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SG11201503676WA - SPUTTERING TARGET CONTAINING Co OR Fe - Google Patents

SPUTTERING TARGET CONTAINING Co OR Fe

Info

Publication number
SG11201503676WA
SG11201503676WA SG11201503676WA SG11201503676WA SG11201503676WA SG 11201503676W A SG11201503676W A SG 11201503676WA SG 11201503676W A SG11201503676W A SG 11201503676WA SG 11201503676W A SG11201503676W A SG 11201503676WA SG 11201503676W A SG11201503676W A SG 11201503676WA
Authority
SG
Singapore
Prior art keywords
sputtering target
target containing
sputtering
target
Prior art date
Application number
SG11201503676WA
Inventor
Atsutoshi Arakawa
Hideo Takami
Yuichiro Nakamura
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201503676WA publication Critical patent/SG11201503676WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0026—Matrix based on Ni, Co, Cr or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Thin Magnetic Films (AREA)
SG11201503676WA 2013-02-15 2014-01-24 SPUTTERING TARGET CONTAINING Co OR Fe SG11201503676WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013028388 2013-02-15
PCT/JP2014/051494 WO2014125897A1 (en) 2013-02-15 2014-01-24 SPUTTERING TARGET CONTAINING Co OR Fe

Publications (1)

Publication Number Publication Date
SG11201503676WA true SG11201503676WA (en) 2015-06-29

Family

ID=51353907

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503676WA SG11201503676WA (en) 2013-02-15 2014-01-24 SPUTTERING TARGET CONTAINING Co OR Fe

Country Status (6)

Country Link
JP (2) JP6332869B2 (en)
CN (1) CN104903488B (en)
MY (2) MY178171A (en)
SG (1) SG11201503676WA (en)
TW (1) TWI608114B (en)
WO (1) WO2014125897A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105056926A (en) * 2015-07-24 2015-11-18 武汉纺织大学 A novel TiO2/WO3-coated magnetic nanocomposite particle and its preparation method and use
JP6660130B2 (en) * 2015-09-18 2020-03-04 山陽特殊製鋼株式会社 CoFeB alloy target material
WO2017170138A1 (en) 2016-03-31 2017-10-05 Ｊｘ金属株式会社 Ferromagnetic material sputtering target
TWI702294B (en) * 2018-07-31 2020-08-21 日商田中貴金屬工業股份有限公司 Sputtering target for magnetic recording media
CN114600190B (en) * 2019-11-01 2024-10-29 田中贵金属工业株式会社 Sputtering target for heat-assisted magnetic recording medium
JP7317741B2 (en) * 2020-02-07 2023-07-31 Ｊｘ金属株式会社 Sputtering targets, magnetic films, and mixed raw material powders for making sputtering targets
JP2024010347A (en) * 2022-07-12 2024-01-24 田中貴金属工業株式会社 Co-Cr-Pt-oxide sputtering target

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000234168A (en) * 1998-12-07 2000-08-29 Japan Energy Corp Sputtering target for optical disk protective film formation
JP2009001860A (en) * 2007-06-21 2009-01-08 Mitsubishi Materials Corp Sputtering target for use in forming film of perpendicular magnetic recording medium having low relative magnetic permeability
JP5204460B2 (en) * 2007-10-24 2013-06-05 三井金属鉱業株式会社 Sputtering target for magnetic recording film and manufacturing method thereof
MY150804A (en) * 2009-03-27 2014-02-28 Jx Nippon Mining & Metals Corp Nonmagnetic material particle-dispersed ferromagnetic material sputtering target
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
MY157156A (en) * 2010-07-20 2016-05-13 Jx Nippon Mining & Metals Corp Sputtering target of ferromagnetic material with low generation of particles
MY156386A (en) * 2010-08-31 2016-02-15 Jx Nippon Mining & Metals Corp Fe-pt-based ferromagnetic material sputtering target
JP5888664B2 (en) * 2010-12-20 2016-03-22 Ｊｘ金属株式会社 Ferromagnetic sputtering target
CN103261471B (en) * 2010-12-20 2015-04-08 吉坤日矿日石金属株式会社 Fe-Pt ferromagnetic sputtering target and method for producing same
JP5563102B2 (en) * 2010-12-22 2014-07-30 Ｊｘ日鉱日石金属株式会社 Sintered sputtering target

Also Published As

Publication number Publication date
WO2014125897A1 (en) 2014-08-21
TW201443262A (en) 2014-11-16
CN104903488A (en) 2015-09-09
CN104903488B (en) 2018-02-16
TWI608114B (en) 2017-12-11
JP2017137570A (en) 2017-08-10
MY178171A (en) 2020-10-06
JP6359622B2 (en) 2018-07-18
JP6332869B2 (en) 2018-05-30
JPWO2014125897A1 (en) 2017-02-02
MY185389A (en) 2021-05-17

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