SG11201606207WA - Method of optimizing a process window - Google Patents
Method of optimizing a process windowInfo
- Publication number
- SG11201606207WA SG11201606207WA SG11201606207WA SG11201606207WA SG11201606207WA SG 11201606207W A SG11201606207W A SG 11201606207WA SG 11201606207W A SG11201606207W A SG 11201606207WA SG 11201606207W A SG11201606207W A SG 11201606207WA SG 11201606207W A SG11201606207W A SG 11201606207WA
- Authority
- SG
- Singapore
- Prior art keywords
- optimizing
- process window
- window
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
- G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Data Mining & Analysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461939071P | 2014-02-12 | 2014-02-12 | |
| US201461943834P | 2014-02-24 | 2014-02-24 | |
| PCT/EP2015/050168 WO2015120996A1 (en) | 2014-02-12 | 2015-01-07 | Method of optimizing a process window |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201606207WA true SG11201606207WA (en) | 2016-09-29 |
Family
ID=52302232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201606207WA SG11201606207WA (en) | 2014-02-12 | 2015-01-07 | Method of optimizing a process window |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US9990451B2 (en) |
| EP (1) | EP3105636B1 (en) |
| JP (2) | JP6386569B2 (en) |
| KR (4) | KR102427139B1 (en) |
| CN (2) | CN105980934B (en) |
| SG (1) | SG11201606207WA (en) |
| TW (2) | TWI628696B (en) |
| WO (1) | WO2015120996A1 (en) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5969848B2 (en) * | 2012-07-19 | 2016-08-17 | キヤノン株式会社 | Exposure apparatus, method for obtaining adjustment amount for adjustment, program, and device manufacturing method |
| CN105849643B (en) | 2013-12-17 | 2019-07-19 | Asml荷兰有限公司 | Yields estimation and control |
| SG11201610106SA (en) | 2014-06-10 | 2016-12-29 | Asml Netherlands Bv | Computational wafer inspection |
| KR102250062B1 (en) * | 2014-07-04 | 2021-05-11 | 삼성전자주식회사 | Fabricating method and apparatus of Semiconductor device |
| KR102021450B1 (en) | 2014-09-22 | 2019-11-04 | 에이에스엠엘 네델란즈 비.브이. | Process window identifier |
| WO2016128189A1 (en) | 2015-02-13 | 2016-08-18 | Asml Netherlands B.V. | Process variability aware adaptive inspection and metrology |
| WO2017080729A1 (en) * | 2015-11-13 | 2017-05-18 | Asml Netherlands B.V. | Methods for identifying a process window boundary |
| CN108292108B (en) | 2015-11-27 | 2020-06-26 | Asml荷兰有限公司 | Metrology target, method and apparatus, computer program and lithographic system |
| IL293649B2 (en) | 2015-12-22 | 2023-11-01 | Asml Netherlands Bv | Apparatus and method for process-window characterization |
| US10962886B2 (en) | 2015-12-31 | 2021-03-30 | Asml Netherlands B.V. | Selection of measurement locations for patterning processes |
| US11443083B2 (en) | 2016-05-12 | 2022-09-13 | Asml Netherlands B.V. | Identification of hot spots or defects by machine learning |
| EP3879345B1 (en) | 2016-10-21 | 2023-08-09 | ASML Netherlands B.V. | Methods of determining corrections for a patterning process |
| KR102280532B1 (en) | 2016-12-23 | 2021-07-22 | 에이에스엠엘 네델란즈 비.브이. | Method and apparatus for controlling pattern fidelity |
| US10140400B2 (en) * | 2017-01-30 | 2018-11-27 | Dongfang Jingyuan Electron Limited | Method and system for defect prediction of integrated circuits |
| CN113946105B (en) * | 2017-02-22 | 2025-01-10 | Asml荷兰有限公司 | Computational measurement |
| US10599046B2 (en) | 2017-06-02 | 2020-03-24 | Samsung Electronics Co., Ltd. | Method, a non-transitory computer-readable medium, and/or an apparatus for determining whether to order a mask structure |
| KR102597444B1 (en) * | 2017-07-12 | 2023-11-03 | 에이에스엠엘 네델란즈 비.브이. | Defect Prediction |
