SG11202011801TA - Ultrasonic joining apparatus - Google Patents
Ultrasonic joining apparatusInfo
- Publication number
- SG11202011801TA SG11202011801TA SG11202011801TA SG11202011801TA SG11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA SG 11202011801T A SG11202011801T A SG 11202011801TA
- Authority
- SG
- Singapore
- Prior art keywords
- joining apparatus
- ultrasonic joining
- ultrasonic
- joining
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018217546 | 2018-11-20 | ||
| PCT/JP2019/043483 WO2020105434A1 (en) | 2018-11-20 | 2019-11-06 | Ultrasonic joining apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202011801TA true SG11202011801TA (en) | 2020-12-30 |
Family
ID=70773303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202011801TA SG11202011801TA (en) | 2018-11-20 | 2019-11-06 | Ultrasonic joining apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11440131B2 (en) |
| JP (1) | JP7082434B2 (en) |
| CN (1) | CN112203794B (en) |
| SG (1) | SG11202011801TA (en) |
| WO (1) | WO2020105434A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202102687RA (en) * | 2019-03-18 | 2021-04-29 | Shinkawa Kk | Capillary guide device and wire bonding apparatus |
| KR102462374B1 (en) * | 2020-11-25 | 2022-11-01 | 한국항공우주연구원 | Horn for ultrasonic wave device and calibration method using thereof |
| US20240116127A1 (en) * | 2022-10-11 | 2024-04-11 | Asmpt Singapore Pte. Ltd. | Ultrasonic transducer operable at multiple resonant frequencies |
| US20240116126A1 (en) * | 2022-10-11 | 2024-04-11 | Asmpt Singapore Pte. Ltd. | Ultrasonic transducer operable at multiple resonant frequencies |
| CN115464288A (en) * | 2022-10-13 | 2022-12-13 | 长沙学院 | Resistance heat-assisted hybrid welding system based on heterogeneous metal |
| US20250041962A1 (en) * | 2023-07-31 | 2025-02-06 | Rohr, Inc. | Method and apparatus for ultrasonic welding thermoplastic components |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02192138A (en) * | 1989-01-19 | 1990-07-27 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| JPH05235116A (en) * | 1992-02-26 | 1993-09-10 | Hitachi Ltd | Ultrasonic horn of wire bonder |
| JP3151691B2 (en) * | 1992-11-24 | 2001-04-03 | 株式会社新川 | Capillary holding structure of ultrasonic horn |
| US5277355A (en) * | 1992-11-25 | 1994-01-11 | Kulicke And Soffa Investments, Inc. | Self-aligning fine wire clamp |
| JP3172901B2 (en) * | 1993-11-30 | 2001-06-04 | 株式会社新川 | Bonding equipment |
| JPH08294673A (en) * | 1995-04-27 | 1996-11-12 | Jiromaru Tsujino | Ultrasonic horn for complex vibration conversion |
| JP3455344B2 (en) | 1995-10-20 | 2003-10-14 | 株式会社オートネットワーク技術研究所 | Ultrasonic welding equipment |
| JP3099942B2 (en) | 1996-08-08 | 2000-10-16 | 株式会社アルテクス | Ultrasonic vibration bonding resonator |
| JPH10323620A (en) | 1997-05-26 | 1998-12-08 | Mitsubishi Electric Corp | Ultrasonic vibration device |
| JP3400323B2 (en) * | 1997-10-13 | 2003-04-28 | 株式会社新川 | Ultrasonic horn capillary holding structure |
| US6073827A (en) * | 1998-08-27 | 2000-06-13 | Kulicke & Soffa Investments, Inc. | Wire bonding capillary with a conical surface |
| JP3802284B2 (en) * | 1999-07-05 | 2006-07-26 | 株式会社新川 | Wire bonding equipment |
| US6766936B2 (en) * | 2001-09-07 | 2004-07-27 | Kabushiki Kaisha Shinkawa | Transducer and a bonding apparatus using the same |
| US20030062395A1 (en) * | 2001-10-01 | 2003-04-03 | Li Hing Leung | Ultrasonic transducer |
