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KR20110040324A - High efficiency power LED light with cooling - Google Patents

High efficiency power LED light with cooling Download PDF

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Publication number
KR20110040324A
KR20110040324A KR1020090097541A KR20090097541A KR20110040324A KR 20110040324 A KR20110040324 A KR 20110040324A KR 1020090097541 A KR1020090097541 A KR 1020090097541A KR 20090097541 A KR20090097541 A KR 20090097541A KR 20110040324 A KR20110040324 A KR 20110040324A
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KR
South Korea
Prior art keywords
plate
heat dissipation
led
led module
magnesium
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KR1020090097541A
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Korean (ko)
Inventor
이성준
조현상
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(주)엠오케이엘이디
조현상
이성준
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Priority to KR1020090097541A priority Critical patent/KR20110040324A/en
Publication of KR20110040324A publication Critical patent/KR20110040324A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 엘이디 모듈에서 발생되는 고열을 그라파이트 전도판과 마그네슘 방열판을 통해 신속히 방출시켜 고효율을 구현할 수 있도록 한 냉각장치가 구비된 고효율 파워 엘이디 조명등에 관한 것으로, 본 발명의 구체적인 수단은 알루미늄판에 LED 회로를 형성시킨 PCB와 PCB의 회로에 접속 배치된 다수의 LED를 갖는 LED모듈판과; 상기 LED모듈판의 전면에 배치되어 상기 LED의 광원을 확산시키는 배광렌즈와; 상기 LED모듈판의 배면에 밀착된 그라파이트 전도판과; 일면에 하나 이상의 전선 도피홈이 형성되어 상기 그라파이트 전도판의 배면에 밀착 배치되고 타면에 입설된 다수의 방열핀을 갖는 마그네슘 방열판과; 상기 마그네슘 방열판이 지지 설치되는 등커버를 포함하는 것을 특징으로 한다.The present invention relates to a high-efficiency power LED lighting lamp equipped with a cooling device for quickly discharging high heat generated from the LED module through the graphite conduction plate and magnesium heat sink to implement high efficiency, and the specific means of the present invention is an LED on the aluminum plate An LED module plate having a plurality of LEDs connected to the PCB on which the circuit is formed and the circuit of the PCB; A light distribution lens disposed on the front surface of the LED module plate to diffuse the light source of the LED; A graphite conductive plate in close contact with the rear surface of the LED module plate; A magnesium heat dissipation plate having one or more wire escape grooves formed on one surface thereof, the magnesium heat dissipation plate having a plurality of heat dissipation fins disposed in close contact with the rear surface of the graphite conductive plate and placed on the other surface; It characterized in that it comprises a back cover that is supported by the magnesium heat sink.

Description

냉각장치가 구비된 고효율 파워 엘이디 조명등{Power LED lighting lamp having cooling unit}Power LED lighting lamp having cooling unit

본 발명은 고효율 파워 엘이디 조명등에 관한 것으로, 특히 엘이디 모듈에서 발생되는 고열을 그라파이트 전도판과 마그네슘 방열판을 통해 신속히 방출시켜 고효율을 구현할 수 있도록 한 냉각장치가 구비된 고효율 파워 엘이디 조명등에 관한 것이다.The present invention relates to a high-efficiency power LED lighting lamp, and more particularly, to a high-efficiency power LED lighting lamp equipped with a cooling device for quickly discharging high heat generated from the LED module through a graphite conductive plate and magnesium heat sink.

엘이디 조명등에 사용되는 엘이디(LED:light-emitting diode) 소자는 N형 반도체와 P형 반도체를 접합한 광전변환소자로서 전력소비가 작고 고휘도로서 가로등 등의 조명장치에 유용하게 활용되고 있다. 그러나 엘이디 조명등은 점등효율과 수명을 향상시키기 위해 방열 처리가 요구된다.The LED (light-emitting diode) element used in LED lighting is a photoelectric conversion element in which an N-type semiconductor and a P-type semiconductor are bonded, and has a low power consumption and is useful for lighting devices such as street lights. However, LED lighting requires heat treatment to improve lighting efficiency and lifespan.

