protection, support, fixed wiring and manufacture of modular field structure. The sensing chip is usually provided with an exposed area to sense the information from the source under test. '' Taking fingerprint sensing chip as an example, the conventional fingerprint sensing chip usually uses lead frame packaging technology to achieve the packaging purpose. The lead frame assembly process usually includes the steps of die cutting, die ′, bond on the lead frame, wire bonding, mold, trimming, etc. I got a good sensing. V. Description of the invention (2) Chip package 'This sensing chip packaging system J: i use surface bonding technology or through-hole technology, and its: and: j-circuit board' In order to get the second-layer structure :: pieces:. Inside pieces of sub-products such as mobile phones, personal digital assistants (pda), etc. Zero group = m, but the chip packaging technology has an overall depression in the Lei Zaokou 々k Μ βπ The heart-shaped sensor that is installed with Fancheng is usually made into a rugged style, which is not conducive to the sensing operation. Furthermore, once the Japanese film is damaged or fails, the entire module must be replaced. The present invention is directed to the above-mentioned problems, and proposes a packaging structure of a half-body sensing chip and a packaging method thereof. [Summary of the Invention] The main purpose of encapsulation is to provide the advantages of a semiconductor sensing chip. , .. and its packaging method, with process materials, fast and productive The high module i further provides a high-quality and inexpensive sensor chip package. Another object of the present invention is to provide a sensor chip package for assembling with a product housing. Flat watch and integrated structure without depressions for easy sensing operation. ^ Another object of the invention is to make the sensor crystal 2 package structure and the electronic device installed have modules by the design of the frame. It has the advantages of volume, overall shape, and beauty. ^ ^ In order to achieve the above purpose, the present invention is to set a sensing chip on a soil plate and form an electrical connection with the substrate to expose the sensing chip. 、 Explanation of invention (3) " " " A zone 'sets the frame on the substrate, and the frame system has an opening window corresponding to the sensing area, so that the sensing chip is framed by the frame and the The sensing area is exposed from the opening window. ~ The detailed description below with specific examples and accompanying drawings will make it easier to understand the purpose, technical content, features, and effects of the present invention. [Embodiments ] $ Cap The figure shows the first schematic diagram of the semiconductor sensor chip package structure of the present invention. A sensor chip package structure 1 includes a substrate, preferably a printed circuit board 10, and a printed circuit board 10 A sensing chip 11 is mounted on the first surface and exposes its sensing area 丨 i 2 to sense information from a source under test. The sensing chip 11 usually passes through a plurality of leads (not shown) and a printed circuit. The board 10 forms an electrical connection and is covered with an encapsulating gel 13 on the outside of the electrical connection structure; a frame 12 is stuck on the printed circuit board 10, and an opening 122 corresponding to the sensing area 112 is opened. The chip 11 is framed and fixed, and the image sensing area 1 丨 2 is exposed from the open window 丨 22. As shown in the second figure, it is a side view of the frame. The frame 12 includes an outer frame. Frame, and is located at the edge of the corresponding sensing area 11 2 and is provided with a barrier bar 丨 24 to separate the packaging gel 1 3 々 Please refer to the third figure again, which is the above-mentioned sensing chip packaging structure i = One side front view, a connector book is provided on the second side of the printed circuit board 10 to provide mounting The removable flat cable (flat cable) 2, = often a flexible flat electrical helmet 'for further use of the flat mirror 2 so that the electrical sensing said sheet s package 1 is mounted in an electronic device electrically connected thereto; other

200524104

In addition, a second chip 15 can be installed on the second side of the printed circuit board 10. The user is a signal processing chip, which is connected to the sensing signal to process the signal sensed by the sensing chip. The four corners of the printed circuit board 10 are provided with four contact areas. Usually, they are metal layers to guide the living body such as a finger when the four corners of the printed circuit board 10 are brushed, and each has a positioning hole 17, The housing of the device is assembled together. ^ ^

Therefore, by using the printed circuit board 丨 0 as the sensing chip, the beauty of the board can be provided with a connector on the lower surface of the printed circuit board, and a cable can be used to damage the sensing chip. When it fails, the chip package structure 1 is sensed without changing the entire module as is customary, which is more convenient to use. In addition, the signal processing IC can be integrated on the printed circuit board 10 to provide a Easy to integrate packaging structure.

