200303784 砍、發明說明 (發明說明應欽明：發明所屬之技術領域、先前技術、内容、實施方式及圖式簡單說明） 【發明所屬^技術領域】 發明領域 本發明係有關於一種用以將臭氧混合、溶解於超純水 5而製造使用於半導體清洗等之臭氧水之臭氧混合裝置及臭 氧混合方法。 發明背景 迄今，這種氣液混合裝置之噴射器係已知的。一般而 10言，喷射器係如第2圖所示，由喷嘴1〇、吸引室u、及擴 散器12所構成，並藉使高壓之液體由喷嘴1〇喷射至吸引 室11，再減壓吸引室11之壓力，而可將氣體由設 置於吸 引至11之軋體吸入口 11a吸引至吸引室Η，並由擴散器 12在液體與氣體相混合之狀態下吐出。 15 近年來，在半導體製造領域中，半導體零件之清洗係 使用將臭氧混合、溶解於超純水之臭氧水，但為了提高清 洗#之臭氧處理效果，還有縮短處理時間，係將臭氧水之 臭氧濃度定在如20ppm以上之高濃度。 要使用喷射器製造如前述之高濃度臭氧水，為了要提 20高臭氧之接觸比例，而增加臭氧流量對超純水流量之比例 ((臭氧流量/超純水流量），以下稱為「液·氣比」），同時 為了增加吸引至吸引室之臭氧量，而將臭氧之壓力提高到 0.3MPa 左右。 然而，習知之喷射器中，當增加氣體流量對液體流量 200303784 玖、發明說明 之比例時’在擴散器之壓力損失會變大，且為了要彌補其 壓力損失’則必須增設加壓果等。若增設加壓果，當清洗 半導體等精密電子零件時，會有微粒（污染物）由泵混入超 純水之可能性、或超純水因金屬而受到污染之可能性增加 5 專問題。 又，為了提高臭氧之壓力，除了要求臭氧產生裝置之 耐壓構造，且使用電解法產生臭氧時，恐怕亦有於電解膜 產生小孔而使大量的臭氧侵入氧室等問題。 L 明内】 10 發明之揭示 因此’本發明之目@ ’即在提供—種可縮小壓力損失 、、放大液It比’且即使減少氣壓亦可將預定濃度之臭 氧溶解於权聽混合裝置及臭氧混合方法。 、 15 本發明之前述目的可藉由臭氧混合裝置而達成，該臭 氧混合裝置之特徵在於：具有-設有加壓水之流入口之室 、一與前述室連通之擴散器、及—插人於前述室内且朝前 述擴散部之人口部開口之臭氧供給管，並且該臭氧供給管 之前端部職有-㈣縮小通過前述擴散敎人口部之流 路之縮小構件。 較佳地，前述臭氧供給管可調節其前端部與前述擴散 部之入口敎㈣㈣，以靖前述料構件之縮小量。 又，·Μ土地，則述臭氧供給管之前端部具有圓雜狀之 外形’而前述室具有適合前述前端部之圓錐台狀之前細流 部’且該前細流部之前端係與前述擴散部之人口部連通。 200303784 玖、發明說明 另，較佳地，使計示壓力約〇·][〜約〇3Mpa之水流入 前述流入口，並且將計示壓力約0 05〜約〇.2Mpa之臭氧供 給前述臭氧供給管。 圖式簡單說明 第1圖係顯示有關本發明之臭氧混合裝置之一實施形 態之截面圖。 第2圖係顯示習知之噴射器之截面圖。 L實施方式3 發明實施之最佳形態 以下參照第1圖所示之截面圖說明有關本發明之臭氧 混合裝置之較佳實施形態。 臭氧混合裂置1包含有：一具有業經加壓之超純水之 流入口 2之室3、一與室3連通之擴散部4、及一插入於室 3内並朝擴政部4之入口部4a開口之臭氧供給管5。 15 臭氧供給管5並非如習知之位於喷射器之喷嘴，以高 速噴出流體為目的者，而是單單以固定之流量供給臭氧者 因此’臭軋供給管5之流路在圖示例中形成漸漸縮小之 噴嘴’但亦可作成無縮小之相同流路戴©之通孔。 臭氧供給管5之後端部係藉管（未圖示）與圖外之臭氧 產生裝置連接’並朝圖之箭頭χ方向傳送臭氧。臭氧由臭 氧產生裝置加壓成如約〇·〇5〜約〇2咖(計示壓力），且以 約0.4〜40 LN/分（Ln為標準狀態之公升）傳送。 /圖示例中，臭氧供給管5之前端部5&係具有圓錐狀之 外形’且頂部朝擴散部4之入口部知開口。室3則具有一 20 200303784 玖、發明說明 具有與4端部5a相同錐部之圓錐台狀之前細流路部3a , 且則細流路部3a連通於擴散部4之入口部4a。 而臭氧供給管5之前端部5a係插入前細流路部3a， 且形成有縮小通過擴散部4之入口部4a之前細流部3a之 5縮小構件。流入室3之加壓水（超純水）在通過其縮小之流 路，即微小間隙X時，會增加流速同時進行減壓，並於擴 政°卩4喷出，且在擴散部減速並進行加壓。送往流入口 2 之超純水宜利用送水泵（不圖示）以約〇1〜約〇3MPa(計示壓 力）而為約1〜約100 L /分。 1〇 圖示例中’臭氧供給管5之前端部5a與前細流路部 3a之間所形成之微小間隙\係漸漸縮小流路截面積，而構 成實質之喷嘴。為了使通過微小間隙χ之超純水增速，微 小間隙X宜如圖示例，為漸漸地縮小流路截面積者。 又’設置有臭氧供給管5，係可調節前端部&與擴散 15部4之人口部4a之間的距離，以調節前端部^之縮小量 ’即微小間隙X之大小。 圖示例中，於臭氧供給管5之外周部形成有螺絲部讣 ，且該螺絲部5b係與支持臭氧供給管5之—部份之支持體 6螺合。因此，若使臭氧供給管在軸圈上轉動，則可對應 於螺絲部5b之螺距，使前端部5a往軸線方向移動，並; 調節微小間隙X之大小。再者，圖中，符號7係表示〇環 1中’藉圖外之泵等加 2進入室3内，並通過 具有上述構造之臭氧混合裝置 壓之超純水係以固定流量由流入口 20 200303784 玖、發明說明 ，小間隙X而往擴散部4喷射。另_方面，臭氧以固定流 5由臭氧供給管5朝擴散部4之人口部4a排出。 、通過从小間隙X之超純水係藉微小間隙之喷嘴作用而 5 減/壓力。因此’可考慮若調節微小間隙X，且將臭氧供 、’°吕5出口附近之超純水的壓力，降低至與臭氧供給管$ ^之臭减力同等以下之壓力，則來自臭氧供給管5之臭 氧可輕易排出並輕易混合。 、此臭氧呈噴務狀捲入於由擴散部4喷出之超純水 並加以混合。臭氧之喷霧狀態係可藉微小間隙X之的調 10即，達到最適化。即，依超純水之流量或壓力、臭氧之流 量等，在擴散部4之噴霧狀微泡會變多，然後調節微小間 隙X之大小並促進臭氧之混合。再者，室3構成超純水之 μ路’但不具有作為如習知之喷射器之吸引室的效用。 f施例1 15 係'使用第1圖所示之臭氧混合裝置，且藉以下條件製 造臭氧水。 喷射部喉部之口徑 臭氧供給管之口徑 臭氧濃度： 臭氧流量： 臭氧壓力： 超純水流量： 超純水壓力： 2〇 2-2 mm φ 1·5 mm 21 〇 g/m N (m n為標準立方公尺) 0·8 W分 °·〇6 MPa 3 L/分 0.2 MPa 200303784 玖、發明說明 臭氧水之臭氧濃度：25 ppm 臭氧水壓力： 〇」MPa 壓力損失： （U MPa (壓力損失=〔超純水壓力〕—〔臭氧水壓力〕） 實施例2 係使用第1圖所示之臭氧混合裝置，且藉以下條件製 造臭氧水。實施例2係較實施例i增加臭氧流量之例。 