통상 엘이디(LED) 조명에 있어서 높은 열을 제어하지 못하는 제품 들의 특징은 저전류 엘이디를 수십개 이상 다수를 설치하여 제조하는 방식을 채택하고 있다.The characteristics of products that can not control the high heat in the LED (LED) lighting is usually adopted by manufacturing a number of low-current LEDs by installing a plurality of.

그러나 방열 처리를 위해 방열팬 또는 방열핀을 추가로 설치하는 경우가 있다. 방열팬의 경우 방열팬의 수명에 따라 LED 수명이 크게 단축되며 소음이 발생되 는 단점을 가진다. 방열핀을 사용하는 경우 방열량의 한계를 가지므로 새로운 구조가 개발되고 있는 실정이다.However, in some cases, an additional heat dissipation fan or heat dissipation fin may be installed. In the case of a heat radiating fan, the LED life is greatly shortened and noise is generated depending on the life of the radiating fan. In the case of using a heat radiation fin has a limit of the amount of heat radiation, a new structure is being developed.

한국 특허 등록번호 제10-0909366호(발명의 명칭: 방열구조 엘이디모듈)의 경우 회로패턴이 인쇄되어 있는 기판을 알루미늄재의 방열기판에 밀착시키고, 방열기판의 상,하부면에 도포된 실리콘수지 또는 에폭시 수지의 열전이매체를 통하여 방열시키는 구조를 갖는다. 그러나 이 특허의 경우 실리콘수지 또는 에폭시 수지를 도포시켜야 하는 별도의 제작 공정이 추가된다.In the case of Korean Patent Registration No. 10-0909366 (name of the invention: heat dissipation structure LED module), the substrate on which the circuit pattern is printed is closely adhered to the heat dissipation board made of aluminum, and the silicone resin coated on the upper and lower surfaces of the heat dissipation board or It has a structure for radiating heat through the heat transfer medium of the epoxy resin. However, this patent adds a separate fabrication process that requires the application of silicone resins or epoxy resins.

따라서 본 발명은 상기와 같은 사정을 감안하여 창출된 것으로, 방열팬을 사용하지 않으며, 열전도성과 방출성이 뛰어난 소재를 선택 구조적으로 모듈화시켜 방열이 뛰어나고, PCB에 빗물의 침투가 이루어질 수 없도록 하여 전기적 불량을 없애고 수명이 향상되도록 한 냉각장치가 구비된 고효율 파워 엘이디 조명등을 제공함에 그 목적이 있다.Therefore, the present invention was created in view of the above circumstances, and does not use a heat dissipation fan, and selects a structurally modular material having excellent thermal conductivity and dissipation property, thereby providing excellent heat dissipation and preventing rainwater from penetrating the PCB. It is an object of the present invention to provide a high-efficiency power LED lamp equipped with a cooling device to eliminate the defect and improve the life.

상기의 목적을 달성하기 위한 본 발명의 구체적인 수단은,In order to achieve the above object,

알루미늄판에 LED 회로를 형성시킨 PCB와 PCB의 회로에 접속 배치된 다수의 LED를 갖는 LED모듈판과;An LED module plate having a plurality of LEDs connected to a PCB formed on the aluminum plate and a circuit of the PCB;

상기 LED모듈판의 전면에 배치되어 상기 LED의 광원을 확산시키는 배광렌즈와;A light distribution lens disposed on the front surface of the LED module plate to diffuse the light source of the LED;

상기 LED모듈판의 배면에 밀착된 그라파이트 전도판과;A graphite conductive plate in close contact with the rear surface of the LED module plate;

일면에 하나 이상의 전선 도피홈이 형성되어 상기 그라파이트 전도판의 배면에 밀착 배치되고 타면에 입설된 다수의 방열핀을 갖는 마그네슘 방열판과;A magnesium heat dissipation plate having one or more wire escape grooves formed on one surface thereof, the magnesium heat dissipation plate having a plurality of heat dissipation fins disposed in close contact with the rear surface of the graphite conductive plate and placed on the other surface;

상기 마그네슘 방열판이 지지 설치되는 등커버를 포함하는 것을 특징으로 한다.It characterized in that it comprises a back cover that is supported by the magnesium heat sink.

또한 본 발명에 따르면,Also according to the invention,

상기 방열핀은 그 표면에 코팅된 카본 나노 튜브 코팅층이 더 형성되어 있는 것을 특징으로 한다.The heat dissipation fin is characterized in that the carbon nanotube coating layer is further formed on the surface.

또한 본 발명에 따르면,Also according to the invention,

상기 등커버는,The back cover,

상기 마그네슘 방열판의 방열핀을 삽통시키는 방열구멍과 방열구멍의 둘레에 마그네슘 방열판을 지지시켜 놓기 위한 상부 견착부와 상부 견착부에 설치된 방수용 패킹을 갖는 상부 덮개와;An upper cover having a heat dissipation hole for inserting the heat dissipation fin of the magnesium heat dissipation plate and an upper abutment part for supporting the magnesium heat dissipation plate around the heat dissipation hole and a waterproof packing installed at the upper abutment part;

상기 배광렌즈를 노출시키는 렌즈개구부과 상기 상부 견착부에 대응되는 하부 견착부와 상기 하부 견착부에 설치된 방수용 패킹을 갖고 상기 상부 덮개에 결합되는 하부 덮개가 포함된 것을 특징으로 한다.And a lower cover coupled to the upper cover with a lens opening for exposing the light distribution lens, a lower adhesive part corresponding to the upper adhesive part, and a waterproof packing installed on the lower adhesive part.

본 발명의 냉각장치가 구비된 고효율 파워 엘이디 조명등에 따르면, LED모듈판에서 발생된 고열을 중간의 그라파이트 전도판을 매개로 신속히 마그네슘 방열판에 확산시키고, 마그네슘 방열판은 방열핀의 탄소난노튜브 코팅층을 통해 전도 및 대류현상을 극대화시켜 방열이 극대화되므로 45℃~55℃의 상온을 유지할 수 있다. 따라서 LED의 수명이 향상 유지된다.According to the high-efficiency power LED lamp equipped with the cooling device of the present invention, the high heat generated from the LED module plate is quickly diffused into the magnesium heat sink through the medium graphite conduction plate, and the magnesium heat sink is conducted through the carbon nanotube coating layer of the heat sink fins. And maximization of convection phenomena heat dissipation is maximized can maintain a room temperature of 45 ℃ ~ 55 ℃. Therefore, the life of the LED is maintained to be improved.

한편, 상부 덮개로 빗물이 유입되더라도 상부 견착부 및 하부 견착부에 설치된 이중의 고무패킹에 의해 LED모듈판으로 유입되는 것을 차단하여 방수가 효과적으로 이루어져 고장 발생이 없어진다.On the other hand, even if rainwater flows into the upper cover, by preventing the inflow into the LED module plate by the double rubber packing installed on the upper and lower adhesive parts, the waterproof is effectively prevented and failure occurs.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1 및 도 2에서와 같이 고효율 파워 엘이디 조명등(10)에는 알루미늄판에 LED 회로를 형성시킨 PCB(22)와 PCB(22)의 회로에 접속 배치된 다수의 LED(24)를 갖는 LED모듈판(20)이 구비된다. 도 4에는 LED모듈판(20)의 사시도가 나타나 있다.As shown in FIGS. 1 and 2, the high-efficiency power LED lamp 10 has an LED module plate having a PCB 22 having an LED circuit formed on an aluminum plate and a plurality of LEDs 24 connected to a circuit of the PCB 22. 20 is provided. 4 is a perspective view of the LED module plate 20.

