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SE9203531D0 - COOLERS FOR POWER ELECTRONICS - Google Patents

COOLERS FOR POWER ELECTRONICS

Info

Publication number
SE9203531D0
SE9203531D0 SE9203531A SE9203531A SE9203531D0 SE 9203531 D0 SE9203531 D0 SE 9203531D0 SE 9203531 A SE9203531 A SE 9203531A SE 9203531 A SE9203531 A SE 9203531A SE 9203531 D0 SE9203531 D0 SE 9203531D0
Authority
SE
Sweden
Prior art keywords
power electronics
layer
conducting
plate
coolers
Prior art date
Application number
SE9203531A
Other languages
Swedish (sv)
Other versions
SE9203531L (en
SE470369B (en
Inventor
W Belwon
Original Assignee
Asea Brown Boveri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Brown Boveri filed Critical Asea Brown Boveri
Priority to SE9203531A priority Critical patent/SE470369B/en
Publication of SE9203531D0 publication Critical patent/SE9203531D0/en
Priority to PCT/SE1993/000825 priority patent/WO1994013013A1/en
Publication of SE9203531L publication Critical patent/SE9203531L/en
Publication of SE470369B publication Critical patent/SE470369B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a substrate (10) integrated with a cooler, for power electronics elements. The substrate comprises an electrically insulating, heat conducting plate (12), each side of which is joined to a layer (14, 16) of electrically conducting and heat conducting material. One conducting layer (14) has a circuit pattern and acts as the support for at least one power electronics element, such as a power semiconductor. According to the invention the other conducting layer (16) is made with a many times greater area than the electrically insulating plate (12), and the portion (18-32) of said other layer (16) extending outside the plate is folded into a heat sink.
SE9203531A 1992-11-24 1992-11-24 With cooler integrated substrate for power electronics elements SE470369B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE9203531A SE470369B (en) 1992-11-24 1992-11-24 With cooler integrated substrate for power electronics elements
PCT/SE1993/000825 WO1994013013A1 (en) 1992-11-24 1993-10-11 Cooler integrated substrate for power electronics elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9203531A SE470369B (en) 1992-11-24 1992-11-24 With cooler integrated substrate for power electronics elements

Publications (3)

Publication Number Publication Date
SE9203531D0 true SE9203531D0 (en) 1992-11-24
SE9203531L SE9203531L (en) 1994-01-31
SE470369B SE470369B (en) 1994-01-31

Family

ID=20387919

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9203531A SE470369B (en) 1992-11-24 1992-11-24 With cooler integrated substrate for power electronics elements

Country Status (2)

Country Link
SE (1) SE470369B (en)
WO (1) WO1994013013A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3595002A1 (en) * 2018-07-12 2020-01-15 Heraeus Deutschland GmbH & Co KG Metal-ceramic substrate with a film formed for direct cooling as substrate bottom

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2113470A (en) * 1982-01-14 1983-08-03 Redpoint Limited Heat sink
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices

Also Published As

Publication number Publication date
WO1994013013A1 (en) 1994-06-09
SE9203531L (en) 1994-01-31
SE470369B (en) 1994-01-31

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