喷射部喉部之口徑·· 2.2mm0 臭氧供給管之口徑：1.5mm ίο 臭氧濃度： 臭氧流量： 臭氧壓力： 超純水流量 超純水壓力200303784 Description of the invention (The description of the invention should be clear: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings are brief descriptions.) [Technical Field] The invention relates to a method for mixing ozone 2. An ozone mixing device and an ozone mixing method for dissolving in ultrapure water 5 to produce ozone water used in semiconductor cleaning and the like. BACKGROUND OF THE INVENTION So far, ejectors of such gas-liquid mixing devices are known. Generally speaking, the ejector is composed of a nozzle 10, a suction chamber u, and a diffuser 12, as shown in FIG. 2, and a high-pressure liquid is sprayed from the nozzle 10 to the suction chamber 11 and decompressed. The pressure of the suction chamber 11 can suck the gas from the rolling body suction port 11a provided to the suction chamber 11 to the suction chamber Η, and spit out the diffuser 12 in a state where the liquid and the gas are mixed. 15 In recent years, in the field of semiconductor manufacturing, the cleaning of semiconductor parts uses ozone water mixed with ozone and dissolved in ultrapure water. However, in order to improve the ozone treatment effect of cleaning #, and to shorten the treatment time, the ozone water is used. The ozone concentration is set to a high concentration such as above 20 ppm. To use the ejector to produce high-concentration ozone water as described above, in order to increase the contact ratio of 20 high ozone, increase the ratio of ozone flow to ultrapure water flow ((ozone flow / ultrapure water flow), hereinafter referred to as "liquid "Gas ratio"), and in order to increase the amount of ozone attracted to the suction chamber, the ozone pressure was increased to about 0.3 MPa. However, in the conventional ejector, when increasing the gas flow rate to the liquid flow rate 200303784 (the ratio of the invention description), the pressure loss in the diffuser will increase, and in order to make up for the pressure loss, a pressurized fruit must be added. If pressurized fruit is added, when cleaning precision electronic parts such as semiconductors, there may be the possibility that particles (contaminants) will be mixed into the ultrapure water by the pump, or the possibility that the ultrapure water will be contaminated by metal increases. 5 Special problems. In addition, in order to increase the pressure of ozone, in addition to the pressure-resistant structure of the ozone generating device, and when the electrolytic method is used to generate ozone, there may be problems such as the formation of small holes in the electrolytic membrane and a large amount of ozone invading the oxygen chamber. L Ming Nai] 10 The disclosure of the invention Therefore, 'the purpose of the invention @' is to provide a method that can reduce the pressure loss and enlarge the liquid It ratio 'and can dissolve a predetermined concentration of ozone in the right-handed mixing device and even if the air pressure is reduced. Ozone mixing method. 15 The foregoing object of the present invention can be achieved by an ozone mixing device, which is characterized by having a chamber provided with a pressurized water inlet, a diffuser communicating with the aforementioned chamber, and-inserting a person An ozone supply pipe which is located in the aforementioned room and opens toward the population section of the diffusion section, and the front end of the ozone supply pipe serves as a reduction member that narrows the flow path through the diffusion and population section. Preferably, the ozone supply pipe can adjust the front end portion and the inlet 敎 ㈣㈣ of the diffusion portion, so as to reduce the amount of reduction of the material member. In addition, in the case of M land, the front end of the ozone supply tube has a rounded outer shape, and the chamber has a truncated cone-shaped front thin flow portion suitable for the front end portion, and the front end of the front thin flow portion is connected to the diffusion portion. The Ministry of Population is connected. 