LED모듈판(20)의 전면에는 LED(24)의 광원을 확산시키는 배광렌즈(30)가 배치된다. 배광렌즈(30)는 유리 등의 투명체로 제작된 반구형의 형태가 될 수 있다.A light distribution lens 30 for diffusing a light source of the LED 24 is disposed on the front surface of the LED module plate 20. The light distribution lens 30 may have a hemispherical shape made of a transparent body such as glass.

LED모듈판(20)의 배면에는 LED모듈판(20)에서 발생된 고열을 전도받는 그라파이트(Graphite) 전도판(40)이 접착되어 있다. 그라파이트 전도판(40)은 그라파이트로 제작되어 LED모듈판(20)의 국부적인 열을 후술할 마그네슘 방열판(50)의 넓은 면적에 신속히 전달하는 역할을 한다.On the back surface of the LED module plate 20, a graphite conductive plate 40 which receives high heat generated from the LED module plate 20 is bonded. The graphite conductive plate 40 is made of graphite and serves to quickly transfer the local heat of the LED module plate 20 to the large area of the magnesium heat sink 50 to be described later.

그라파이트 전도판(40)의 배면에는 마그네슘 방열판(50)이 접착되어 있다. 마그네슘 방열판(50)은 일면에 LED모듈판(20)에서 인출된 전선을 포설하기 위해 하나 이상의 전선 도피홈(52)이 형성되어 있고 타면에 입설된 다수의 방열핀(54)이 구비되어 있다.The magnesium heat sink 50 is attached to the back surface of the graphite conductive plate 40. Magnesium heat dissipation plate 50 has one or more wire escape grooves 52 are formed on one side to install the wires drawn from the LED module plate 20, and a plurality of heat dissipation fins 54 are provided on the other side.

여기서 방열핀(52)은 그 표면에 카본 나노 튜브(CNT)가 150㎛~200㎛로 코팅된 코팅층이 더 형성될 수 있다. 여기서, 카본 나노 튜브 코팅층은 속이 비어 있는 구조로서 그 자체에 의해 열전도성과 대류 현상으로 방열작용을 촉진시킨다. 이는 카본 나노 튜브(CNT)의 코팅 두께를 150㎛ 이하로 하면 방열 성능의 향상이 미미하고, 200㎛ 이상으로 하면 벗겨짐이 발생되기 때문이다.Herein, the heat dissipation fins 52 may further include a coating layer coated with a carbon nanotube (CNT) having a thickness of 150 μm to 200 μm. Here, the carbon nanotube coating layer has a hollow structure, thereby promoting heat dissipation by thermal conductivity and convection. This is because if the coating thickness of the carbon nanotubes (CNT) is 150 µm or less, the improvement of heat dissipation performance is insignificant, and if the coating thickness of the carbon nanotubes (CNT) is 200 µm or more, peeling occurs.

마그네슘 방열판(50)은 마그네슘(Mg)으로 제작된 것으로 알루미늄보다 30% 정도 가볍고 열전도성도 50%내외의 뛰어난 성질을 가지고 있다.Magnesium heat sink 50 is made of magnesium (Mg) is about 30% lighter than aluminum and has excellent thermal conductivity of about 50%.

마그네슘 방열판(50)은 등커버(60)에 지지 설치된다. 등커버(60)는 상부 덮개(62)와 하부 덮개(64)를 포함한다.The magnesium heat sink 50 is supported by the back cover 60. The back cover 60 includes an upper cover 62 and a lower cover 64.

상부 덮개(62)는 마그네슘 방열판(50)의 방열핀(54)을 삽통시키는 방열구멍(62a)과 방열구멍(62a)의 둘레에 마그네슘 방열판(50)을 지지시켜 놓기 위한 상부 견착부(62b)와 상부 견착부(62b)에 설치된 방수용 패킹(63)을 갖고 있다.The upper cover 62 includes a heat dissipation hole 62a through which the heat dissipation fins 54 of the magnesium heat dissipation plate 50 are inserted, and an upper adhesive part 62b for supporting the magnesium heat dissipation plate 50 around the heat dissipation hole 62a. It has the waterproof packing 63 provided in the upper adhesion part 62b.

하부 덮개(64)는 상기 배광렌즈(30)를 노출시키는 렌즈개구부(64a)와 상기 상부 견착부(62b)에 대응되는 하부 견착부(64b)와 상기 하부 견착부(64b)에 설치된 방수용 패킹(65)을 갖고 상기 상부 덮개(62)에 결합되어 있다.The lower cover 64 may include a lens opening 64a exposing the light distribution lens 30, a lower packing part 64b corresponding to the upper packing part 62b, and a waterproof packing installed on the lower packing part 64b. 65 and is coupled to the top cover 62.

이와 같이 구성된 고효율 파워 엘이디 조명등(10)은 일례로 도 3과 같이 배광렌즈(30)가 3행 4열로 설치될 수 있다. 이때 각 열의 배광렌즈(30)는 렌즈 덮개(32)통하여 설치될 수 있다. 또한 각 열마다 하나씩의 마그네슘 방열판(50)이 설치된다.The high efficiency power LED lamp 10 configured as described above may have, for example, a light distribution lens 30 installed in three rows and four columns as shown in FIG. 3. At this time, the light distribution lens 30 in each row may be installed through the lens cover 32. In addition, one magnesium heat sink 50 is installed in each row.

이때 그라파이트 전도판(40)과 마그네슘 방열판(50)은 나사(70)를 통하여 상부 덮개(62)의 상부 견착부(62b)의 밑면에 고정 설치된다.At this time, the graphite conductive plate 40 and the magnesium heat sink 50 are fixed to the bottom surface of the upper adhesion portion 62b of the upper cover 62 through the screw 70.

이와 같이 구성된 본 실시예의 작용을 설명한다.The operation of this embodiment configured as described above will be described.

다수의 LED(24)에 전원이 공급되면 LED모듈판(20)에서 발생된 고열은 그라파이트로 제작된 그라파이트 방열판(40)에 신속히 흡수된다. 그라파이트 방열판(40)에 흡수된 국부열은 이보다 더 넓은 면적을 갖는 마그네슘 방열판(50)에 전달된다.When power is supplied to the plurality of LEDs 24, the high heat generated from the LED module plate 20 is rapidly absorbed by the graphite heat sink 40 made of graphite. The local heat absorbed by the graphite heat sink 40 is transferred to the magnesium heat sink 50 having a larger area.

마그네슘 방열판(50)에 전이된 열은 방열핀(54)의 표면을 통하여 방출이 되며, 이때 방열핀(54)에 코팅된 카본 나노 튜브 코팅층에 의해 전도 및 대류 현상의 촉진으로 방열이 극대화된다.The heat transferred to the magnesium heat sink 50 is released through the surface of the heat radiation fins 54, and the heat radiation is maximized by the promotion of conduction and convection by the carbon nanotube coating layer coated on the heat radiation fins 54.

이와 같이 본 발명은 LED모듈판(20)에서 발생된 고열을 중간의 그라파이트 전도판(40)을 매개로 신속히 마그네슘 방열판(50)에 확산시키고, 마그네슘 방열판(50)은 방열핀(54)의 탄소난노튜브 코팅층을 통해 전도 및 대류현상을 극대화시켜 방열이 극대화되므로 45℃~55℃의 상온을 유지할 수 있다. 따라서 LED의 수명이 향상 유지된다.As such, the present invention rapidly spreads the high heat generated from the LED module plate 20 to the magnesium heat sink 50 through the intermediate graphite conductive plate 40, and the magnesium heat sink 50 is a carbon column of the heat sink fins 54. The heat dissipation is maximized by maximizing conduction and convection through the no-tube coating layer, so that room temperature of 45 ℃ ~ 55 ℃ can be maintained. Therefore, the life of the LED is maintained to be improved.

