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SE9701724D0 - A pn-diode of SiC and a method for production thereof - Google Patents

A pn-diode of SiC and a method for production thereof

Info

Publication number
SE9701724D0
SE9701724D0 SE9701724A SE9701724A SE9701724D0 SE 9701724 D0 SE9701724 D0 SE 9701724D0 SE 9701724 A SE9701724 A SE 9701724A SE 9701724 A SE9701724 A SE 9701724A SE 9701724 D0 SE9701724 D0 SE 9701724D0
Authority
SE
Sweden
Prior art keywords
drift layer
portions
junction
grid
sic
Prior art date
Application number
SE9701724A
Other languages
English (en)
Inventor
Kurt Rottner
Adolf Schoener
Mietek Bakowski
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Priority to SE9701724A priority Critical patent/SE9701724D0/sv
Publication of SE9701724D0 publication Critical patent/SE9701724D0/sv
Priority to US08/859,844 priority patent/US5902117A/en
Priority to EP98904481A priority patent/EP0980589A1/en
Priority to PCT/SE1998/000239 priority patent/WO1998052232A1/en
Priority to JP54910798A priority patent/JP2001525990A/ja

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/01Manufacture or treatment
    • H10D8/051Manufacture or treatment of Schottky diodes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/931Silicon carbide semiconductor

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
SE9701724A 1997-05-09 1997-05-09 A pn-diode of SiC and a method for production thereof SE9701724D0 (sv)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE9701724A SE9701724D0 (sv) 1997-05-09 1997-05-09 A pn-diode of SiC and a method for production thereof
US08/859,844 US5902117A (en) 1997-05-09 1997-05-21 PN-diode of SiC and a method for production thereof
EP98904481A EP0980589A1 (en) 1997-05-09 1998-02-12 A PN-DIODE OF SiC AND A METHOD FOR PRODUCTION THEREOF
PCT/SE1998/000239 WO1998052232A1 (en) 1997-05-09 1998-02-12 A PN-DIODE OF SiC AND A METHOD FOR PRODUCTION THEREOF
JP54910798A JP2001525990A (ja) 1997-05-09 1998-02-12 SiCからなるpn型ダイオードおよびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9701724A SE9701724D0 (sv) 1997-05-09 1997-05-09 A pn-diode of SiC and a method for production thereof
US08/859,844 US5902117A (en) 1997-05-09 1997-05-21 PN-diode of SiC and a method for production thereof

Publications (1)

Publication Number Publication Date
SE9701724D0 true SE9701724D0 (sv) 1997-05-09

Family

ID=26662982

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9701724A SE9701724D0 (sv) 1997-05-09 1997-05-09 A pn-diode of SiC and a method for production thereof

Country Status (3)

Country Link
US (1) US5902117A (sv)
SE (1) SE9701724D0 (sv)
WO (1) WO1998052232A1 (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524900B2 (en) * 2001-07-25 2003-02-25 Abb Research, Ltd Method concerning a junction barrier Schottky diode, such a diode and use thereof
US6791161B2 (en) * 2002-04-08 2004-09-14 Fabtech, Inc. Precision Zener diodes
DE102005011702A1 (de) * 2004-03-11 2005-09-29 Siced Electronics Development Gmbh & Co. Kg Halbleiterbauelement, insbesondere Diode, und zugehöriges Herstellungsverfahren
DE102005011703A1 (de) * 2004-03-11 2005-09-29 Siced Electronics Development Gmbh & Co. Kg pn-Diode auf der Basis von Silicumcarbid und Verfahren zu deren Herstellung
US8901699B2 (en) 2005-05-11 2014-12-02 Cree, Inc. Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection
JP5061506B2 (ja) * 2006-06-05 2012-10-31 富士電機株式会社 炭化珪素半導体装置の製造方法
DE102007024461B4 (de) 2007-05-25 2012-10-11 Infineon Technologies Austria Ag Halbleiterelement und Verfahren zu seiner Herstellung
JP6029397B2 (ja) * 2012-09-14 2016-11-24 三菱電機株式会社 炭化珪素半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153904A (en) * 1977-10-03 1979-05-08 Texas Instruments Incorporated Semiconductor device having a high breakdown voltage junction characteristic
DE2846637A1 (de) * 1978-10-11 1980-04-30 Bbc Brown Boveri & Cie Halbleiterbauelement mit mindestens einem planaren pn-uebergang und zonen- guard-ringen
GB2134705B (en) * 1983-01-28 1985-12-24 Philips Electronic Associated Semiconductor devices
US4771011A (en) * 1984-05-09 1988-09-13 Analog Devices, Incorporated Ion-implanted process for forming IC wafer with buried-Zener diode and IC structure made with such process
US5318915A (en) * 1993-01-25 1994-06-07 North Carolina State University At Raleigh Method for forming a p-n junction in silicon carbide
DE4405815A1 (de) * 1993-02-24 1994-08-25 Samsung Electronics Co Ltd Halbleitervorrichtung mit einer Anodenschicht, die durch selektive Diffusion ausgebildete Bereiche geringerer Konzentration aufweist
SE9601176D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A method for producing a semiconductor device having semiconductor layers of SiC by the use of an implanting step and a device produced thereby
SE9601174D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A method for producing a semiconductor device having a semiconductor layer of SiC and such a device
SE9601175D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A method for producing a semiconductor device by the use of an implanting step and a device produced thereby
SE9602745D0 (sv) * 1996-07-11 1996-07-11 Abb Research Ltd A method for producing a channel region layer in a SiC-layer for a voltage controlled semiconductor device
US5801836A (en) * 1996-07-16 1998-09-01 Abb Research Ltd. Depletion region stopper for PN junction in silicon carbide

Also Published As

Publication number Publication date
WO1998052232A1 (en) 1998-11-19
US5902117A (en) 1999-05-11

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