TW200507105A - Method of forming adjacent holes on a semiconductor substrate - Google Patents
Method of forming adjacent holes on a semiconductor substrateInfo
- Publication number
- TW200507105A TW200507105A TW092122252A TW92122252A TW200507105A TW 200507105 A TW200507105 A TW 200507105A TW 092122252 A TW092122252 A TW 092122252A TW 92122252 A TW92122252 A TW 92122252A TW 200507105 A TW200507105 A TW 200507105A
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- layer
- adjacent holes
- semiconductor substrate
- horizontal surface
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract 3
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A method of forming adjacent holes on a semiconductor substrate is disclosed. The adjacent holes are separated by a fine line structure. The method includes the steps of providing a semiconductor substrate with an insolating layer on the substrate, forming a step-shaped structure, with a first horizontal surface, a second horizontal surface, and a vertical surface, on the surface of the insolating layer, depositing a sacrificial layer with an average thickness, forming a patterned photoresist layer on portions of the first and second horizontal surface, performing an etchback process to remove the sacrificial layer not covered by the photoresist layer and forming a spacer on the vertical surface, removing the patterned photoresist layer, and using the spacer and the remaining sacrificial layer as a hard mask to remove the insulating layer, thereby forming two adjacent holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92122252A TWI240329B (en) | 2003-08-13 | 2003-08-13 | Method of forming adjacent holes on a semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92122252A TWI240329B (en) | 2003-08-13 | 2003-08-13 | Method of forming adjacent holes on a semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200507105A true TW200507105A (en) | 2005-02-16 |
| TWI240329B TWI240329B (en) | 2005-09-21 |
Family
ID=37007722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92122252A TWI240329B (en) | 2003-08-13 | 2003-08-13 | Method of forming adjacent holes on a semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI240329B (en) |
-
2003
- 2003-08-13 TW TW92122252A patent/TWI240329B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI240329B (en) | 2005-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |