CN207765433U - A kind of fingerprint sensor of encapsulation - Google Patents
A kind of fingerprint sensor of encapsulation Download PDFInfo
- Publication number
- CN207765433U CN207765433U CN201721840179.7U CN201721840179U CN207765433U CN 207765433 U CN207765433 U CN 207765433U CN 201721840179 U CN201721840179 U CN 201721840179U CN 207765433 U CN207765433 U CN 207765433U
- Authority
- CN
- China
- Prior art keywords
- fingerprint sensor
- circuit board
- flexible circuit
- electrically connected
- conducting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 230000008054 signal transmission Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 25
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 239000011241 protective layer Substances 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 15
- 230000002950 deficient Effects 0.000 abstract description 5
- 230000010354 integration Effects 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 229920000297 Rayon Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
Abstract
The fingerprint sensor of encapsulation, including：Cover board；Fingerprint sensor, front are provided with fingerprint sensing area and the weld pad positioned at fingerprint sensing area periphery, and weld pad is electrically connected to form electric signal transmission access with fingerprint sensing area；The front of the fingerprint sensor is bonded with the back side of the cover board；Conducting wire is located at the back side of cover board and one end and is electrically connected weld pad；Flexible circuit board is located at the back side of fingerprint sensor；Metal wire, one end connect conducting wire, and the other end is electrically connected the flexible circuit board.The utility model is by optimizing fingerprint sensor encapsulating structure, to reduce the packaging process difficulty of fingerprint sensor, ensure meet the needs of encapsulation chip high integration, high stability while package dimension, and the fraction defective caused by fingerprint sensor encapsulation procedure substantially reduces.
Description
Technical field
The utility model belongs to semiconductor packaging, is specifically related to a kind of fingerprint that structure more reasonably encapsulates biography
Sense chip.
Background technology
Fingerprint sensing and identification technology have become person identification and personal information security certification generally uses
Identification technology has been widely used in the multiple fields of personal information identification.With the development consumer electronics of electronic technology
Product Intelligent hardware such as mobile phone, tablet computer, laptop, electronic watch also generally uses fingerprint identification technology,
Internet electronic business, Electronic Finance payment fast development, more exacerbate people and identification and information security wanted
It asks, fingerprint sensing technology can be more widely used.
The continuous miniaturization and multifunction of electronic product, it is desirable that the encapsulation of fingerprint identification technology must satisfy microsize
And high sensitivity, the packaging technology difficulty of fingerprint sensor how is reduced, optimizing the encapsulating structure of fingerprint sensor becomes
The important technology project of this field.On July 21st, 2017, the Chinese patent ZL201621262068.8 of bulletin disclosed a kind of finger
The encapsulating structure of line sensor, it includes cover board；Fingerprint sensor, front are provided with fingerprint sensing area and are located at fingerprint
The weld pad of sensing unit periphery, the weld pad electrically lead to the back side of the fingerprint sensor, the fingerprint sensor
The back side has the first conductive structure being electrically connected with weld pad；It is pasted with the back side of the cover board in the front of the fingerprint sensor
It closes；Flexible circuit board, the back side have the second conductive structure, opening are arranged in the flexible circuit board；The flexible circuit board
Front be bonded with the back side of the cover board, the fingerprint sensor is located in the opening；First conductive structure with
The second conductive structure electrical connection.It is highly integrated to meet electronic product to reduce the package dimension of fingerprint sensor,
The demand of high stability, and improve the stability of fingerprint sensor encapsulation.After the prior art is open by flexible circuit board
Fingerprint sensor merging is wherein packaged, can reduce because thickness caused by flexible circuit board increases, but need
Increase multiple processes during processing procedure, such as etch the groove being electrically connected with weld pad, through-hole on wafer, in fingerprint sensing
Wiring layer, protective layer, insulating layer are produced again in the back side of chip, and flexible circuit board needs to make wafer assembly through-hole etc., this
All considerably increase the process and processing procedure of fingerprint sensor encapsulation, it is also possible to lead to the rising for encapsulating fraction defective.