| WO2019043780A1 (en) * | 2017-08-29 | 2019-03-07 | ギガフォトン株式会社 | Data analysis device, semiconductor manufacturing system, data analysis method, and semiconductor manufacturing method |
| US11282695B2 (en) | 2017-09-26 | 2022-03-22 | Samsung Electronics Co., Ltd. | Systems and methods for wafer map analysis |
| US10445452B2 (en) * | 2017-10-04 | 2019-10-15 | Mentor Graphics Corporation | Simulation-assisted wafer rework determination |
| EP3495888A1 (en) * | 2017-12-06 | 2019-06-12 | ASML Netherlands B.V. | Method for controlling a lithographic apparatus and associated apparatuses |
| WO2019115426A1 (en) | 2017-12-13 | 2019-06-20 | Asml Netherlands B.V. | Prediction of out of specification physical items |
| KR102690502B1 (en) * | 2017-12-19 | 2024-07-30 | 에이에스엠엘 네델란즈 비.브이. | Computational metrology based correction and control |
| US11079687B2 (en) | 2017-12-22 | 2021-08-03 | Asml Netherlands B.V. | Process window based on defect probability |
| CN111542855B (en) * | 2017-12-31 | 2024-10-15 | Asml荷兰有限公司 | Method and system for defect inspection and review |
| CN108090032B (en) * | 2018-01-03 | 2021-03-23 | 第四范式（北京）技术有限公司 | Visual interpretation method and device of logistic regression model |
| CN111684541B (en) * | 2018-02-08 | 2024-08-27 | 东京毅力科创株式会社 | Information processing device, program product, process execution device, and information processing system |
| WO2019162280A1 (en) * | 2018-02-23 | 2019-08-29 | Asml Netherlands B.V. | Guided patterning device inspection |
| WO2019209301A1 (en) | 2018-04-26 | 2019-10-31 | Hewlett-Packard Development Company, L.P. | Printing production quality prediction |
| KR102529085B1 (en) * | 2018-06-25 | 2023-05-08 | 에이에스엠엘 네델란즈 비.브이. | Wavefront Optimization for Tuning Scanner Based on Performance Matching |
| JP6980115B2 (en) * | 2018-08-24 | 2021-12-15 | 技術研究組合次世代３Ｄ積層造形技術総合開発機構 | Information processing device, information processing method, information processing program, laminated modeling device and process window generation method |
| EP3627225A1 (en) | 2018-09-19 | 2020-03-25 | ASML Netherlands B.V. | Particle beam apparatus, defect repair method, lithographic exposure process and lithographic system |
| US11244873B2 (en) * | 2018-10-31 | 2022-02-08 | Tokyo Electron Limited | Systems and methods for manufacturing microelectronic devices |
| CN112969968B (en) * | 2018-11-08 | 2024-06-11 | Asml荷兰有限公司 | Prediction of disqualification based on spatial characteristics of process variability |
| WO2020120050A1 (en) * | 2018-12-14 | 2020-06-18 | Asml Netherlands B.V. | Apparatus and method for grouping image patterns to determine wafer behavior in a patterning process |
| WO2020135997A1 (en) | 2018-12-26 | 2020-07-02 | Asml Netherlands B.V. | System and method for inspecting a wafer |
| US11550309B2 (en) * | 2019-01-08 | 2023-01-10 | Kla Corporation | Unsupervised defect segmentation |
| US11263737B2 (en) * | 2019-01-10 | 2022-03-01 | Lam Research Corporation | Defect classification and source analysis for semiconductor equipment |
| US11348813B2 (en) | 2019-01-31 | 2022-05-31 | Applied Materials, Inc. | Correcting component failures in ion implant semiconductor manufacturing tool |
| CN110034034B (en) * | 2019-03-04 | 2021-06-15 | 上海华力集成电路制造有限公司 | Compensation method for precision deviation of wafer carrier of defect observation equipment |
| TWI845690B (en) * | 2019-06-06 | 2024-06-21 | 日商東京威力科創股份有限公司 | Substrate inspection device, substrate inspection system, substrate inspection method and computer program product |
| US11442021B2 (en) * | 2019-10-11 | 2022-09-13 | Kla Corporation | Broadband light interferometry for focal-map generation in photomask inspection |
| JP7508325B2 (en) * | 2020-10-02 | 2024-07-01 | キヤノン株式会社 | Feedback control device, lithography apparatus, measurement apparatus, processing apparatus, planarization apparatus, article manufacturing method, computer program, and feedback control method |