After understanding the package structure of the present invention, the manufacturing process and steps of the present invention for manufacturing the sensor chip package structure i will now be described with reference to the structure shown in the above-mentioned figure. Please refer to FIGS. 4A to 4B. As shown. First, as shown in the fourth A diagram, a substrate is provided. A printed circuit board 10 is commonly used. A plurality of conductive contacts 丨 8 have been provided near the outside of the printed circuit board 10, and four corners are provided. The connection area 16 and the positioning hole 17; then, as shown in the fourth figure B, a sensing chip 11 is adhered on the printed circuit board 10 and the sensing area 1 12 is exposed, wherein the sensing chip 11 is on A pad 18 corresponding to the conductive contacts 18 is provided on one side adjacent to the conductive contacts 丨 8. After the sensing plate 11 is installed, as shown in the fourth figure C, There are two windows 丨 2 2, 126 The frame 12 is installed on the printed circuit board 10, and the frame 12 is usually a card

200524104 V. Description of the invention (5) The design method is assembled with the printed circuit board 10 to use the frame body 12 to frame and fix the sensing chip 1 1 while making the sensing area 11 2 and the conductive contact 丨 8 The solder pads 18 'are exposed from the open windows 122 and 126, respectively; thereafter, a wire bonding step is performed as shown in FIG. 4D to connect the conductive contacts 8 and the solder pads 18' with a plurality of leads 19, so as to enable the sensing chip. 11 is electrically connected to the printed circuit board 10. After the electrical connection between the printed circuit board 10 and the sensing chip 11 is completed, finally, as shown in FIG. 4E, a packaging gel 13 is filled outside the electrical connection structure to cover the leads 19, the conductive contacts 18, and the solder. The pad 18 achieves a protective effect, so that the package completes a sensing chip package structure i. Among them, since the frame 12 is provided with a barrier bar 124, the viscosity of the colloid 13 is controlled during the glue step, and the barrier gel 24 is used to prevent the packaging gel 13 from overflowing to the sensing chip.丨 丨 surface to keep the sensor chip 1 1 clean. This sensing chip package structure i is suitable for components that require a bare chip to sense a red ':: such as a microcomputer sensing element, a fingerprint sensing element, and a wire sensing 7G component. Take the fingerprint sensing element as an example. 'As shown in the fifth figure: Ershi-the inside of the housing 3 of the electronic device is provided with positioning holes ^ clips 30, and the sensor chip packaging structure is assembled. The board housing 3 and the inner card Zen 30 are aligned with the printed circuit. One fixed / one buckle. The sensor chip package structure 1 and the housing 3 are the same color. The design with H = t is the same as that of the housing 3. , And Gu Yi integration, overall shape and beautiful

Page 9 3 After the two are assembled, the surface is formed by two pieces of 1 and the fingerprint 40 of the case. Among them, the following can be added: "to facilitate sensing-finger 4 on 200524104 V. Description of the invention (6) Among them," about referring to the good "# et al. In the following patents, the principle of sensing chips is quite many, such as Zhou Zheng Tri-application type: ι · Capacitive type, pressure type, and thermal sensor disclosed in the application April 3, 2002 ^ National Patent Application No. 091 1 06806, the application date is the Republic of China Invention Patent; the name is "Capacitive "Fingerprint reading chip"; 2. The next day, the invention name is case number 0091 1 1 0443, and the application is named May 2002 Act; 3. The Republic of China / Likui-type fingerprint reading chip and its manufacturer 20 ( July 6, 1991 / Λ Ming patent "Application No. 0909113755, the design day of the application date is the name of the temperature sensing micro-sensing fingerprint sensor chip pressure micro-sensing element and its: 2 years 22: 3: name • It is called "capacitive type to repeat it. 〃The private pattern read chip structure of the application", so here is not to sense the chip package structure i can be assembled in various electronics such as pen drives, personal digital processors (PDA) and mobile phones, etc. : Therefore, in the present invention, a sensing chip is mounted on a circuit substrate, and the board is framed. Sensing chip and making the sensing area self-method have the advantages of simple, fast and high yield. Equipped = no fingerprint sensor is recessed, it is easier to operate. Therefore, the chip packaging structure can achieve high quality at the same time. The price is cheap and easy, and it can effectively overcome the shortcomings of the conventional technology. The above description explains the features of the present invention through the examples, so that those skilled in the art can understand the content of the present invention and base it on the facts. ; Not limited to 200524104 V. Description of the invention (7) The patent scope of the present invention is determined, so all other equivalent modifications or modifications made without departing from the spirit disclosed by the present invention should still be included in the scope of patent application described below Description of drawing number: 1 Sensing chip package structure 1 0 Printed circuit board 11 Sensing chip 11 2 Sensing area 122 Open window 126 Open window 14 Connector 16 connection area 1 8 Conductive contact 19 Lead 2 Flat cable 3 shell Body 4 fingers