Utility model content
The utility model provides a kind of simple and practical in structure, and the fingerprint sensor of the high encapsulation of stability passes through
The conductive line structure of fingerprint sensor face side, the complicated conductive structure for reducing the fingerprint sensor back side make, make
The design for the fingerprint sensor that must be encapsulated is more reasonable, stability higher, and encapsulate after thickness meet it is highly integrated
It is required that.
Technical solution used by the utility model is as follows：
A kind of fingerprint sensor of encapsulation, it is characterised in that the fingerprint sensor of the encapsulation includes：
Cover board；
Fingerprint sensor, front are provided with fingerprint sensing and go and the weld pad positioned at fingerprint sensing area periphery, weld pad with
Fingerprint sensing area is electrically connected to form electric signal transmission access；
The front of the fingerprint sensor is bonded with the back side of the cover board；
Conducting wire is located at the back side of cover board and one end and is electrically connected weld pad；
Flexible circuit board is located at the back side of fingerprint sensor；
Metal wire, one end connect conducting wire, and the other end is electrically connected the flexible circuit board.
Concretely, the weld pad is distributed in the two opposing lateral sides in the fingerprint sensing area, and one end of conducting wire is electrically connected
After connecing weld pad, the other end extends to outside the sticking part of fingerprint sensor and the cover board.
In addition, the front and the back side of the fingerprint sensor of the flexible circuit board fit, it is located at fingerprint sensing
The weld pad of area side is electrically connected with one end of the conducting wire, and the other end of conducting wire is electrically connected a metal wire, the metal
The back side of line and flexible circuit board is electrically connected.
Furthermore the front and the back side of the fingerprint sensor of the flexible circuit board fit, and are located at fingerprint sensing
The weld pad of the area other side is electrically connected with one end of the conducting wire, and the other end of conducting wire is electrically connected a metal wire, the gold
The front for belonging to line and flexible circuit board is electrically connected.
In addition to this, the both ends of the conducting wire are respectively set conducting terminal, the conducting terminal of conducting wire one end with
The weld pad is electrically connected, and the conducting terminal of the conducting wire other end is electrically connected the metal wire, the other end of metal wire with
Flexible circuit board is electrically connected.
In one embodiment, there is an insulating layer, the top of conducting wire between the conducting wire and the back side of cover board
A protective layer is covered, the both ends of conducting wire expose to form conducting terminal, and exposed metal is also formed in the flexible circuit board
Pad, a conducting terminal of the conducting wire and the metal gasket of flexible circuit board is electrically connected in the both ends of a metal wire.
In another embodiment, the back side and front of the flexible circuit board are respectively formed the opening of exposing metal pad, described
The other end of metal wire is electrically connected between the opening and the metal gasket.
In one embodiment, plastic packaging layer is formed outside the cover board and flexible circuit board, plastic packaging layer at least coats the conduction
Terminal, fingerprint sensor and metal wire, the one end part of the flexible circuit board is in outside the plastic packaging layer.
Although the fingerprint sensor of the encapsulation is made of cover board, fingerprint sensor, flexible circuit board superposition, but three
Setting is bonded between person, plastic packaging layer and flexible circuit board are supplied to the preferable pressure of fingerprint sensor to carry, therefore plastic packaging layer
Thickness can effectively reduce.The structure and processing procedure of the fingerprint sensor of the encapsulation are simplified, and can effectively reduce deficient manufacturing procedure rate,
Improve production efficiency.
The utility model is further elaborated with reference to the accompanying drawings and detailed description.
Description of the drawings
Fig. 1 is the encapsulating structure schematic diagram of fingerprint sensor in specific embodiment of the present invention；
Fig. 2 a are the structural schematic diagrams that fingerprint sensor forms weld pad in specific embodiment of the present invention；
Fig. 2 b are the structural schematic diagrams that conducting wire is formed in specific embodiment of the present invention cover plate；
Fig. 2 c are to be bonded and formed to be electrically connected between fingerprint sensor and cover board in specific embodiment of the present invention
Structural schematic diagram；
Fig. 2 d are the structural representations that flexible circuit board is bonded with fingerprint sensor in specific embodiment of the present invention
Figure；
Fig. 2 e are that the structure of metal wire connection conducting wire and flexible circuit board is shown in specific embodiment of the present invention
It is intended to.