Family Cites Families (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5934459B2 (en) | 1978-09-08 | 1984-08-22 | 太洋鋳機株式会社 | molding sand cooling equipment |
| JPS5934459U (en) | 1982-08-27 | 1984-03-03 | 三菱電機株式会社 | dc motor |
| US5777901A (en) * | 1995-09-29 | 1998-07-07 | Advanced Micro Devices, Inc. | Method and system for automated die yield prediction in semiconductor manufacturing |
| US6324298B1 (en) * | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
| US6466314B1 (en) * | 1998-09-17 | 2002-10-15 | Applied Materials, Inc. | Reticle design inspection system |
| JP4597509B2 (en) * | 1999-08-26 | 2010-12-15 | 株式会社ナノジオメトリ研究所 | Pattern inspection apparatus and pattern inspection method |
| AU2002245560A1 (en) * | 2001-03-20 | 2002-10-03 | Numerial Technologies, Inc. | System and method of providing mask defect printability analysis |
| US7363099B2 (en) * | 2002-06-07 | 2008-04-22 | Cadence Design Systems, Inc. | Integrated circuit metrology |
| JP2004053683A (en) * | 2002-07-16 | 2004-02-19 | Fujitsu Ltd | Method and apparatus for managing pattern forming process |
| US6925860B1 (en) * | 2003-02-21 | 2005-08-09 | Nanometrics Incorporated | Leveling a measured height profile |
| US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
| US7003758B2 (en) * | 2003-10-07 | 2006-02-21 | Brion Technologies, Inc. | System and method for lithography simulation |
| KR101056142B1 (en) * | 2004-01-29 | 2011-08-10 | 케이엘에이-텐코 코포레이션 | Computerized method for detecting defects in reticle design data |
| US7653890B2 (en) * | 2004-04-02 | 2010-01-26 | Cadence Design Systems, Inc. | Modeling resolution enhancement processes in integrated circuit fabrication |
| US7295291B2 (en) * | 2004-05-12 | 2007-11-13 | Litel Instruments | Apparatus and process for the determination of static lens field curvature |
| US7593565B2 (en) * | 2004-12-08 | 2009-09-22 | Rudolph Technologies, Inc. | All surface data for use in substrate inspection |
| US7788629B2 (en) * | 2004-07-21 | 2010-08-31 | Kla-Tencor Technologies Corp. | Systems configured to perform a non-contact method for determining a property of a specimen |
| US7814456B2 (en) * | 2004-11-22 | 2010-10-12 | Tela Innovations, Inc. | Method and system for topography-aware reticle enhancement |
| DE102005009536A1 (en) * | 2005-02-25 | 2006-08-31 | Carl Zeiss Sms Gmbh | Process to inspect masks for weak spots uses aerial image simulation to produce a list of critical points or hotspots, which is analyzed using Aerial Imaging Measurement system to compare real with simulated images |
| US7297453B2 (en) * | 2005-04-13 | 2007-11-20 | Kla-Tencor Technologies Corporation | Systems and methods for mitigating variances on a patterned wafer using a prediction model |
| US7760929B2 (en) * | 2005-05-13 | 2010-07-20 | Applied Materials, Inc. | Grouping systematic defects with feedback from electrical inspection |
| US7853920B2 (en) | 2005-06-03 | 2010-12-14 | Asml Netherlands B.V. | Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing |
| US7769225B2 (en) | 2005-08-02 | 2010-08-03 | Kla-Tencor Technologies Corp. | Methods and systems for detecting defects in a reticle design pattern |
| JP2007053202A (en) | 2005-08-17 | 2007-03-01 | Toshiba Corp | Computation method of proximity effect, dangerous point detector, and program |
| US7695876B2 (en) * | 2005-08-31 | 2010-04-13 | Brion Technologies, Inc. | Method for identifying and using process window signature patterns for lithography process control |
| DE102005041311B4 (en) | 2005-08-31 | 2012-04-12 | Globalfoundries Inc. | Method and system for automatically detecting exposed substrates with a high probability of defocused exposure fields |
