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TW200516736A - Semiconductor package with heat sink - Google Patents

Semiconductor package with heat sink

Info

Publication number
TW200516736A
TW200516736A TW092130885A TW92130885A TW200516736A TW 200516736 A TW200516736 A TW 200516736A TW 092130885 A TW092130885 A TW 092130885A TW 92130885 A TW92130885 A TW 92130885A TW 200516736 A TW200516736 A TW 200516736A
Authority
TW
Taiwan
Prior art keywords
heat sink
substrate
semiconductor package
bulger
chip
Prior art date
Application number
TW092130885A
Other languages
Chinese (zh)
Other versions
TWI265608B (en
Inventor
Han-Ping Pu
Chin-Te Chen
Wen-Che Lee
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW092130885A priority Critical patent/TWI265608B/en
Publication of TW200516736A publication Critical patent/TW200516736A/en
Application granted granted Critical
Publication of TWI265608B publication Critical patent/TWI265608B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A semiconductor package with a heat sink is proposed, in which at least a chip and the heat sink covering the chip are mounted on a substrate. The heat sink is composed of a planar portion and a supporting portion extending from the periphery of the planar portion, and at least a recessed structure is formed on a surface of the support portion attached to the substrate. In addition, at least a bulger unit is disposed on a surface of the substrate, thereby fixing the heat sink on the substrate with tight fit through a recessed structure and a bulger unit. Thus, the heat sink is fixed stably on the substrate for reducing the cost.
TW092130885A 2003-11-05 2003-11-05 Semiconductor package with heat sink TWI265608B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092130885A TWI265608B (en) 2003-11-05 2003-11-05 Semiconductor package with heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092130885A TWI265608B (en) 2003-11-05 2003-11-05 Semiconductor package with heat sink

Publications (2)

Publication Number Publication Date
TW200516736A true TW200516736A (en) 2005-05-16
TWI265608B TWI265608B (en) 2006-11-01

Family

ID=38122261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092130885A TWI265608B (en) 2003-11-05 2003-11-05 Semiconductor package with heat sink

Country Status (1)

Country Link
TW (1) TWI265608B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928409A (en) * 2014-03-17 2014-07-16 江苏省宜兴电子器件总厂 Integrated circuit inverting welding air impermeability packaging structure
TWI560823B (en) * 2014-12-18 2016-12-01 Qi Ding Technology Qinhuangdao Co Ltd Heat radiation structure, method for making the same, and device using the same
TWI581688B (en) * 2014-11-13 2017-05-01 欣興電子股份有限公司 Embedded component package structure and manufacturing method thereof
TWI705549B (en) * 2019-12-31 2020-09-21 矽品精密工業股份有限公司 Electronic package
TWI708337B (en) * 2018-11-22 2020-10-21 矽品精密工業股份有限公司 Electronic package and manufacturing method thereof and cooling part
TWI709205B (en) * 2015-02-09 2020-11-01 日商安靠科技日本公司 Semiconductor device
CN113066361A (en) * 2021-03-01 2021-07-02 武汉华星光电半导体显示技术有限公司 Flexible display device and preparation method thereof
CN114360380A (en) * 2022-01-04 2022-04-15 奥英光电（苏州）有限公司 a display module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647802B (en) * 2016-07-06 2019-01-11 矽品精密工業股份有限公司 Heat dissipation package structure

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928409A (en) * 2014-03-17 2014-07-16 江苏省宜兴电子器件总厂 Integrated circuit inverting welding air impermeability packaging structure
CN103928409B (en) * 2014-03-17 2017-01-04 江苏省宜兴电子器件总厂 A kind of integrated circuit back-off weldering air-tight packaging structure
TWI581688B (en) * 2014-11-13 2017-05-01 欣興電子股份有限公司 Embedded component package structure and manufacturing method thereof
TWI560823B (en) * 2014-12-18 2016-12-01 Qi Ding Technology Qinhuangdao Co Ltd Heat radiation structure, method for making the same, and device using the same
TWI709205B (en) * 2015-02-09 2020-11-01 日商安靠科技日本公司 Semiconductor device
TWI708337B (en) * 2018-11-22 2020-10-21 矽品精密工業股份有限公司 Electronic package and manufacturing method thereof and cooling part
TWI705549B (en) * 2019-12-31 2020-09-21 矽品精密工業股份有限公司 Electronic package
CN113066361A (en) * 2021-03-01 2021-07-02 武汉华星光电半导体显示技术有限公司 Flexible display device and preparation method thereof
WO2022183560A1 (en) * 2021-03-01 2022-09-09 武汉华星光电半导体显示技术有限公司 Flexible display device and manufacturing method therefor
US12167581B2 (en) 2021-03-01 2024-12-10 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible display device and manufacturing method thereof
CN114360380A (en) * 2022-01-04 2022-04-15 奥英光电（苏州）有限公司 a display module

Also Published As

Publication number Publication date
TWI265608B (en) 2006-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees