RU228529U1 - LED module - Google Patents

Abstract

The utility model relates to light-emitting diodes, specifically to modules of light-signaling and lighting systems. The technical result is an increase in the efficiency of heat removal from LEDs and dissipation of the removed heat into the surrounding space. A LED module with LEDs on a heat-dissipating substrate coated with a polymer layer, with a heat-dissipating substrate of predominantly rectangular shape made of metal with low thermal resistance including an electrically insulating but heat-conducting material with low thermal resistance, facilitating heat dissipation through the heat-dissipating substrate with low thermal resistance, a polymer layer with phosphors, at least two holes are made in the heat-dissipating substrate, and the area of the heat-dissipating substrate is more than 10 times greater than the area of at least one LED located on the heat-dissipating substrate.

Description

Field of technology

The technical solution relates to light-emitting diodes, specifically to modules of light-signaling and lighting systems.

State of the art

An analogue of the declared LED module is the “Lighting device on LEDs” Russian Federation patent for invention 2367842, according to IPC F21S 8/00, published 20.09.2009 with LEDs and a plate heat sink.

The disadvantage of this design is the insufficiently high efficiency of heat dissipation due to the connection of the LEDs located on the board and the heat dissipation plate through the bases of the LED housings.

The closest analogue of the claimed LED module is the "Light-emitting device" according to US patent for invention 9000470, according to IPC H01L 33/00, published 04/07/2015 with LEDs on a heat-dissipating substrate, covered with a polymer layer, with a heat-dissipating substrate of predominantly round shape made of metal with low thermal resistance including a dielectric electrically insulating, but heat-conducting material with low thermal resistance, and the polymer layer is made with phosphors of different colors.

The disadvantage of such designs is the insufficiently high efficiency of heat dissipation due to the high density of LEDs.

The essence of the utility model

The objective of the utility model is to create a LED module with increased efficiency of heat dissipation from LEDs and dissipation of the removed heat into the surrounding space.

The technical result of the utility model is an increase in the efficiency of heat removal from LEDs and the dissipation of the removed heat into the surrounding space.

The most effective way to solve the set task is to make at least two holes in the heat-dissipating substrate and a ratio of the area of the heat-dissipating substrate to the area of the LEDs of more than 10. Such a ratio of the areas of the LED module elements allows increasing the radiation area of the heat-dissipating substrate outside the zones of heat transfer from the LEDs and ensuring a quasi-stationary mode of heat removal from the LEDs and dissipation of the removed heat into the surrounding space in the entire range of operating temperatures of both individual LEDs and the LED module as a whole.

The technical result is achieved in that the LED module with LEDs on a heat-dissipating substrate coated with a polymer layer, with a heat-dissipating substrate of predominantly rectangular shape made of metal with low thermal resistance, including an electrically insulating but heat-conducting material with low thermal resistance, facilitating heat dissipation through the heat-dissipating substrate with low thermal resistance, the said polymer layer with phosphors of at least one color, in the said heat-dissipating substrate at least two holes are made, and the area of the heat-dissipating substrate is more than 10 times greater than the area of at least one LED located on the heat-dissipating substrate.

The technical result can also be achieved by the fact that the polymer layer can be made in the form of an optical system of a separate LED.

The technical result can also be achieved by the fact that the polymer layer can be made in the form of an optical system of all LEDs of the LED module.

The technical result can also be achieved by the fact that at least one opening is designed with the possibility of connection to a heat-dissipating device or heat pipe.

Implementation of a utility model

Fig. 1 shows a diagram of an LED module with one LED.

Fig. 2 shows a diagram of an LED module with four LEDs.

Fig. 3 shows the temperature distribution over the surface of an LED module with one LED on the thermal imager screen.

Fig. 4 shows the temperature distribution over the surface of an LED module with four LEDs on the thermal imager screen.

When manufacturing an LED module, various technologies for mounting the LED crystal “chip on board” directly onto the module board can be used.

LED module 1 with LEDs 2 on a heat-dissipating substrate 3, predominantly rectangular in shape with holes 4.

The LED module operates like all LED devices - emitting in a solid-state semiconductor at a certain wavelength. Placing LEDs 2 on a heat-dissipating substrate 3, given that the area of the heat-dissipating substrate is more than 10 times larger than the area of one LED or several LEDs 2 located or located on the heat-dissipating substrate, allows increasing the efficiency of heat removal from the LEDs and dissipation of the removed heat into the surrounding space. It is also possible to increase the efficiency of heat removal by connecting the heat-dissipating substrate 3 through the central hole 4 with a heat-dissipating device or heat conductor.

In the example of the implementation of a LED module with one LED, the values of the temperature distribution over the surface of the LED module on the thermal imager screen (Fig. 3) with substrate dimensions of 15×10 mm, substrate thickness of 1.5 mm, LED dimensions in plan of 1.5×1.5 mm, holes of 2 mm diameter, the difference in temperature of the LED (51.4°C) and most of the substrate (44.5°C) is about 13% at an ambient temperature of 20°C, the area of the substrate is 12 times larger than the area of the LED, ensuring a balance of the heat emitted by the LED and the heat removed by the heat-dissipating substrate.

In the example of the implementation of a LED module with four LEDs, the values of the temperature distribution over the surface of the LED module on the thermal imager screen (Fig. 4) with substrate dimensions of 21×9 mm, a substrate thickness of 1.5 mm, LED dimensions in plan of 1.5×1.5 mm, holes of 2 mm in diameter, the difference in the temperatures of the LEDs (99.4°C) and most of the substrate (84.6°C) is about 15% at an ambient temperature of 20°C, the area of the substrate is 31.5 times larger than the area of the LED, ensuring a balance of the heat emitted by the LED and the heat removed by the heat-dissipating substrate.

Claims (3)

1. A LED module with LEDs coated with a polymer layer, including a rectangular heat-dissipating substrate for accommodating the LEDs, the substrate is made of a metal with low thermal resistance and an electrically insulating heat-conducting material with low thermal resistance, the polymer layer is made with phosphors of at least one color, characterized in that at least two openings are made in the said heat-dissipating substrate, wherein the area of the heat-dissipating substrate is more than 10 times greater than the area of at least one LED located on the heat-dissipating substrate. 2. A LED module according to item 1, characterized in that the polymer layer is made in the form of an optical system of a separate LED. 3. The LED module according to item 1, characterized in that the polymer layer is made in the form of an optical system of all LEDs of the LED module.