Specific implementation mode
Specific embodiment of the present utility model is described in detail below in conjunction with attached drawing.But these embodiments are not
Structure that limitation the utility model, those skilled in the art are made according to these embodiments, method or functionally
Change be all contained in the scope of protection of the utility model.
It should be noted that the purpose for providing these attached drawings is to help to understand the embodiments of the present invention, and
It should not be construed as the improper restriction to the utility model.For the sake of becoming apparent from, size as shown in the figure is not necessarily to scale, can
It can make and amplify, reduce or other changes.In addition, the three dimensions ruler of length, width and depth should be included in actual fabrication
It is very little.In addition, structure of the fisrt feature described below on second feature can be formed as straight comprising the first and second features
The embodiment of contact, can also be formed in the embodiment between the first and second features comprising other feature, and such first
May not be to be in direct contact with second feature.
Referring to FIG. 1, Fig. 1 is the encapsulating structure schematic diagram of fingerprint sensor in specific embodiment of the present invention.
The encapsulating structure of fingerprint sensor includes cover board 210, fingerprint sensor 100, flexible circuit board 300 and plastic packaging layer 400.
The back side of cover board 210 and the front of fingerprint sensor 100 fit.The front setting of fingerprint sensor 100
There are fingerprint sensing area 110 and the weld pad 120 positioned at 110 periphery of fingerprint sensing area, weld pad 120 to be electrically connected with fingerprint sensing area 110
Form electric signal transmission access.Weld pad 120 is also electrically connected with the conducting wire 140 positioned at 210 back side of cover board.Concretely, it welds
Pad 120 is distributed in the two opposing lateral sides in the fingerprint sensing area 110, as shown in Figure 1, weld pad 120 is distributed in fingerprint sensing area 110
Arranged on left and right sides.
In this present embodiment, conducting wire 140 is formed in the back side of cover board 210, the back of the body of conducting wire 140 and cover board 210
There is an insulating layer 143, the top of conducting wire 140 to cover a protective layer 141, the both ends of conducting wire expose to be formed between face
Conducting terminal 142 and 145, the conducting terminal 145 and weld pad 120 of 140 one end of conducting wire are by being conductively connected object such as conducting resinl
144 are electrically connected, and 140 other end of conducting wire extends to sticking part outside of the fingerprint sensor 100 with the cover board 210.
Flexible circuit board 300 is located at the back side of fingerprint sensor 100, the i.e. front of flexible circuit board 300 and the finger
The back side of line sensing chip 100 fits.The back side and front of flexible circuit board 300 are respectively formed the opening of exposing metal pad, i.e.,
The 300 positive metal gasket 320 of metal gasket 310 and flexible circuit board at 300 back side of flexible circuit board.As shown in Figure 1, being located at fingerprint
The weld pad 120 in 110 left side of sensing unit is electrically connected with one end of the conducting wire 140, the other end electrical connection of conducting wire 140
One metal wire 330, the metal wire 330 are electrically connected with the metal gasket 310 at 300 backside openings of flexible circuit board；Positioned at fingerprint
110 other side of sensing unit is that the weld pad on right side is electrically connected with one end of corresponding conducting wire, the other end electrical connection of conducting wire
One metal wire 340, the metal wire are electrically connected with the metal gasket 320 at 300 front openings of flexible circuit board.
Plastic packaging layer 400 is formed outside cover board 210 and flexible circuit board 300, plastic packaging layer 400 at least coats the conducting end
Son, fingerprint sensor 100 and metal wire 330,340 realize fixation, insulation and protection to metal wire, flexible circuit board 300
One end part in outside plastic packaging layer 400, facilitate flexible circuit board to be electrically connected with external circuit.
The relatively simple practicality of fingerprint sensor processing procedure that should mutually encapsulate.A is please referred to Fig.2, fingerprint sensor 100 has
There are fingerprint sensing area 110, and the weld pad 120 positioned at fingerprint sensing area periphery.Multiple weld pads line up two row and are located at single fingerprint
The opposite arranged on left and right sides of sensing chip, weld pad 120 are electrically connected to form electric signal transmission access with fingerprint sensing area 110.Yu Benshi
It applies in example, fingerprint sensor without the etch process of progress groove on it, therefore is also not required to after wafer is formed after cutting
The intensity of worrying about fingerprints sensing chip corner is wanted to be affected.
