SG11201406151TA - Iii-nitride high electron mobility transistor structures and methods for fabrication of same - Google Patents
Iii-nitride high electron mobility transistor structures and methods for fabrication of sameInfo
- Publication number
- SG11201406151TA SG11201406151TA SG11201406151TA SG11201406151TA SG11201406151TA SG 11201406151T A SG11201406151T A SG 11201406151TA SG 11201406151T A SG11201406151T A SG 11201406151TA SG 11201406151T A SG11201406151T A SG 11201406151TA SG 11201406151T A SG11201406151T A SG 11201406151TA
- Authority
- SG
- Singapore
- Prior art keywords
- fabrication
- iii
- methods
- same
- electron mobility
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/477—Vertical HEMTs or vertical HHMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/114—PN junction isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/053—Manufacture or treatment of heterojunction diodes or of tunnel diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/343—Gate regions of field-effect devices having PN junction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/854—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG11201406151TA SG11201406151TA (en) | 2012-03-29 | 2013-03-28 | Iii-nitride high electron mobility transistor structures and methods for fabrication of same |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG2012022968 | 2012-03-29 | ||
| SG2012023164 | 2012-03-29 | ||
| SG2012022976 | 2012-03-29 | ||
| SG2012094637 | 2012-12-20 | ||
| SG2012095535 | 2012-12-26 | ||
| SG11201406151TA SG11201406151TA (en) | 2012-03-29 | 2013-03-28 | Iii-nitride high electron mobility transistor structures and methods for fabrication of same |
| PCT/SG2013/000125 WO2013147710A1 (en) | 2012-03-29 | 2013-03-28 | Iii-nitride high electron mobility transistor structures and methods for fabrication of same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201406151TA true SG11201406151TA (en) | 2014-10-30 |
Family
ID=54018193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201406151TA SG11201406151TA (en) | 2012-03-29 | 2013-03-28 | Iii-nitride high electron mobility transistor structures and methods for fabrication of same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20150255547A1 (en) |
| SG (1) | SG11201406151TA (en) |
| WO (1) | WO2013147710A1 (en) |
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| WO2012151466A2 (en) * | 2011-05-05 | 2012-11-08 | Arctic Sand Technologies, Inc. | Dc-dc converter with modular stages |
| US10680515B2 (en) | 2011-05-05 | 2020-06-09 | Psemi Corporation | Power converters with modular stages |
| US8743553B2 (en) | 2011-10-18 | 2014-06-03 | Arctic Sand Technologies, Inc. | Power converters with integrated capacitors |
| US8723491B2 (en) | 2011-12-19 | 2014-05-13 | Arctic Sand Technologies, Inc. | Control of power converters with capacitive energy transfer |
| JP6112491B2 (en) * | 2012-04-26 | 2017-04-12 | パナソニックIpマネジメント株式会社 | Semiconductor device and power conversion device |
| US8619445B1 (en) | 2013-03-15 | 2013-12-31 | Arctic Sand Technologies, Inc. | Protection of switched capacitor power converter |
| US8724353B1 (en) | 2013-03-15 | 2014-05-13 | Arctic Sand Technologies, Inc. | Efficient gate drivers for switched capacitor converters |
| US20150311138A1 (en) * | 2014-04-29 | 2015-10-29 | Qualcomm Incorporated | Transistors with improved thermal conductivity |
| CN104009076B (en) * | 2014-05-29 | 2017-04-12 | 西安电子科技大学 | AlGaN/GaN heterojunction field effect transistor |
| KR102135163B1 (en) * | 2014-06-26 | 2020-07-20 | 한국전자통신연구원 | Semiconductor device and fabrication method thereof |
| US9571093B2 (en) | 2014-09-16 | 2017-02-14 | Navitas Semiconductor, Inc. | Half bridge driver circuits |
| US9859732B2 (en) | 2014-09-16 | 2018-01-02 | Navitas Semiconductor, Inc. | Half bridge power conversion circuits using GaN devices |
| US9960154B2 (en) * | 2014-09-19 | 2018-05-01 | Navitas Semiconductor, Inc. | GaN structures |
| WO2016149063A1 (en) | 2015-03-13 | 2016-09-22 | Arctic Sand Technologies, Inc. | Dc-dc transformer with inductor for the facilitation of adiabatic inter-capacitor charge transport |
| US9679762B2 (en) * | 2015-03-17 | 2017-06-13 | Toshiba Corporation | Access conductivity enhanced high electron mobility transistor |
| WO2017007991A1 (en) | 2015-07-08 | 2017-01-12 | Arctic Sand Technologies, Inc. | Switched-capacitor power converters |
| CN105140270B (en) * | 2015-07-29 | 2018-01-09 | 电子科技大学 | A kind of enhanced HEMT device |
| JPWO2017038139A1 (en) * | 2015-08-28 | 2018-04-12 | シャープ株式会社 | Nitride semiconductor device |
| JP2017055008A (en) * | 2015-09-11 | 2017-03-16 | 株式会社東芝 | Semiconductor device |
| ITUB20155862A1 (en) | 2015-11-24 | 2017-05-24 | St Microelectronics Srl | NORMALLY OFF TYPE TRANSISTOR WITH REDUCED RESISTANCE IN THE STATE ON AND RELATIVE MANUFACTURING METHOD |
| WO2017111829A1 (en) * | 2015-12-26 | 2017-06-29 | Intel Corporation | Thin film switching device |
| US9831867B1 (en) | 2016-02-22 | 2017-11-28 | Navitas Semiconductor, Inc. | Half bridge driver circuits |
| US10217827B2 (en) * | 2016-05-11 | 2019-02-26 | Rfhic Corporation | High electron mobility transistor (HEMT) |
| DE102016015475B3 (en) * | 2016-12-28 | 2018-01-11 | 3-5 Power Electronics GmbH | IGBT semiconductor structure |
| WO2018220741A1 (en) * | 2017-05-31 | 2018-12-06 | 三菱電機株式会社 | Semiconductor device production method |
| US10615273B2 (en) * | 2017-06-21 | 2020-04-07 | Cree, Inc. | Semiconductor devices having a plurality of unit cell transistors that have smoothed turn-on behavior and improved linearity |
| US10978583B2 (en) | 2017-06-21 | 2021-04-13 | Cree, Inc. | Semiconductor devices having a plurality of unit cell transistors that have smoothed turn-on behavior and improved linearity |
| GB2564482B (en) * | 2017-07-14 | 2021-02-10 | Cambridge Entpr Ltd | A power semiconductor device with a double gate structure |
| US10811514B2 (en) * | 2018-03-28 | 2020-10-20 | Semiconductor Components Industries, Llc | Electronic device including an enhancement-mode HEMT and a method of using the same |
| CN110752211A (en) * | 2018-07-23 | 2020-02-04 | 西安电子科技大学 | Diode bidirectional amplitude limiting circuit based on vertical PIN and manufacturing method |
| CN110752186B (en) * | 2018-07-23 | 2024-05-24 | 西安电子科技大学 | A millimeter wave over-protection circuit based on gallium nitride and its preparation method |
| WO2020051285A1 (en) * | 2018-09-05 | 2020-03-12 | The University Of Texas At Austin | Lateral semiconductor device and method of manufacture |
| US11398551B2 (en) * | 2019-05-07 | 2022-07-26 | United States Of America As Represented By The Secretary Of The Air Force | Self-aligned gate and drift design for high-critical field strength semiconductor power transistors with ion implantation |
| US12382651B2 (en) | 2019-05-07 | 2025-08-05 | Cambridge Gan Devices Limited | Power semiconductor device with an auxiliary gate structure |
| US11127847B2 (en) * | 2019-05-16 | 2021-09-21 | Vanguard International Semiconductor Corporation | Semiconductor devices having a gate field plate including an extension portion and methods for fabricating the semiconductor device |
| US10720913B1 (en) * | 2019-05-28 | 2020-07-21 | Infineon Technologies Austria Ag | Integrated failsafe pulldown circuit for GaN switch |
| TWI811394B (en) * | 2019-07-09 | 2023-08-11 | 聯華電子股份有限公司 | High electron mobility transistor and method for fabricating the same |
| US10958268B1 (en) | 2019-09-04 | 2021-03-23 | Infineon Technologies Austria Ag | Transformer-based driver for power switches |
| US10979032B1 (en) | 2020-01-08 | 2021-04-13 | Infineon Technologies Austria Ag | Time-programmable failsafe pulldown circuit for GaN switch |
| CN112204753B (en) * | 2020-07-07 | 2022-11-29 | 英诺赛科(珠海)科技有限公司 | Semiconductor device and method for manufacturing the same |
| WO2022076338A1 (en) * | 2020-10-06 | 2022-04-14 | The Penn State Research Foundation | Super-heterojunction schottky diode |
| TWI771983B (en) * | 2021-04-14 | 2022-07-21 | 國立中山大學 | Defect detection method of gan high electron mobility transistor |