200303784 发明 Description of the invention In addition, preferably, the metered pressure is about 0 ·] [~ about 03Mpa into the aforementioned inlet, and the metered pressure of about 0.05 to about 0.2Mpa is supplied to the aforementioned ozone supply. tube. Brief Description of Drawings Fig. 1 is a sectional view showing an embodiment of an ozone mixing device according to the present invention. Fig. 2 is a sectional view showing a conventional ejector. Embodiment 3 Best Mode for Implementing the Invention A preferred embodiment of the ozone mixing device according to the present invention will be described below with reference to the sectional view shown in FIG. The ozone mixing cracking unit 1 includes a chamber 3 having an inlet 2 for pressurized ultrapure water, a diffusion part 4 communicating with the chamber 3, and an inlet inserted into the chamber 3 and facing the expansion unit 4. The ozone supply pipe 5 with the opening 4a. 15 Ozone supply pipe 5 is not located in the nozzle of the ejector as is conventionally used to eject fluid at high speed, but it is only supplied to ozone at a fixed flow rate. Therefore, the flow path of the odor rolling supply pipe 5 is gradually formed in the example shown in the figure. Reduced nozzles' but can also be made through holes of the same flow path without reduction. The rear end of the ozone supply pipe 5 is connected to an ozone generating device not shown in the figure through a pipe (not shown) and transmits ozone in the direction of arrow χ in the figure. The ozone is pressurized by the ozone generating device to have a pressure of about 0.05 to about 0.02 (calculated pressure), and is transmitted at about 0.4 to 40 LN / min (Ln is a liter in a standard state). In the example shown in the figure, the front end portion 5 & of the ozone supply pipe 5 has a conical shape 'and the top portion is opened toward the entrance portion of the diffusion portion 4. The chamber 3 has a 20 200303784 玖, description of the invention, a truncated cone-shaped front thin flow path portion 3a having the same taper portion as the 4 end portion 5a, and the thin flow path portion 3a communicates with the inlet portion 4a of the diffusion portion 4. The front end portion 5a of the ozone supply pipe 5 is inserted into the front thin flow path portion 3a, and a narrowing member 5 is formed to narrow the narrow flow portion 3a before passing through the inlet portion 4a of the diffusion portion 4. When the pressurized water (ultra-pure water) flowing into the chamber 3 passes through its reduced flow path, that is, the small gap X, it will increase the flow rate and reduce the pressure at the same time. Pressurize. The ultrapure water sent to the inflow port 2 should preferably be about 1 to about 100 L / min with a water pump (not shown) at a pressure of about 0.01 to about 0.3 MPa (calculated pressure). 