B is please referred to Fig.2, cover board 210 is provided, cover board 210 is the material with high dielectric constant, such as glass or pottery
Porcelain.In present embodiment, cover board is transparent substrates, and the backsize of cover board 210 has black out ink 220.At the back side of cover board 220
Insulating layer 143 is formed, then forms conducting wire 140 on insulating layer 143, ripe RDL works may be used in conducting wire 140
The surface for being distributed in insulating layer 143 of skill selectivity is simultaneously arranged with corresponding weld pad 120.The material of insulating layer 143 can be oxygen
SiClx, silicon nitride, silicon oxynitride or resinae dielectric material.Conducting wire is discontinuous, the corresponding different weld pad of distribution, and that
This insulation.
Then protective layer 141 is formed, protective layer 141 at least covers conducting wire 140, trepanning is arranged on protective layer 141,
The both ends of trepanning exposed conductor lines form conducting terminal 142 and 145.In specific implementation mode, protective layer can be with sense
The anti-solder ink of light characteristic, the trepanning can on the protection layer be formed by exposure imaging technique.
C is please referred to Fig.2, the front of fingerprint sensor 100 is bonded with the back side of cover board 210,120 corresponding lead of weld pad
The conducting terminal of circuit 140 is simultaneously electrically connected.In concrete application, fingerprint sensor by DAF films or is sticked with cover board
Glue laminating is fixed.In present embodiment, by the way that DAF films 130, the front of fingerprint sensor 100 is arranged at the back side of cover board 210
It fits on DAF films 130, ensure that fingerprint sensor is bonded fixed flatness.If using viscose, refer to avoid reducing
The sensitivity of line sensing chip, viscose use the material with high dielectric constant, the dielectric constant of viscose to be greater than or equal to 4.
Such as Fig. 2 d, the front of flexible circuit board 300 is bonded with the back side of fingerprint sensor 100.Flexible PCB 300
With front and the back side relative to each other, the front and back of flexible PCB is respectively formed with the metal gasket 320 of exposure opening
With 310.Conventional electronics adhesion process can be used in the bonding of flexible circuit board and fingerprint sensor.
E is please referred to Fig.2, using routing technique by the conducting terminal of the conducting wire 140 in the left side of fingerprint sensor 100
142 are electrically connected with the metal gasket 310 at 300 back side of flexible circuit board by metal wire 330, are equally passed fingerprint using routing technique
The conducting terminal of the conducting wire on 100 right side of sense chip passes through metal wire electricity with 300 positive metal gasket 320 of flexible circuit board
340 connections.
Finally, plastic packaging layer is formed, plastic packaging layer at least coats the conducting terminal, fingerprint sensor and metal wire, and
The metal pad part of entire conducting wire and flexible circuit board, improves the stability of the encapsulating structure of fingerprint sensor.
Compared to the prior art, fingerprint sensor eliminates etching fluting with being electrically connected for flexible circuit board, punches, soft
Property circuit board openings and complexity fingerprint sensor on form again the process of wiring layer so that entire fingerprint sensor
Encapsulation procedure is more simple and direct and efficient, encapsulates high yield rate, the fraction defective influenced by processing technology is significantly.
The utility model is by optimizing fingerprint sensor encapsulating structure, to reduce the packaging process of fingerprint sensor
Difficulty ensures meet the needs of encapsulation chip high integration, high stability while package dimension, and fingerprint sensor seals
Fraction defective caused by dress processing procedure substantially reduces.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
The boiling narrating mode of a independent technical solution, specification is merely for the sake of clarity, and those skilled in the art should will say
Bright book is arranged as one, and the technical solution of each embodiment can also be by appropriately combined, and forming those skilled in the art can
With the other embodiment of understanding.
Tool of the series of detailed descriptions listed above only for the credible embodiment of the utility model
Body illustrates, they are all to be done without departing from the utility model technical spirit not to limit the scope of protection of the utility model
Equivalent implementations or change should be included within the scope of protection of this utility model.
