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TW200511509A - Photosensitive semiconductor device and method for fabrication the same - Google Patents

Photosensitive semiconductor device and method for fabrication the same

Info

Publication number
TW200511509A
TW200511509A TW092124070A TW92124070A TW200511509A TW 200511509 A TW200511509 A TW 200511509A TW 092124070 A TW092124070 A TW 092124070A TW 92124070 A TW92124070 A TW 92124070A TW 200511509 A TW200511509 A TW 200511509A
Authority
TW
Taiwan
Prior art keywords
opening
tape carrier
semiconductor device
photosensitive
photosensitive semiconductor
Prior art date
Application number
TW092124070A
Other languages
Chinese (zh)
Other versions
TWI241688B (en
Inventor
Chien-Ping Huang
Chih-Ming Huang
Cheng-Hsu Hsiao
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW092124070A priority Critical patent/TWI241688B/en
Publication of TW200511509A publication Critical patent/TW200511509A/en
Application granted granted Critical
Publication of TWI241688B publication Critical patent/TWI241688B/en

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)

Abstract

A photosensitive semiconductor device and a method for fabricating the same are proposed, in which a tape carrier with an opening and a photosensitive chip having a plurality of stud bumps formed thereon are provided respectively, and a plurality of conductive elements coated on a first surface of the tape carrier extend inwardly to the opening, wherein the photosensitive chip accommodated within the opening is attached on the conductive elements by the corresponding stud bumps. Then, an encapsulant is formed on an opposite second surface of the tape carrier to encapsulate the opening, and a transparent unit is attached on the first surface of the tape carrier to cover another side of the opening. Finally, a lens holder is mounted on the first surface of the tape carrier, allowing the transparent unit positioned between a lens of the lens holder and the photosensitive chip, thereby providing a thin and low cost photosensitive semiconductor device.
TW092124070A 2003-09-01 2003-09-01 Photosensitive semiconductor device and method for fabrication the same TWI241688B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092124070A TWI241688B (en) 2003-09-01 2003-09-01 Photosensitive semiconductor device and method for fabrication the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092124070A TWI241688B (en) 2003-09-01 2003-09-01 Photosensitive semiconductor device and method for fabrication the same

Publications (2)

Publication Number Publication Date
TW200511509A true TW200511509A (en) 2005-03-16
TWI241688B TWI241688B (en) 2005-10-11

Family

ID=37014022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092124070A TWI241688B (en) 2003-09-01 2003-09-01 Photosensitive semiconductor device and method for fabrication the same

Country Status (1)

Country Link
TW (1) TWI241688B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447972B (en) * 2010-12-28 2014-08-01 Biao Qin LED chip and LED chip and chip manufacturing methods
CN106817518A (en) * 2015-11-30 2017-06-09 南昌欧菲光电技术有限公司 Dual camera module
TWI630557B (en) * 2017-04-18 2018-07-21 Gingy Technology Inc. Image capturing module and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447972B (en) * 2010-12-28 2014-08-01 Biao Qin LED chip and LED chip and chip manufacturing methods
CN106817518A (en) * 2015-11-30 2017-06-09 南昌欧菲光电技术有限公司 Dual camera module
TWI630557B (en) * 2017-04-18 2018-07-21 Gingy Technology Inc. Image capturing module and manufacturing method thereof
TWI632717B (en) * 2017-04-18 2018-08-11 Gingy Technology Inc. Image capturing module and manufacturing method thereof

Also Published As

Publication number Publication date
TWI241688B (en) 2005-10-11

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