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SE9601172D0 - Insulated gate bipolar transistor having a trench and a method for procuction thereof - Google Patents

Insulated gate bipolar transistor having a trench and a method for procuction thereof

Info

Publication number
SE9601172D0
SE9601172D0 SE9601172A SE9601172A SE9601172D0 SE 9601172 D0 SE9601172 D0 SE 9601172D0 SE 9601172 A SE9601172 A SE 9601172A SE 9601172 A SE9601172 A SE 9601172A SE 9601172 D0 SE9601172 D0 SE 9601172D0
Authority
SE
Sweden
Prior art keywords
layer
trench
type
highly doped
source region
Prior art date
Application number
SE9601172A
Other languages
English (en)
Inventor
Mietek Bakowski
Christopher Harris
Ulf Gustafsson
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Priority to SE9601172A priority Critical patent/SE9601172D0/sv
Publication of SE9601172D0 publication Critical patent/SE9601172D0/sv
Priority to US08/637,105 priority patent/US5763902A/en
Priority to EP97915821A priority patent/EP0890191A1/en
Priority to PCT/SE1997/000531 priority patent/WO1997036329A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • H10D12/032Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/035Etching a recess in the emitter region 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
SE9601172A 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof SE9601172D0 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9601172A SE9601172D0 (sv) 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof
US08/637,105 US5763902A (en) 1996-03-27 1996-04-24 Insulated gate bipolar transistor having a trench and a method for production thereof
EP97915821A EP0890191A1 (en) 1996-03-27 1997-03-26 Insulated gate bipolar transistor having a trench and a method for production thereof
PCT/SE1997/000531 WO1997036329A1 (en) 1996-03-27 1997-03-26 Insulated gate bipolar transistor having a trench and a method for production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9601172A SE9601172D0 (sv) 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof
US08/637,105 US5763902A (en) 1996-03-27 1996-04-24 Insulated gate bipolar transistor having a trench and a method for production thereof

Publications (1)

Publication Number Publication Date
SE9601172D0 true SE9601172D0 (sv) 1996-03-27

Family

ID=26662558

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9601172A SE9601172D0 (sv) 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof

Country Status (3)

Country Link
US (1) US5763902A (sv)
SE (1) SE9601172D0 (sv)
WO (1) WO1997036329A1 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180958B1 (en) * 1997-02-07 2001-01-30 James Albert Cooper, Jr. Structure for increasing the maximum voltage of silicon carbide power transistors
SE9800286D0 (sv) * 1998-02-02 1998-02-02 Abb Research Ltd A transistor of SiC
CN117457731B (zh) * 2023-12-22 2024-05-28 深圳天狼芯半导体有限公司 一种栅极下方具有P型空间层的SiC垂直IGBT及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542077A (en) * 1977-06-08 1979-01-09 Hitachi Ltd Semiconductor switching element
US4466173A (en) * 1981-11-23 1984-08-21 General Electric Company Methods for fabricating vertical channel buried grid field controlled devices including field effect transistors and field controlled thyristors utilizing etch and refill techniques
US5173435A (en) * 1987-11-11 1992-12-22 Mitsubishi Denki Kabushiki Kaisha Insulated gate bipolar transistor
JPH0817233B2 (ja) * 1987-11-11 1996-02-21 三菱電機株式会社 絶縁ゲート型バイポーラトランジスタ
US5233215A (en) * 1992-06-08 1993-08-03 North Carolina State University At Raleigh Silicon carbide power MOSFET with floating field ring and floating field plate
US5506421A (en) * 1992-11-24 1996-04-09 Cree Research, Inc. Power MOSFET in silicon carbide
US5396087A (en) * 1992-12-14 1995-03-07 North Carolina State University Insulated gate bipolar transistor with reduced susceptibility to parasitic latch-up
US5397717A (en) * 1993-07-12 1995-03-14 Motorola, Inc. Method of fabricating a silicon carbide vertical MOSFET

Also Published As

Publication number Publication date
US5763902A (en) 1998-06-09
WO1997036329A1 (en) 1997-10-02

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