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SG10201704180PA - Method and apparatus for processing wafer-shaped articles - Google Patents

Method and apparatus for processing wafer-shaped articles

Info

Publication number
SG10201704180PA
SG10201704180PA SG10201704180PA SG10201704180PA SG10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA SG 10201704180P A SG10201704180P A SG 10201704180PA
Authority
SG
Singapore
Prior art keywords
shaped articles
processing wafer
wafer
processing
articles
Prior art date
Application number
SG10201704180PA
Inventor
Mui David
Berney Butch
Goller Alois
Ravkin Mike
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of SG10201704180PA publication Critical patent/SG10201704180PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG10201704180PA 2016-05-31 2017-05-23 Method and apparatus for processing wafer-shaped articles SG10201704180PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/169,330 US10720343B2 (en) 2016-05-31 2016-05-31 Method and apparatus for processing wafer-shaped articles

Publications (1)

Publication Number Publication Date
SG10201704180PA true SG10201704180PA (en) 2017-12-28

Family

ID=60418268

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201704180PA SG10201704180PA (en) 2016-05-31 2017-05-23 Method and apparatus for processing wafer-shaped articles

Country Status (6)

Country Link
US (2) US10720343B2 (en)
JP (2) JP7231321B2 (en)
KR (1) KR102101536B1 (en)
CN (1) CN107452654B (en)
SG (1) SG10201704180PA (en)
TW (1) TWI734788B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10861719B2 (en) 2016-05-31 2020-12-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles

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US10658204B2 (en) 2017-08-08 2020-05-19 Lam Research Ag Spin chuck with concentrated center and radial heating
US11043403B2 (en) 2018-04-06 2021-06-22 Semes Co., Ltd. Substrate support unit and substrate processing apparatus having the same including reflective member configured to reflect light toward substrate
KR102208753B1 (en) * 2018-04-06 2021-01-28 세메스 주식회사 Substrate supporting unit and substrate processing apparatus using the same
KR102078157B1 (en) 2018-04-16 2020-02-17 세메스 주식회사 Substrate heating unit and substrate processing apparatus using the same
JP7175119B2 (en) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
KR102244605B1 (en) 2018-09-20 2021-04-26 주식회사 에이치에스하이테크 Apparatus for processing wafer
KR102102277B1 (en) 2018-09-20 2020-04-20 주식회사 에이치에스하이테크 Apparatus for processing wafer
KR102102202B1 (en) * 2018-11-07 2020-04-21 세메스 주식회사 Apparatus and system for treating substrate
GB201900912D0 (en) 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
GB201901637D0 (en) * 2019-02-06 2019-03-27 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
KR102232654B1 (en) * 2019-08-05 2021-03-26 주식회사 에이치에스하이테크 Led spin chuck
KR102303593B1 (en) * 2019-11-05 2021-09-23 세메스 주식회사 Apparatus and Method for treating substrate
KR102347145B1 (en) * 2020-01-29 2022-01-04 무진전자 주식회사 Substrate processing apparatus using light source built in spin chuck
GB202002798D0 (en) 2020-02-27 2020-04-15 Lam Res Ag Apparatus for processing a wafer
WO2021202171A1 (en) * 2020-04-01 2021-10-07 Lam Research Corporation Rapid and precise temperature control for thermal etching
KR102347146B1 (en) * 2020-06-09 2022-01-04 무진전자 주식회사 Substrate processing apparatus using light source
GB202015527D0 (en) 2020-09-30 2020-11-11 Lam Res Ag Apparatus for processing wafer-shaped articles
GB202016750D0 (en) 2020-10-22 2020-12-09 Lam Res Ag Apparatus for processing a wafer-shaped article
KR102584511B1 (en) * 2020-12-07 2023-10-06 세메스 주식회사 Supproting unit and substrate treating apparutus including the same
GB202101428D0 (en) 2021-02-02 2021-03-17 Lam Res Ag Apparatus for dispensing a liquid
JP7625458B2 (en) * 2021-03-22 2025-02-03 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
JP2025037020A (en) * 2023-09-05 2025-03-17 ウシオ電機株式会社 Light source unit
GB202315890D0 (en) 2023-10-17 2023-11-29 Lam Res Ag Apparatus for processing a wafer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10861719B2 (en) 2016-05-31 2020-12-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Also Published As

Publication number Publication date
CN107452654A (en) 2017-12-08
US20200227284A1 (en) 2020-07-16
US10861719B2 (en) 2020-12-08
CN107452654B (en) 2020-11-24
TWI734788B (en) 2021-08-01
KR102101536B1 (en) 2020-04-17
TW201806058A (en) 2018-02-16
JP2017224807A (en) 2017-12-21
JP2022058827A (en) 2022-04-12
JP7324323B2 (en) 2023-08-09
KR20170135714A (en) 2017-12-08
US10720343B2 (en) 2020-07-21
JP7231321B2 (en) 2023-03-01
US20170345681A1 (en) 2017-11-30

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