12 frame 124 barrier bar 13 package gel 15 integrated circuit chip 17 positioning hole 18 ’solder pad 30 card tenon 4 0 fingerprint

Page 11 200524104 Brief Description of the Drawings The first figure is a schematic diagram of the first side of the sensor chip package structure of the present invention. The second figure is a side view of the frame of the present invention. The third figure is a second schematic view of the sensing chip package structure of the present invention. Figures 4A to 4E are schematic diagrams of the structure of each step of packaging the sensing chip according to the present invention. The fifth figure shows the application and use of the sensing chip package structure of the present invention. Figure 0

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Claims (1)

200524104 VI. Scope of patent application1. A packaging structure for a semiconductor sensing wafer, including a substrate; a sensing wafer, which is disposed on the substrate to form an electrical connection with the substrate, and exposes the sensing chip. A measurement area; and a frame body, which is arranged on the substrate and has an opening window corresponding to the sensing area to frame the sensing chip and expose the sensing area from the opening window. 2. The packaging structure of the semiconductor sensing chip according to item 1 of the scope of patent application, wherein the substrate is a printed circuit board. 3. The packaging structure of the semiconductor sensing chip according to item 1 in the scope of patent application, wherein the substrate and the sensing chip are electrically connected with a plurality of leads 4. The semiconductor sensor according to item 1 in the scope of patent application The packaging structure of the test chip further includes an encapsulant, which is an electrical connection structure covering the sensor chip and the substrate. 5. The packaging structure of the semiconductor sensor chip according to item 1 of the scope of the patent application, wherein the frame system includes a frame, and a barrier bar is provided on the frame to limit the packaging gel. 6. The sealing structure of the semiconductor sensor chip according to item 1 of the scope of the patent application, wherein a connector is further provided on the substrate to provide a flat cable for mounting. 7 · The semiconductor sensor chip sealing structure according to item 6 of the scope of the patent application, wherein the connector is provided on the lower surface of the substrate. 8 · Semiconductor sensor chip package as described in the first patent application 200524104 6. The scope of the patent application, an integrated circuit chip is mounted on the substrate, and it forms a signal connection relationship with the sensor chip. 9. The sealed structure of the semiconductor sensor chip as described in item 8 of the scope of the patent application 'The integrated circuit chip is mounted on the lower surface of the substrate. I 0. The sealing structure of the semiconductor sensing wafer according to item 1 of the scope of the patent application, wherein a plurality of positioning holes are further provided on the periphery of the substrate to provide the packaging structure and a casing to be assembled together. II. The packaging structure of the semiconductor sensing chip as described in item 10 of the scope of patent application, which is assembled with the casing to form a flat surface. 1 2. The sealing structure of a semiconductor sensing wafer as described in item i 0 of the patent application scope, wherein the casing is a casing of an electronic device. 1 3. The packaging structure of the semiconductor sensor chip according to item 1 of the scope of the patent application, wherein a plurality of contact areas are further provided on the periphery of the substrate. 14. A method for packaging a semiconductor sensing chip, including the following steps: providing a substrate; mounting a sensing chip on the substrate to expose a sensing area of the sensing chip; and placing a frame with a window A body is mounted on the substrate to frame the sensing chip and expose the sensing area from the opening window; and to electrically connect the sensing chip and the substrate. 15 · The method for packaging a semiconductor sensor chip as described in item 14 of the scope of patent application, wherein the substrate is a printed circuit board. 16 · The method for packaging a semiconductor sensing chip as described in item 4 of the patent application scope, wherein the step of electrically connecting the substrate and the sensing chip is wire bonding Page 14 200524104 VI. Scope of patent application. 17. The sealing of the semiconductor sensing chip as described in item 14 of the scope of the patent application, after Yuan Cheng electrically connects the substrate and the sensing chip, it further includes a step of filling a packaging gel to cover The electrical connection structure of the sensing chip and the substrate. 18 · The method for packaging a semiconductor sensor chip as described in item 17 of the scope of patent application 'wherein' the frame system includes an outer frame, and a barrier bar is provided on the outer frame to limit the encapsulation of the colloid overflow. 1 9 · The method of sealing semiconductor sensing wafers as described in item 14 of the scope of the patent application, after Yuan Cheng electrically connects the substrate and the sensing wafer, it further includes a step of integrating an integrated circuit wafer Mounted on the lower surface of the substrate so that the integrated circuit chip and the sensing chip form a signal connection relationship. 2 〇. The method for packaging a semiconductor sensing chip as described in item 14 of the scope of the patent application, after completing the steps of electrically connecting the substrate and the sensing chip, it further includes a step of connecting the substrate to a casing. Assembled together. Page 15