| US7570796B2 (en) * | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| TWI397995B (en) | 2006-04-17 | 2013-06-01 | Omnivision Tech Inc | Array imaging system and related method |
| US7954072B2 (en) * | 2006-05-15 | 2011-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Model import for electronic design automation |
| US8102408B2 (en) | 2006-06-29 | 2012-01-24 | Kla-Tencor Technologies Corp. | Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs |
| US20080074678A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Accuracy of optical metrology measurements |
| JP4851924B2 (en) * | 2006-12-08 | 2012-01-11 | 株式会社東芝 | Hazardous area counting method, pattern correction method and program |
| US7694244B2 (en) * | 2006-12-18 | 2010-04-06 | Cadence Design Systems, Inc. | Modeling and cross correlation of design predicted criticalities for optimization of semiconductor manufacturing |
| US7987150B1 (en) * | 2007-02-09 | 2011-07-26 | Siglaz | Method and apparatus for automated rule-based sourcing of substrate microfabrication defects |
| US7725845B1 (en) * | 2007-02-24 | 2010-05-25 | Cadence Design Systems, Inc. | System and method for layout optimization using model-based verification |
| US7689948B1 (en) * | 2007-02-24 | 2010-03-30 | Cadence Design Systems, Inc. | System and method for model-based scoring and yield prediction |
| JP4846635B2 (en) * | 2007-03-22 | 2011-12-28 | 株式会社東芝 | Pattern information generation method |
| JP4333770B2 (en) * | 2007-04-12 | 2009-09-16 | ソニー株式会社 | Mask pattern creation program, semiconductor manufacturing method, mask pattern creation method, and semiconductor design program |
| JP4958616B2 (en) * | 2007-04-20 | 2012-06-20 | 株式会社日立ハイテクノロジーズ | Hot spot narrowing device, hot spot narrowing method, hot spot narrowing program, hot spot inspection device, and hot spot inspection method |
| US7962863B2 (en) * | 2007-05-07 | 2011-06-14 | Kla-Tencor Corp. | Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer |
| US7707526B2 (en) * | 2007-05-25 | 2010-04-27 | Synopsys, Inc. | Predicting IC manufacturing yield based on hotspots |
| NL1036189A1 (en) * | 2007-12-05 | 2009-06-08 | Brion Tech Inc | Methods and System for Lithography Process Window Simulation. |
| US8260034B2 (en) | 2008-01-22 | 2012-09-04 | International Business Machines Corporation | Multi-modal data analysis for defect identification |
| NL1036558A1 (en) * | 2008-03-25 | 2009-09-28 | Asml Netherlands Bv | Method and lithographic apparatus for acquiring height data related to a substrate surface. |
| JP5225463B2 (en) * | 2008-06-03 | 2013-07-03 | エーエスエムエル ネザーランズ ビー．ブイ． | Lens heating compensation method |
| WO2009152046A1 (en) * | 2008-06-11 | 2009-12-17 | Kla-Tencor Corporation | Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof |
| NL2003654A (en) * | 2008-11-06 | 2010-05-10 | Brion Tech Inc | Methods and system for lithography calibration. |
| NL2003699A (en) | 2008-12-18 | 2010-06-21 | Brion Tech Inc | Method and system for lithography process-window-maximixing optical proximity correction. |
| US8312406B2 (en) * | 2009-06-22 | 2012-11-13 | Cadence Design Systems, Inc. | Method and system performing RC extraction |
| US8108803B2 (en) * | 2009-10-22 | 2012-01-31 | International Business Machines Corporation | Geometry based electrical hotspot detection in integrated circuit layouts |
| NL2005522A (en) * | 2009-10-28 | 2011-05-02 | Asml Netherlands Bv | Pattern selection for full-chip source and mask optimization. |
| CN102054074B (en) * | 2009-10-30 | 2015-06-24 | 新思科技有限公司 | Method and system for correcting photoetching hot spots in rear winding arrangement |
| KR101410846B1 (en) * | 2010-02-19 | 2014-06-23 | 에이에스엠엘 네델란즈 비.브이. | Lithographic apparatus and device manufacturing method |
| US8534135B2 (en) * | 2010-04-30 | 2013-09-17 | Nanometrics Incorporated | Local stress measurement |
| US9201022B2 (en) * | 2011-06-02 | 2015-12-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extraction of systematic defects |
| US8502146B2 (en) * | 2011-10-03 | 2013-08-06 | Kla-Tencor Corporation | Methods and apparatus for classification of defects using surface height attributes |
| US8935643B2 (en) * | 2011-10-06 | 2015-01-13 | Mentor Graphics Corporation | Parameter matching hotspot detection |
| US9053259B1 (en) * | 2011-11-28 | 2015-06-09 | Cadence Design Systems, Inc. | Methods, systems, and articles of manufacture for implementing pattern-based design enabled manufacturing of electronic circuit designs |
| US9858658B2 (en) * | 2012-04-19 | 2018-01-02 | Applied Materials Israel Ltd | Defect classification using CAD-based context attributes |
| US8843875B2 (en) * | 2012-05-08 | 2014-09-23 | Kla-Tencor Corporation | Measurement model optimization based on parameter variations across a wafer |
| US10330608B2 (en) * | 2012-05-11 | 2019-06-25 | Kla-Tencor Corporation | Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools |
| US8948495B2 (en) | 2012-08-01 | 2015-02-03 | Kla-Tencor Corp. | Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer |
| US9189844B2 (en) * | 2012-10-15 | 2015-11-17 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific information |
| NL2011683A (en) * | 2012-12-13 | 2014-06-16 | Asml Netherlands Bv | Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product. |
| US9092846B2 (en) * | 2013-02-01 | 2015-07-28 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific and multi-channel information |
| US9064084B2 (en) * | 2013-03-14 | 2015-06-23 | Globalfoundries Singapore Pte. Ltd. | Topography driven OPC and lithography flow |
| US9081919B2 (en) * | 2013-03-15 | 2015-07-14 | Globalfoundries Singapore Pte. Ltd. | Design-for-manufacturing—design-enabled-manufacturing (DFM-DEM) proactive integrated manufacturing flow |
| US9702829B1 (en) * | 2013-04-09 | 2017-07-11 | Kla-Tencor Corporation | Systems and methods for wafer surface feature detection and quantification |
| US9466101B2 (en) * | 2013-05-01 | 2016-10-11 | Taiwan Semiconductor Manufacturing Company Limited | Detection of defects on wafer during semiconductor fabrication |
| US9857291B2 (en) * | 2013-05-16 | 2018-01-02 | Kla-Tencor Corporation | Metrology system calibration refinement |
| US20150112649A1 (en) * | 2013-10-18 | 2015-04-23 | International Business Machines Corporation | Clustering Lithographic Hotspots Based on Frequency Domain Encoding |
| US10649347B2 (en) * | 2013-10-29 | 2020-05-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US9518932B2 (en) * | 2013-11-06 | 2016-12-13 | Kla-Tencor Corp. | Metrology optimized inspection |
| CN105849643B (en) * | 2013-12-17 | 2019-07-19 | Asml荷兰有限公司 | Yields estimation and control |
| SG11201610106SA (en) * | 2014-06-10 | 2016-12-29 | Asml Netherlands Bv | Computational wafer inspection |
| US9747520B2 (en) * | 2015-03-16 | 2017-08-29 | Kla-Tencor Corporation | Systems and methods for enhancing inspection sensitivity of an inspection tool |
| US10062158B2 (en) * | 2015-07-10 | 2018-08-28 | Globalwafers Co., Ltd. | Wafer nanotopography metrology for lithography based on thickness maps |
| US10181185B2 (en) * | 2016-01-11 | 2019-01-15 | Kla-Tencor Corp. | Image based specimen process control |
| US10796070B2 (en) * | 2018-07-19 | 2020-10-06 | Mentor Graphics Corporation | Layout pattern similarity determination based on binary turning function signatures |
| CN112969968B (en) * | 2018-11-08 | 2024-06-11 | Asml荷兰有限公司 | Prediction of disqualification based on spatial characteristics of process variability |
-
2015
- 2015-01-07 KR KR1020227003222A patent/KR102427139B1/en active Active
