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SG11202003747YA - Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding device - Google Patents

Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding device

Info

Publication number
SG11202003747YA
SG11202003747YA SG11202003747YA SG11202003747YA SG11202003747YA SG 11202003747Y A SG11202003747Y A SG 11202003747YA SG 11202003747Y A SG11202003747Y A SG 11202003747YA SG 11202003747Y A SG11202003747Y A SG 11202003747YA SG 11202003747Y A SG11202003747Y A SG 11202003747YA
Authority
SG
Singapore
Prior art keywords
bonding
semiconductor chip
conductive film
setting conditions
chip during
Prior art date
Application number
SG11202003747YA
Other languages
English (en)
Inventor
Tomonori Nakamura
Toru Maeda
Satoru Nagai
Yoshihiro Saeki
Osamu Watanabe
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202003747YA publication Critical patent/SG11202003747YA/en

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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices

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  • Manufacturing & Machinery (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
SG11202003747YA 2017-09-28 2018-09-14 Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding device SG11202003747YA (en)

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