Claims (8)
1. a kind of fingerprint sensor of encapsulation, it is characterised in that the fingerprint sensor of the encapsulation includes：
Cover board；
Fingerprint sensor, front are provided with fingerprint sensing area and the weld pad positioned at fingerprint sensing area periphery, weld pad and fingerprint
Sensing unit is electrically connected to form electric signal transmission access；
The front of the fingerprint sensor is bonded with the back side of the cover board；
Conducting wire is located at the back side of cover board and one end and is electrically connected weld pad；
Flexible circuit board is located at the back side of fingerprint sensor；
Metal wire, one end connect conducting wire, and the other end is electrically connected the flexible circuit board.
2. the fingerprint sensor of encapsulation according to claim 1, it is characterised in that the weld pad is distributed in the fingerprint
The two opposing lateral sides of sensing unit, conducting wire one end electrical connection weld pad after, the other end extend to fingerprint sensor with it is described
Outside the sticking part of cover board.
3. the fingerprint sensor of encapsulation according to claim 2, it is characterised in that the flexible circuit board front with
The back side of the fingerprint sensor fits, and is electrically connected positioned at the weld pad of fingerprint sensing area side and one end of the conducting wire
It connects, the other end of conducting wire is electrically connected a metal wire, the back side electric connection of the metal wire and flexible circuit board.
4. the fingerprint sensor of encapsulation according to claim 2, it is characterised in that the flexible circuit board front with
The back side of the fingerprint sensor fits, and is located at the weld pad of the fingerprint sensing area other side and one end electricity of the conducting wire
The other end of connection, conducting wire is electrically connected a metal wire, the front electric connection of the metal wire and flexible circuit board.
5. the fingerprint sensor of encapsulation according to claim 3 or 4, it is characterised in that the both ends of the conducting wire point
Conducting terminal is not set, and the conducting terminal of conducting wire one end is electrically connected with the weld pad, the conduction of the conducting wire other end
Terminal is electrically connected the metal wire, and the other end and the flexible circuit board of metal wire are electrically connected.
6. the fingerprint sensor of encapsulation according to claim 1, it is characterised in that the back of the body of the conducting wire and cover board
There is an insulating layer, the top of conducting wire to cover a protective layer between face, the both ends of conducting wire expose to form conducting terminal,
Also exposed metal gasket is formed in the flexible circuit board, the both ends of a metal wire are electrically connected the one of the conducting wire
The metal gasket of conducting terminal and flexible circuit board.
7. the fingerprint sensor of encapsulation according to claim 1, it is characterised in that the back side of the flexible circuit board and
Front is respectively formed the opening of exposing metal pad, and the other end of the metal wire is electrically connected between the opening and the metal gasket
It connects.
8. the fingerprint sensor of encapsulation according to claim 7, it is characterised in that outside the cover board and flexible circuit board
Plastic packaging layer is formed, plastic packaging layer at least coats the conducting terminal, fingerprint sensor and metal wire, and the one of the flexible circuit board
End is located at outside the plastic packaging layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721840179.7U CN207765433U (en) | 2017-12-26 | 2017-12-26 | A kind of fingerprint sensor of encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721840179.7U CN207765433U (en) | 2017-12-26 | 2017-12-26 | A kind of fingerprint sensor of encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207765433U true CN207765433U (en) | 2018-08-24 |
Family
ID=63184565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721840179.7U Withdrawn - After Issue CN207765433U (en) | 2017-12-26 | 2017-12-26 | A kind of fingerprint sensor of encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207765433U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946200A (en) * | 2017-12-26 | 2018-04-20 | 苏州晶方半导体科技股份有限公司 | The method for packing and encapsulation fingerprint sensor of fingerprint sensor |
-
2017
- 2017-12-26 CN CN201721840179.7U patent/CN207765433U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946200A (en) * | 2017-12-26 | 2018-04-20 | 苏州晶方半导体科技股份有限公司 | The method for packing and encapsulation fingerprint sensor of fingerprint sensor |
| CN107946200B (en) * | 2017-12-26 | 2024-08-09 | 苏州晶方半导体科技股份有限公司 | Packaging method of fingerprint sensing chip and packaged fingerprint sensing chip |
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