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TW200506372A - Connector for measurement of electrical resistance and production process thereof, and measuring apparatus and measuring method of electrical resistance for circuit board - Google Patents

Connector for measurement of electrical resistance and production process thereof, and measuring apparatus and measuring method of electrical resistance for circuit board

Info

Publication number
TW200506372A
TW200506372A TW093108144A TW93108144A TW200506372A TW 200506372 A TW200506372 A TW 200506372A TW 093108144 A TW093108144 A TW 093108144A TW 93108144 A TW93108144 A TW 93108144A TW 200506372 A TW200506372 A TW 200506372A
Authority
TW
Taiwan
Prior art keywords
electrical resistance
measurement
connector
electrodes
circuit board
Prior art date
Application number
TW093108144A
Other languages
English (en)
Other versions
TWI256476B (en
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Fujio Hara
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200506372A publication Critical patent/TW200506372A/zh
Application granted granted Critical
Publication of TWI256476B publication Critical patent/TWI256476B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
TW093108144A 2003-03-26 2004-03-25 Connector for measurement of electrical resistance and production process thereof, and measuring apparatus and measuring method of electrical resistance for circuit board TWI256476B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003085173 2003-03-26

Publications (2)

Publication Number Publication Date
TW200506372A true TW200506372A (en) 2005-02-16
TWI256476B TWI256476B (en) 2006-06-11

Family

ID=33095019

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108144A TWI256476B (en) 2003-03-26 2004-03-25 Connector for measurement of electrical resistance and production process thereof, and measuring apparatus and measuring method of electrical resistance for circuit board

Country Status (6)

Country Link
US (1) US20060176064A1 (zh)
EP (1) EP1607751A1 (zh)
KR (1) KR20050115297A (zh)
CN (1) CN1764844A (zh)
TW (1) TWI256476B (zh)
WO (1) WO2004086062A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497084B (zh) * 2010-09-30 2015-08-21 Ismeca Semiconductor Holding 電性接點及測試平台
TWI761398B (zh) * 2016-12-01 2022-04-21 日商日本電產理德股份有限公司 電阻測量裝置及電阻測量方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006043629A1 (ja) * 2004-10-22 2006-04-27 Jsr Corporation アダプター装置およびその製造方法並びに回路装置の電気的検査装置
WO2006043631A1 (ja) * 2004-10-22 2006-04-27 Jsr Corporation ウエハ検査用異方導電性コネクターおよびその製造方法、ウエハ検査用プローブカードおよびその製造方法並びにウエハ検査装置
TW200635158A (en) * 2004-10-22 2006-10-01 Jsr Corp Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device
US7595790B2 (en) * 2005-01-31 2009-09-29 Panasonic Corporation Pressure sensitive conductive sheet, method of manufacturing the same, and touch panel using the same
JP5008005B2 (ja) 2006-07-10 2012-08-22 東京エレクトロン株式会社 プローブカード
KR101118650B1 (ko) * 2010-12-30 2012-03-06 경북대학교 산학협력단 도전성 박막의 무손상 저항 균일성 평가 장치
CN102175919B (zh) * 2011-01-28 2015-11-04 上海华虹宏力半导体制造有限公司 金属硅化物薄膜电阻模型的提取方法
US9442133B1 (en) * 2011-08-21 2016-09-13 Bruker Nano Inc. Edge electrode for characterization of semiconductor wafers
US9176167B1 (en) * 2011-08-21 2015-11-03 Bruker Nano Inc. Probe and method of manufacture for semiconductor wafer characterization
CN102520252A (zh) * 2011-12-29 2012-06-27 广州杰赛科技股份有限公司 一种测试模具及其制作方法及薄膜电阻基板单位阻值检测方法
CN103472304B (zh) * 2013-09-17 2014-10-22 中国科学院物理研究所 一种弹性探针阵列多通道电阻测量方法和装置
JP6918518B2 (ja) * 2017-02-27 2021-08-11 デクセリアルズ株式会社 電気特性の検査冶具
CN112689769B (zh) * 2018-09-14 2025-03-04 日本电产理德股份有限公司 检查指示信息产生装置与方法、基板检查系统及存储介质
JP7281620B2 (ja) * 2018-10-15 2023-05-26 パナソニックＩｐマネジメント株式会社 特性計測装置、部品実装装置、特性計測方法および部品実装方法
US11860193B2 (en) * 2018-11-21 2024-01-02 Mitsui Chemicals, Inc. Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electric inspection device and electric inspection method
CN110045208A (zh) * 2019-04-30 2019-07-23 北京航天时代光电科技有限公司 一种用于快速检测电连接器的通用装置及方法
TWI716106B (zh) * 2019-09-16 2021-01-11 力成科技股份有限公司 封裝基板之電阻量測方法及其封裝基板
CN113495190B (zh) * 2020-04-01 2024-10-15 株式会社东芝 电阻映射装置、电阻测定装置、电阻测定方法、程序以及记录介质
CN113051853B (zh) * 2021-03-05 2022-05-31 奥特斯科技(重庆)有限公司 受损部件载体确定方法、计算机程序、计算机可读介质以及检测系统
CN116359801B (zh) * 2023-02-06 2025-03-14 武汉中成智创科技有限公司 一种电缆连接金具压接电阻检测装置及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0592749U (ja) * 1992-05-14 1993-12-17 株式会社アドバンテスト スルーホール抵抗測定用プローブ
JP2000180472A (ja) * 1998-12-11 2000-06-30 Hitachi Cable Ltd ベアチップ検査用プローブ基板
JP2000241485A (ja) * 1999-02-24 2000-09-08 Jsr Corp 回路基板の電気抵抗測定装置および方法
KR100509526B1 (ko) * 2000-09-25 2005-08-23 제이에스알 가부시끼가이샤 이방 도전성 시트 및 그의 제조 방법 및 그의 응용 제품
JP4522604B2 (ja) * 2001-03-19 2010-08-11 日東電工株式会社 異方導電性フィルム
US6771077B2 (en) * 2002-04-19 2004-08-03 Hitachi, Ltd. Method of testing electronic devices indicating short-circuit
JP2003322665A (ja) * 2002-05-01 2003-11-14 Jsr Corp 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497084B (zh) * 2010-09-30 2015-08-21 Ismeca Semiconductor Holding 電性接點及測試平台
TWI761398B (zh) * 2016-12-01 2022-04-21 日商日本電產理德股份有限公司 電阻測量裝置及電阻測量方法

Also Published As

Publication number Publication date
US20060176064A1 (en) 2006-08-10
WO2004086062A1 (ja) 2004-10-07
TWI256476B (en) 2006-06-11
EP1607751A1 (en) 2005-12-21
CN1764844A (zh) 2006-04-26
KR20050115297A (ko) 2005-12-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees