SG11201610106SA - Computational wafer inspection - Google Patents
Computational wafer inspectionInfo
- Publication number
- SG11201610106SA SG11201610106SA SG11201610106SA SG11201610106SA SG11201610106SA SG 11201610106S A SG11201610106S A SG 11201610106SA SG 11201610106S A SG11201610106S A SG 11201610106SA SG 11201610106S A SG11201610106S A SG 11201610106SA SG 11201610106S A SG11201610106S A SG 11201610106SA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer inspection
- computational
- computational wafer
- inspection
- wafer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N7/00—Computing arrangements based on specific mathematical models
- G06N7/01—Probabilistic graphical models, e.g. probabilistic networks
-
- H10P74/23—
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- Data Mining & Analysis (AREA)
- Algebra (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Computing Systems (AREA)
- Computational Mathematics (AREA)
- Mathematical Physics (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Mathematical Analysis (AREA)
- Probability & Statistics with Applications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462010221P | 2014-06-10 | 2014-06-10 | |
| US201462023589P | 2014-07-11 | 2014-07-11 | |
| PCT/EP2015/061609 WO2015189026A2 (en) | 2014-06-10 | 2015-05-26 | Computational wafer inspection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201610106SA true SG11201610106SA (en) | 2016-12-29 |
Family
ID=53268803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201610106SA SG11201610106SA (en) | 2014-06-10 | 2015-05-26 | Computational wafer inspection |
Country Status (7)
| Country | Link |
|---|---|
| US (6) | US9507907B2 (en) |
| JP (2) | JP6491677B2 (en) |
| KR (1) | KR101991418B1 (en) |
| CN (2) | CN106463434B (en) |
| SG (1) | SG11201610106SA (en) |
| TW (1) | TWI549012B (en) |
| WO (1) | WO2015189026A2 (en) |
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| US10459345B2 (en) | 2015-03-06 | 2019-10-29 | Asml Netherlands B.V. | Focus-dose co-optimization based on overlapping process window |
-
2015
- 2015-05-26 SG SG11201610106SA patent/SG11201610106SA/en unknown
- 2015-05-26 KR KR1020177000611A patent/KR101991418B1/en active Active
- 2015-05-26 WO PCT/EP2015/061609 patent/WO2015189026A2/en not_active Ceased
- 2015-05-26 JP JP2016570068A patent/JP6491677B2/en active Active
- 2015-05-26 CN CN201580031822.9A patent/CN106463434B/en active Active
- 2015-05-26 CN CN202011419885.0A patent/CN112530828B/en active Active
- 2015-06-04 US US14/730,993 patent/US9507907B2/en active Active
- 2015-06-09 TW TW104118649A patent/TWI549012B/en active
-
2016
- 2016-10-31 US US15/339,669 patent/US9990462B2/en active Active
-
2018
- 2018-06-04 US US15/996,992 patent/US10579772B2/en active Active
- 2018-11-29 JP JP2018223995A patent/JP6697530B2/en active Active
-
2020
- 2020-02-28 US US16/804,048 patent/US11080459B2/en active Active
-
2021
- 2021-07-30 US US17/389,682 patent/US12067340B2/en active Active
-
2024
- 2024-08-15 US US18/806,274 patent/US20240403537A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019061267A (en) | 2019-04-18 |
| US12067340B2 (en) | 2024-08-20 |
| CN112530828B (en) | 2025-03-28 |
| CN106463434A (en) | 2017-02-22 |
| US20180365369A1 (en) | 2018-12-20 |
| CN112530828A (en) | 2021-03-19 |
| KR101991418B1 (en) | 2019-06-20 |
| KR20170015500A (en) | 2017-02-08 |
| US9507907B2 (en) | 2016-11-29 |
| US20210357570A1 (en) | 2021-11-18 |
| US9990462B2 (en) | 2018-06-05 |
| WO2015189026A2 (en) | 2015-12-17 |
| JP2017524963A (en) | 2017-08-31 |
| JP6491677B2 (en) | 2019-03-27 |
| US20170046473A1 (en) | 2017-02-16 |
| US20240403537A1 (en) | 2024-12-05 |
| US20150356233A1 (en) | 2015-12-10 |
| TW201602821A (en) | 2016-01-16 |
| US10579772B2 (en) | 2020-03-03 |
| US11080459B2 (en) | 2021-08-03 |
| CN106463434B (en) | 2020-12-22 |
| WO2015189026A3 (en) | 2016-02-18 |
| US20200218849A1 (en) | 2020-07-09 |
| JP6697530B2 (en) | 2020-05-20 |
| TWI549012B (en) | 2016-09-11 |
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