| EP4106007A1 (en) * | 2021-06-16 | 2022-12-21 | Imec VZW | Iii-v semiconductor field-effect transistor |
| CN113594226B (en) * | 2021-07-07 | 2024-01-23 | 西安电子科技大学 | High-linearity HEMT device based on planar nanowire channel and preparation method |
| CN113690311B (en) * | 2021-08-30 | 2023-04-25 | 电子科技大学 | GaN HEMT device integrated with flywheel diode |
| CN114203797B (en) * | 2021-11-29 | 2023-03-21 | 西安电子科技大学 | Super junction gallium oxide transistor based on heterojunction and manufacturing method and application thereof |
| CN114256330B (en) * | 2021-12-22 | 2023-05-26 | 电子科技大学 | Super-junction IGBT terminal structure |
| EP4213215A1 (en) * | 2022-01-12 | 2023-07-19 | Nexperia B.V. | Multi-finger high-electron mobility transistor |
| CN116960150A (en) * | 2022-04-19 | 2023-10-27 | 联华电子股份有限公司 | high electron mobility transistor |
| CN115084232B (en) * | 2022-07-21 | 2023-01-17 | 北京芯可鉴科技有限公司 | Heterojunction transverse double-diffusion field effect transistor, manufacturing method, chip and circuit |
| US12176887B2 (en) | 2022-10-17 | 2024-12-24 | Infineon Technologies Austria Ag | Transformer-based drive for GaN devices |
| US12368383B2 (en) | 2023-03-13 | 2025-07-22 | Infineon Technologies Austria Ag | Isolated DC/DC converter and power electronics system |
| WO2025115271A1 (en) * | 2023-11-30 | 2025-06-05 | パナソニックIpマネジメント株式会社 | Nitride semiconductor device |
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| US8809867B2 (en) * | 2002-04-15 | 2014-08-19 | The Regents Of The University Of California | Dislocation reduction in non-polar III-nitride thin films |
| EP1495168B1 (en) * | 2002-04-15 | 2014-06-11 | The Regents of The University of California | Method of growing non-polar a-plane or m-plane gallium nitride thin films by metalorganic chemical vapor deposition and structure obtained thereby |
| US7858996B2 (en) * | 2006-02-17 | 2010-12-28 | The Regents Of The University Of California | Method for growth of semipolar (Al,In,Ga,B)N optoelectronic devices |
| KR101045573B1 (en) * | 2005-07-06 | 2011-07-01 | 인터내쇼널 렉티파이어 코포레이션 | III-nitride enhancement mode element |
| US7972915B2 (en) * | 2005-11-29 | 2011-07-05 | The Hong Kong University Of Science And Technology | Monolithic integration of enhancement- and depletion-mode AlGaN/GaN HFETs |
| US8044432B2 (en) * | 2005-11-29 | 2011-10-25 | The Hong Kong University Of Science And Technology | Low density drain HEMTs |
| US7932539B2 (en) * | 2005-11-29 | 2011-04-26 | The Hong Kong University Of Science And Technology | Enhancement-mode III-N devices, circuits, and methods |
| JP2008034411A (en) * | 2006-07-26 | 2008-02-14 | Toshiba Corp | Nitride semiconductor device |
| US7985986B2 (en) * | 2008-07-31 | 2011-07-26 | Cree, Inc. | Normally-off semiconductor devices |
| JP4786730B2 (en) * | 2009-05-28 | 2011-10-05 | シャープ株式会社 | Field effect transistor and manufacturing method thereof |
| WO2011163318A2 (en) * | 2010-06-23 | 2011-12-29 | Cornell University | Gated iii-v semiconductor structure and method |
| US9653286B2 (en) * | 2012-02-14 | 2017-05-16 | Hexagem Ab | Gallium nitride nanowire based electronics |
| US9276097B2 (en) * | 2012-03-30 | 2016-03-01 | Infineon Technologies Austria Ag | Gate overvoltage protection for compound semiconductor transistors |
| US8878249B2 (en) * | 2012-04-12 | 2014-11-04 | The Regents Of The University Of California | Method for heteroepitaxial growth of high channel conductivity and high breakdown voltage nitrogen polar high electron mobility transistors |
| US9142550B2 (en) * | 2013-06-18 | 2015-09-22 | Infineon Technologies Austria Ag | High-voltage cascaded diode with HEMT and monolithically integrated semiconductor diode |
-
2013
- 2013-03-28 SG SG11201406151TA patent/SG11201406151TA/en unknown
- 2013-03-28 WO PCT/SG2013/000125 patent/WO2013147710A1/en not_active Ceased
- 2013-03-28 US US14/389,043 patent/US20150255547A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013147710A1 (en) | 2013-10-03 |
| US20150255547A1 (en) | 2015-09-10 |
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