1 In the example shown in the figure, the small gap formed between the front end portion 5a of the ozone supply pipe 5 and the front thin flow path portion 3a gradually reduces the cross-sectional area of the flow path to form a substantial nozzle. In order to increase the speed of ultrapure water passing through the small gap χ, the small gap X should be as shown in the example, which gradually reduces the cross-sectional area of the flow path. Furthermore, an ozone supply pipe 5 is provided to adjust the distance between the front end portion & the population portion 4a of the diffusion portion 15 to adjust the reduction amount of the front end portion ^, that is, the size of the small gap X. In the example shown in the figure, a screw portion 讣 is formed on the outer peripheral portion of the ozone supply pipe 5, and the screw portion 5b is screwed with a support 6 that supports a part of the ozone supply pipe 5. Therefore, if the ozone supply pipe is rotated on the shaft ring, the tip portion 5a can be moved in the axial direction corresponding to the pitch of the screw portion 5b, and the size of the small gap X can be adjusted. In the figure, the symbol 7 indicates that in the ring 0, an ultrapure water system, which is pumped by a pump and the like outside the figure, is added into the chamber 3, and is passed through the inlet 20 at a fixed flow rate by an ozone mixing device having the above structure. 200303784 (ii) Invention description: The small gap X is sprayed toward the diffusion portion 4. On the other hand, ozone is discharged from the ozone supply pipe 5 toward the population section 4a of the diffusion section 4 in a fixed flow 5. By reducing the pressure from the ultra-pure water of the small gap X through the nozzle action of the small gap. Therefore, it can be considered that if the micro gap X is adjusted, and the pressure of the ozone supply and the ultrapure water near the outlet of Lu 5 is reduced to a pressure equal to or less than the odor reduction force of the ozone supply pipe, the ozone supply pipe comes from the ozone supply pipe. 5 of ozone can be easily discharged and easily mixed. The ozone is sprayed into the ultra-pure water sprayed from the diffusion section 4 and mixed. The spray state of ozone can be optimized by adjusting the gap X of 10 minutely. That is, depending on the flow rate or pressure of ultrapure water, the flow rate of ozone, and the like, the number of sprayed microbubbles in the diffusion portion 4 increases, and then the size of the micro-gap X is adjusted to promote ozone mixing. Moreover, the chamber 3 constitutes a μ-channel of ultrapure water but does not have the function as a suction chamber of a conventional ejector. fExample 1 15 The ozone mixing device shown in Fig. 1 was used, and ozone water was produced under the following conditions. The diameter of the throat of the injection unit is the diameter of the ozone supply pipe. Ozone concentration: Ozone flow rate: Ozone pressure: Ultrapure water flow rate: Ultrapure water pressure: 2〇2-2 mm φ 1.5 mm 21 0 g / m N (mn is Standard cubic meter) 0 · 8 Wmin ° · 〇6 MPa 3 L / min 0.2 MPa 200303784 玖, Description of the invention Ozone concentration of ozone water: 25 ppm Ozone water pressure: 〇 ″ MPa Pressure loss: (U MPa (Pressure loss = [Ultra-pure water pressure]-[Ozone water pressure]) Example 2 uses the ozone mixing device shown in Figure 1 and produces ozone water under the following conditions. Example 2 is an example of increasing the ozone flow rate compared to Example i The diameter of the throat of the spraying section ... 2.2mm0 The diameter of the ozone supply pipe: 1.5mm ίο Ozone concentration: Ozone flow rate: Ozone pressure: Ultrapure water flow Ultrapure water pressure