- 2015-01-07 JP JP2016549131A patent/JP6386569B2/en active Active
- 2015-01-07 KR KR1020167025138A patent/KR101939288B1/en active Active
- 2015-01-07 SG SG11201606207WA patent/SG11201606207WA/en unknown
- 2015-01-07 CN CN201580008223.5A patent/CN105980934B/en active Active
- 2015-01-07 EP EP15700059.7A patent/EP3105636B1/en active Active
- 2015-01-07 KR KR1020187036426A patent/KR102211093B1/en active Active
- 2015-01-07 KR KR1020217002743A patent/KR102359050B1/en active Active
- 2015-01-07 WO PCT/EP2015/050168 patent/WO2015120996A1/en active Application Filing
- 2015-01-07 CN CN201811040666.4A patent/CN109283800B/en active Active
- 2015-01-26 TW TW104102587A patent/TWI628696B/en active
- 2015-01-26 TW TW107106250A patent/TWI694487B/en active
- 2015-02-09 US US14/616,905 patent/US9990451B2/en active Active
-
2018
- 2018-06-04 US US15/996,899 patent/US11238189B2/en active Active
- 2018-06-15 JP JP2018114918A patent/JP6641422B2/en active Active
-
2022
- 2022-01-28 US US17/586,856 patent/US12141507B2/en active Active
-
2024
- 2024-10-28 US US18/928,905 patent/US20250053702A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN109283800B (en) | 2021-01-01 |
| US20250053702A1 (en) | 2025-02-13 |
| TW201532124A (en) | 2015-08-16 |
| CN109283800A (en) | 2019-01-29 |
| JP6386569B2 (en) | 2018-09-05 |
| US11238189B2 (en) | 2022-02-01 |
| US20220147665A1 (en) | 2022-05-12 |
| WO2015120996A1 (en) | 2015-08-20 |
| KR101939288B1 (en) | 2019-01-16 |
| KR102359050B1 (en) | 2022-02-08 |
| KR102427139B1 (en) | 2022-07-29 |
| KR20210014745A (en) | 2021-02-09 |
| TW201834016A (en) | 2018-09-16 |
| KR102211093B1 (en) | 2021-02-03 |
| US9990451B2 (en) | 2018-06-05 |
| TWI628696B (en) | 2018-07-01 |
| TWI694487B (en) | 2020-05-21 |
| JP2017505460A (en) | 2017-02-16 |
| KR20160122217A (en) | 2016-10-21 |
| JP6641422B2 (en) | 2020-02-05 |
| CN105980934A (en) | 2016-09-28 |
| JP2018194847A (en) | 2018-12-06 |
| CN105980934B (en) | 2018-10-09 |
| US20180330030A1 (en) | 2018-11-15 |
| EP3105636A1 (en) | 2016-12-21 |
| US12141507B2 (en) | 2024-11-12 |
| US20150227654A1 (en) | 2015-08-13 |
| KR20180136581A (en) | 2018-12-24 |
| KR20220019070A (en) | 2022-02-15 |
| EP3105636B1 (en) | 2023-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201606207WA (en) | Method of optimizing a process window | |
| PL3984740T3 (en) | A method of producing a veneered element | |
| HUE054565T2 (en) | Method of manufacturing a tube | |
| ZA201702613B (en) | A footlet as well as a method for producing such a footlet | |
| IL249868A0 (en) | A method | |
| GB201410050D0 (en) | Method of estimating well productivity along a section of a wellbore | |
| SG10201510345RA (en) | Method for producing a tube of glass | |
| SG11201703184SA (en) | A method of treatment | |
| IL252173A0 (en) | Method for producing methyl-dichloro-phosphane | |
| PT2955295T (en) | Method for manufacturing a panel | |
| HUE053000T2 (en) | Production method for stabilizers | |
| SG11201701326YA (en) | Method for producing oligosilane | |
| GB2522663B (en) | A method of selecting a region of interest | |
| GB201521886D0 (en) | A method of treating a well | |
| GB201421768D0 (en) | Method of manufacturing a seal | |
| GB201417695D0 (en) | Tooling production method | |
| GB201416350D0 (en) | A method of fitting | |
| LT2937159T (en) | Method of making a spanner | |
| ZA201604816B (en) | Method for producing a component | |
| HUE052742T2 (en) | Method for producing parts | |
| IL254917A (en) | A production method | |
| GB2543449B (en) | Method of completing a well | |
| GB2532330B (en) | Counter comprising a curved pane, method of producing a counter | |
| GB201423238D0 (en) | A method of ambandoning a well | |
| GB201401621D0 (en) | Method of manufacturing a panel |