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TW200642113A - LED package structure for fixing LED chip and conducting electricity and heat - Google Patents

LED package structure for fixing LED chip and conducting electricity and heat

Info

Publication number
TW200642113A
TW200642113A TW094117182A TW94117182A TW200642113A TW 200642113 A TW200642113 A TW 200642113A TW 094117182 A TW094117182 A TW 094117182A TW 94117182 A TW94117182 A TW 94117182A TW 200642113 A TW200642113 A TW 200642113A
Authority
TW
Taiwan
Prior art keywords
heat
circuit board
chip
package structure
led chip
Prior art date
Application number
TW094117182A
Other languages
Chinese (zh)
Inventor
cong-xin Chen
Original Assignee
Chen jing hao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen jing hao filed Critical Chen jing hao
Priority to TW094117182A priority Critical patent/TW200642113A/en
Publication of TW200642113A publication Critical patent/TW200642113A/en

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

This invention discloses an LED package structure for fixing LED chip and conducting electricity and heat. The structure has a circuit board made of heat-conductive material. The circuit board can be of a flat shape, or at least has a bump shape or multilayered stairs shape. There is at least one supporting area arranged on the circuit board to support the chip and the area. There is at least a pair of electrodes arranged at the edge, surface of the plate, groove, internal layer, or bottom of the circuit board for directly conducting heat via the heat-conductive material, so as to provide the LED chip with circuit connection. Actually, there is at least one hole in the supporting area for containing adhesive to attach and fix one or more chips. The area that does not come into touch with adhesive between the supporting area and the chip can be used as a heat-conductive path.
TW094117182A 2005-05-26 2005-05-26 LED package structure for fixing LED chip and conducting electricity and heat TW200642113A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094117182A TW200642113A (en) 2005-05-26 2005-05-26 LED package structure for fixing LED chip and conducting electricity and heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094117182A TW200642113A (en) 2005-05-26 2005-05-26 LED package structure for fixing LED chip and conducting electricity and heat

Publications (1)

Publication Number Publication Date
TW200642113A true TW200642113A (en) 2006-12-01

Family

ID=57810014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117182A TW200642113A (en) 2005-05-26 2005-05-26 LED package structure for fixing LED chip and conducting electricity and heat

Country Status (1)

Country Link
TW (1) TW200642113A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8236687B2 (en) 2009-11-27 2012-08-07 Industrial Technology Research Institute Die-bonding method of LED chip and LED manufactured by the same
TWI385824B (en) * 2008-04-25 2013-02-11 Advanced Optoelectronic Tech Light source device
TWI566436B (en) * 2011-02-25 2017-01-11 榮創能源科技股份有限公司 Light-emitting diode package structure and light source device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385824B (en) * 2008-04-25 2013-02-11 Advanced Optoelectronic Tech Light source device
US8236687B2 (en) 2009-11-27 2012-08-07 Industrial Technology Research Institute Die-bonding method of LED chip and LED manufactured by the same
TWI566436B (en) * 2011-02-25 2017-01-11 榮創能源科技股份有限公司 Light-emitting diode package structure and light source device

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