210 g/m3N 1·8 LN/分 0.08 MPa 3 L/分 0.25 MPa 臭氧水之臭氧濃度：33 ppm 臭氧水壓力·· 0.1 MPa 壓力損失： 0.15 MPa 2〇 ·係、使用第2圖所示之習知之噴射器，且藉以下條件混 臭氧與超純水。喷射裔之擴散器、噴嘴、及吸引室係使 用與第1圖之臭氧混合裝置之對應部分相同規格者。 噴射部喉部之口徑：2.2 mm 0 水噴射噴嘴之口徑：1.5 mm 10 200303784 玖、發明說明 臭氧濃度： 臭氧流量： 臭氧壓力： 超純水流$· 5 超純水壓力： 210 §/111\(111\為標準立方公尺) 1.7 LN/分 0.06 MPa 3 L/分 0.5 MPa 臭氧水之臭氧濃度：32 ppm 臭氧水壓力： 0.1 MPa 壓力損失： 0·4 MPa 10 比較例2 係使用與比較例1相同之習知之喷射器，且藉以下條 件製造臭氧水。 喷射部喉部之口徑：2.2 mm 0 水喷射喷嘴之口徑：1.5mm 15 臭氧濃度： 臭氧流量： 臭氧壓力： 超純水流量 超純水壓力 210 g/m3N (m3N為標準立方公尺） 0.2 Ln/分 0.06 MPa 1·5 L/分 0.25 MPa 臭氧水之臭氧濃度：16 ppm 臭氧水壓力： 0.1 MPa 壓力損失： 0.15 MPa 比較例2與比較例1相比，係降低超純水壓例之例（避 11 20 200303784 坎、發明說明 開加壓泵增設部分） 超純水流量在比較例1中係3 L/分，但在比較例2中 係減少1.5 L/分，同時往臭氧之吸引室的吸入流量在比較 例1中係1.7 LN/分，但在比較例2中係降低至0.2 LN/分。 5 此時，為了不超過〇·〇6 MPa之臭氧壓力而減少臭氧產生量 〇 若參照前述之實施例1與實施例2，可判斷臭氧水皆 確保20ppm以上之臭氧濃度，而壓力損失在〇·2 MPa以下 〇 10 又，實施例1、2中，臭氧之壓力亦為0.06 MPa、0.08 MPa，且該程度之壓力係不會對臭氧產生裝置造成故障之 程度’又，也是於臭氧產生裝置中不須特別的耐壓構造之 程度。 更進一步，即使在實施例1、2中將臭氧流量由〇.8 15 Ln/分增加為I·8 LN/分，實施例2之壓力損失亦在015 MPa，與得到相同臭氧濃度之比較例1相比較亦非常小， 且為不需要為彌補壓力損失而增設加壓系等之範圍。 相對於此，若參照比較例1，若作成欲得到與實施例2 相同4級之臭氧》辰度之臭氧水’則必須增設加壓栗且增加 20超純水之壓力至〇·5 MPa，此時會產生〇·4 MPa之壓力損失 〇 比較例2中則不增設加壓泵，將超純水之壓力作成與 實施例相同等級之壓力，並減少壓力損失，但臭氧水之臭 氧濃度為16ppm，未達到半導體清洗中必要之2〇ppm。 200303784 玖、發明說明 由前述實施例可知，若根據本發明之臭氧混合裝置及 臭氧混合，與使用習知之喷射器製造臭氧水之情況比較， 可抑制超純水之壓力使之降低，且不須增加加壓設備，並 抑制臭氧之壓力且防止對臭氧產生裝置之損害，而且，可 5 增加相對於超純水流量之臭氧水流量之比率，且製造高濃 度之臭氧水。 【圖式簡單說明3 第1圖係顯示有關本發明之臭氧混合裝置之一實施形 態之截面圖。 10 第2圖係顯示習知之喷射器之截面圖。 【圖式之主要元件代表符號表】 1...臭氧混合裝置 11。..吸引室 2…(超純水)流入口 11a…氣體吸入口 3…室 12".擴散器 3a...前細流部 X…微小間隙 4…欠部 4a···入口部 5...臭氧供給管 5a···前端部 5b...螺絲部 6…支持體 7...0 環 10···喷嘴 13210 g / m3N 1 · 8 LN / min 0.08 MPa 3 L / min 0.25 MPa Ozone concentration in ozone water: 33 ppm Ozone water pressure ·· 0.1 MPa Pressure loss: 0.15 MPa 2 ·· Series, use the one shown in Figure 2 The conventional ejector mixes ozone and ultrapure water under the following conditions. The spray diffuser, nozzle, and suction chamber are those having the same specifications as the corresponding parts of the ozone mixing device in FIG. 1. The diameter of the throat of the spraying section: 2.2 mm 0 The diameter of the water spraying nozzle: 1.5 mm 10 200303784 玖 Description of the invention Ozone concentration: Ozone flow rate: Ozone pressure: Ultra-pure water flow $ 5 Ultra-pure water pressure: 210 § / 111 \ ( 111 \ is the standard cubic meter) 1.7 LN / min 0.06 MPa 3 L / min 0.5 MPa Ozone concentration of ozone water: 32 ppm Ozone water pressure: 0.1 MPa Pressure loss: 0 · 4 MPa 10 Comparative example 2 Use and comparative example 1 The same conventional injector, and ozone water is produced under the following conditions. Diameter of jet throat: 2.2 mm 0 Diameter of water jet nozzle: 1.5mm 15 Ozone concentration: Ozone flow rate: Ozone pressure: Ultrapure water flow Ultrapure water pressure 210 g / m3N (m3N is the standard cubic meter) 0.2 Ln 0.06 MPa 1 · 5 L / min 0.25 MPa Ozone concentration of ozone water: 16 ppm Ozone water pressure: 0.1 MPa