| JP3788351B2 (en) * | 2002-01-21 | 2006-06-21 | 松下電器産業株式会社 | Electronic component bonding apparatus and electronic component bonding tool |
| EP1375048B1 (en) * | 2002-06-18 | 2008-05-21 | F&K Delvotec Bondtechnik GmbH | Wire bonding device |
| JP3966217B2 (en) * | 2003-04-23 | 2007-08-29 | 松下電器産業株式会社 | Bonding apparatus and bonding tool |
| US7322507B2 (en) * | 2005-01-17 | 2008-01-29 | Amkor Technology, Inc. | Transducer assembly, capillary and wire bonding method using the same |
| JP4792945B2 (en) * | 2005-01-28 | 2011-10-12 | 日産自動車株式会社 | Ultrasonic bonding apparatus and bonded structure |
| JP4657964B2 (en) * | 2005-10-07 | 2011-03-23 | 株式会社新川 | Ultrasonic horn |
| JP2007319876A (en) * | 2006-05-30 | 2007-12-13 | Toshiba Corp | Ultrasonic bonding device, and semi-conductor device manufacturing method |
| JP4679454B2 (en) * | 2006-07-13 | 2011-04-27 | 株式会社新川 | Wire bonding equipment |
| US7997470B2 (en) * | 2006-11-24 | 2011-08-16 | Asm Technology Singapore Pte Ltd | Flanged transducer having improved rigidity |
| JP4336732B1 (en) * | 2008-04-11 | 2009-09-30 | Ｔｄｋ株式会社 | Ultrasonic mounting equipment |
| US8011559B2 (en) * | 2009-11-09 | 2011-09-06 | GM Global Technology Operations LLC | Active material-augmented vibration welding system and method of use |
| CN101804575B (en) * | 2010-03-05 | 2013-05-01 | 清华大学 | Elliptical ultrasonic vibration auxiliary cutting device with adjustable track |
| JP2012039032A (en) | 2010-08-11 | 2012-02-23 | Fujitsu Ltd | Capillary for wire bonding device and ultrasonic transducer |
| JP5583179B2 (en) * | 2012-08-03 | 2014-09-03 | 株式会社カイジョー | Bonding equipment |
| JP5930419B2 (en) * | 2014-03-14 | 2016-06-08 | 株式会社カイジョー | Bonding equipment |
| JP5930423B2 (en) * | 2014-05-09 | 2016-06-08 | 株式会社カイジョー | Bonding equipment |
| CN106457458B (en) * | 2014-06-12 | 2018-04-17 | 日产自动车株式会社 | Engagement state inspection method |
| JP5916814B2 (en) * | 2014-08-06 | 2016-05-11 | 株式会社カイジョー | Bonding method and bonding apparatus |
| CN107107252A (en) * | 2014-08-25 | 2017-08-29 | 日产自动车株式会社 | Ultrasonic bonding equipment |
| CN204321507U (en) * | 2014-12-09 | 2015-05-13 | 苏州科技学院 | A kind of single-electrical signal excitation ultrasonic elliptical vibratory extruding machining apparatus |
| DE102015214408C5 (en) * | 2015-07-29 | 2020-01-09 | Telsonic Holding Ag | Sonotrode, device and method for producing a welded connection |
| JP6397807B2 (en) * | 2015-09-28 | 2018-09-26 | 辻野 次郎丸 | Ultrasonic composite vibration welding method |
| CN206934145U (en) * | 2016-10-25 | 2018-01-30 | 厚凯（天津）医疗科技有限公司 | A kind of torsional oscillation formula ultrasonic scalpel system |
| DE112018006322B4 (en) * | 2017-12-11 | 2024-07-25 | Branson Ultrasonics Corporation | Intelligent ultrasound stack and method for controlling an ultrasound system having an intelligent ultrasound stack |
-
2019
- 2019-11-06 WO PCT/JP2019/043483 patent/WO2020105434A1/en active Application Filing
- 2019-11-06 CN CN201980036660.6A patent/CN112203794B/en active Active
- 2019-11-06 JP JP2020558250A patent/JP7082434B2/en active Active
- 2019-11-06 US US17/057,879 patent/US11440131B2/en active Active
- 2019-11-06 SG SG11202011801TA patent/SG11202011801TA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7082434B2 (en) | 2022-06-08 |
| US20210197308A1 (en) | 2021-07-01 |
| JPWO2020105434A1 (en) | 2021-09-30 |
| CN112203794B (en) | 2022-08-09 |
| US11440131B2 (en) | 2022-09-13 |
| WO2020105434A1 (en) | 2020-05-28 |
| CN112203794A (en) | 2021-01-08 |
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