[go: up one dir, main page]

SE8103205L - Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel - Google Patents

Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel

Info

Publication number
SE8103205L
SE8103205L SE8103205A SE8103205A SE8103205L SE 8103205 L SE8103205 L SE 8103205L SE 8103205 A SE8103205 A SE 8103205A SE 8103205 A SE8103205 A SE 8103205A SE 8103205 L SE8103205 L SE 8103205L
Authority
SE
Sweden
Prior art keywords
atminstone
nickel
containing palladium
pallet containing
metals copper
Prior art date
Application number
SE8103205A
Other languages
English (en)
Other versions
SE426178B (sv
Inventor
J Skowronek
O Persson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE8103205A priority Critical patent/SE426178B/sv
Priority to AT82901553T priority patent/ATE18579T1/de
Priority to JP57501543A priority patent/JPS58500765A/ja
Priority to EP82901553A priority patent/EP0079356B1/en
Priority to PCT/SE1982/000154 priority patent/WO1982004072A1/en
Priority to DE8282901553T priority patent/DE3269785D1/de
Publication of SE8103205L publication Critical patent/SE8103205L/sv
Publication of SE426178B publication Critical patent/SE426178B/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE8103205A 1981-05-21 1981-05-21 Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel SE426178B (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE8103205A SE426178B (sv) 1981-05-21 1981-05-21 Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel
AT82901553T ATE18579T1 (de) 1981-05-21 1982-05-06 Ein verfahren zum chemischen abziehen von metallueberzuegen die palladium enthalten sowie mindestens eines der metalle kupfer und nickel, sowie ein bad zur ausfuehrung dieses verfahrens.
JP57501543A JPS58500765A (ja) 1981-05-21 1982-05-06 パラジウムと銅およびニツケルの少くとも一方の金属とを含むめつき層を化学的に剥離する方法および該方法に使用する浴
EP82901553A EP0079356B1 (en) 1981-05-21 1982-05-06 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method
PCT/SE1982/000154 WO1982004072A1 (en) 1981-05-21 1982-05-06 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method
DE8282901553T DE3269785D1 (en) 1981-05-21 1982-05-06 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8103205A SE426178B (sv) 1981-05-21 1981-05-21 Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel

Publications (2)

Publication Number Publication Date
SE8103205L true SE8103205L (sv) 1982-11-22
SE426178B SE426178B (sv) 1982-12-13

Family

ID=20343892

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8103205A SE426178B (sv) 1981-05-21 1981-05-21 Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel

Country Status (5)

Country Link
EP (1) EP0079356B1 (sv)
JP (1) JPS58500765A (sv)
DE (1) DE3269785D1 (sv)
SE (1) SE426178B (sv)
WO (1) WO1982004072A1 (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1209886A (en) * 1982-01-11 1986-08-19 Thomas W. Bleeks Peroxide selective stripping compositions and method
JPS63172799A (ja) * 1987-01-12 1988-07-16 日本パ−カライジング株式会社 アルミニウムの表面洗浄剤
GB8829253D0 (en) * 1988-12-15 1989-01-25 Imasa Ltd Method of removing deposits of tin lead or tin/lead alloys from copper substrates and compositions for use therein
DE19635981C2 (de) * 1996-09-05 1998-12-24 Peter Prof Dr Ing Mutschler Verfahren zur direkten Regelung der Geschwindigkeit eines elektrischen Antriebes
KR100761608B1 (ko) * 2000-07-26 2007-09-27 미츠비시 가스 가가쿠 가부시키가이샤 팔라듐 제거액 및 팔라듐 제거방법
JP6236824B2 (ja) * 2012-03-29 2017-11-29 宇部興産株式会社 プリント配線基板の製造方法
KR20170008309A (ko) * 2014-07-10 2017-01-23 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 도금 방법
EP3168332B2 (en) 2015-03-13 2023-07-26 Okuno Chemical Industries Co., Ltd. Use of a jig electrolytic stripper for removing palladium from an object and a method for removing palladium
CN106245030A (zh) * 2016-09-14 2016-12-21 佛山科学技术学院 一种钯镍合金镀层退镀的化学退镀液及退镀方法
CN110629224B (zh) * 2019-10-15 2022-03-18 昆山市板明电子科技有限公司 环境友好型退镍剂及其制备方法和使用方法
CN112111740A (zh) * 2020-09-24 2020-12-22 深圳市松柏实业发展有限公司 镍磷镀层的褪除液、制备方法以及镍磷层的褪除方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945865A (en) * 1974-07-22 1976-03-23 Dart Environment And Services Company Metal dissolution process

Also Published As

Publication number Publication date
SE426178B (sv) 1982-12-13
JPS58500765A (ja) 1983-05-12
EP0079356B1 (en) 1986-03-12
WO1982004072A1 (en) 1982-11-25
DE3269785D1 (en) 1986-04-17
EP0079356A1 (en) 1983-05-25

Similar Documents

Publication Publication Date Title
ATA319682A (de) Elektronisches geraet
GB2022880B (en) Electronic alarm clock
BR8102742A (pt) Espoleta eletronica
JPS5281769A (en) Housing and strainer assembly
SE8103205L (sv) Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel
FI811751A0 (fi) Anordning foer att avlaegsna gas fraon pappersmassasuspension
IT8222125A1 (it) Elemento filtrante
FI814107L (fi) Valsning av metall
FI801984A (fi) Hydrometallurgiskt foerfarande foer utvinning av vaerdemetaller ur metalliska legeringar
JPS57166535A (en) Electronic thermometer
GB2084329B (en) Electronic thermometer
GB2022145B (en) Sintering silver alloys
NO834868L (no) Reaksjonssintret oksyd-borid
JPS57201995A (en) Input protection circuit
GB2043976B (en) Electronic alarm circuit
DK455582A (da) Elektronisk varselsanlaeg
FI830771L (fi) Elektronisk vaog
FI822593L (fi) Elektroniska byggdelar
JPS53123355A (en) Soldering of article containing copper element
GB2007412B (en) Electronic flow presetter
JPS57196600A (en) Electronic device containing trestle
IT7868686A0 (it) Filtro elettronico di sicurezza
FI813307L (fi) Foerfarande foer framstaellning av en haolprofil av metall
BR8107332A (pt) Bijuteria eletronica
KR830003289U (ko) 전자기기장치