Pressure loss: 0.15 MPa Comparative Example 2 is an example of a case where the ultrapure water pressure is reduced compared to Comparative Example 1. (Avoid 11 20 200303784, the description of the invention to open the additional part of the booster pump.) The flow rate of ultrapure water in Comparative Example 1 was 3 L / min, but in Comparative Example 2, it was reduced by 1.5 L / min. At the same time, it went to the ozone suction chamber. The inhalation flow rate was 1.7 LN / min in Comparative Example 1, but decreased to 0.2 LN / min in Comparative Example 2. 5 At this time, in order to reduce the ozone generation amount so as not to exceed the ozone pressure of 0.06 MPa, if referring to the foregoing Example 1 and Example 2, it can be judged that the ozone water can ensure an ozone concentration of 20 ppm or more, and the pressure loss is 〇 · 2 MPa or less 〇10 Also, in Examples 1 and 2, the ozone pressure is also 0.06 MPa and 0.08 MPa, and the pressure of this level is such that it will not cause a failure of the ozone generating device. It is also the ozone generating device. There is no need for a special pressure-resistant structure. Furthermore, even when the ozone flow rate was increased from 0.8 15 Ln / min to I · 8 LN / min in Examples 1 and 2, the pressure loss in Example 2 was also 015 MPa, which is a comparative example with the same ozone concentration. 1 is also very small in comparison, and it is a range that does not require the addition of a pressurizing system to compensate for pressure loss. On the other hand, if you refer to Comparative Example 1, if you want to obtain ozone water with the same grade 4 ozone as in Example 2, you must add a pressurized pump and increase the pressure of 20 ultrapure water to 0.5 MPa. At this time, a pressure loss of 0.4 MPa will occur. In Comparative Example 2, no pressure pump was added, the pressure of ultrapure water was made to the same level as in the example, and the pressure loss was reduced, but the ozone concentration of ozone water was 16 ppm, which is not 20 ppm necessary for semiconductor cleaning. 200303784 发明 Description of the invention It can be known from the foregoing embodiments that if the ozone mixing device and ozone mixing according to the present invention are compared with the case of using conventional ejectors to produce ozone water, the pressure of ultrapure water can be suppressed and reduced, and it is not necessary Increase the pressurization equipment, and suppress the pressure of ozone and prevent damage to the ozone generating device. Furthermore, it can increase the ratio of the ozone water flow rate with respect to the flow of ultrapure water, and produce high-concentration ozone water. [Brief Description of Drawings 3] Figure 1 is a cross-sectional view showing an embodiment of an ozone mixing device according to the present invention. 10 Figure 2 is a cross-sectional view showing a conventional ejector. [Representative symbols for main elements of the drawing] 1 ... Ozone mixing device 11. .. suction chamber 2… (ultra-pure water) inlet 11a… gas inlet 3… chamber 12 ". diffuser 3a ... front thin flow section X ... micro gap 4 ... under section 4a ... inlet section 5. .Ozone supply pipe 5a ... Tip 5b ... Screw 6 ... Support 7 ... 0 Ring 10 ... Nozzle 13