한편, 상부 덮개(62)로 빗물이 유입되더라도 상부 견착부(62b) 및 하부 견착 부(64b)에 설치된 이중의 고무패킹(63,65)에 의해 LED모듈판(20)으로 유입되는 것을 차단하여 방수가 효과적으로 이루어져 고장 발생이 없어진다.On the other hand, even if rainwater flows into the upper cover 62 by blocking the inflow into the LED module plate 20 by the double rubber packing (63, 65) installed in the upper adhesive portion 62b and the lower adhesive portion 64b. Waterproofing is effective and there is no breakdown.

이같이 본 발명의 고효율 파워 엘이디 조명등(10)은 열전도성이 뛰어나 소형 제작이 가능하여 풍속 및 중량에 의한 파손 우려가 없어지므로 예로, 가로등에 설치할 수 있는 이점을 제공한다.As described above, the high-efficiency power LED lamp 10 of the present invention is excellent in thermal conductivity and can be manufactured in a small size, thereby eliminating the risk of damage caused by wind speed and weight.

이상과 같이, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술사상과 아래에 기재될 청구범위의 균등범위 내에서 다양한 수정 및 변형이 가능함은 물론이다.As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

본 명세서에서 첨부되는 다음의 도면들은 본 발명의 바람직한 실시예를 예시하는 것이며, 후술하는 발명의 상세한 설명과 함께 본 발명의 기술사상을 더욱 이해시키는 역할을 하는 것이므로, 본 발명은 그러한 도면에 기재된 사항에만 한정되어서 해석되어서는 아니된다.The following drawings, which are attached in this specification, illustrate preferred embodiments of the present invention, and together with the detailed description of the present invention, serve to further understand the technical spirit of the present invention. It should not be construed as limited to.

도 1은 본 발명에 따른 고효율 파워 엘이디 조명등의 사시도.1 is a perspective view of a high efficiency power LED lamp according to the present invention.

도 2는 도 1의 A-A선 단면도.2 is a cross-sectional view taken along the line A-A of FIG.

도 3은 본 발명에 따른 고효율 파워 엘이디 조명등의 광원 배열을 나타낸 사시도.Figure 3 is a perspective view showing a light source arrangement of the high-efficiency power LED lamp according to the present invention.

도 4는 본 발명에 적용되는 LED 모듈판의 사시도.Figure 4 is a perspective view of the LED module plate applied to the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

20: LED 모듈판20: LED module board

22: PCB22: PCB

24: LED24: LED

30: 배광렌즈30: light distribution lens

40: 전도판40: conduction plate

50: 방열판50: heat sink

54: 방열핀54: heat sink fin

60: 등커버60: back cover

62a: 방열구멍62a: heat dissipation hole

62b: 상부 견착부62b: upper shoulder

64: 하부덮개64: lower cover

64b: 하부 견착부64b: lower shoulder

Claims (3)

알루미늄판에 LED 회로를 형성시킨 PCB(22)와 PCB(22)의 회로에 접속 배치된 다수의 LED(24)를 갖는 LED모듈판(20)과;An LED module plate 20 having a PCB 22 having an LED circuit formed on an aluminum plate and a plurality of LEDs 24 connected to the circuit of the PCB 22; 상기 LED모듈판(20)의 전면에 배치되어 상기 LED(24)의 광원을 확산시키는 배광렌즈(30)와;A light distribution lens 30 disposed on the front surface of the LED module plate 20 to diffuse the light source of the LED 24; 상기 LED모듈판(20)의 배면에 밀착된 그라파이트(Graphite) 전도판(40)과;Graphite conductive plate 40 in close contact with the back of the LED module plate 20; 일면에 하나 이상의 전선 도피홈(52)이 형성되어 상기 그라파이트 전도판(40)의 배면에 밀착 배치되고 타면에 입설된 다수의 방열핀(54)을 갖는 마그네슘 방열판(50)과;Magnesium heat dissipation plate 50 having one or more wire escape grooves 52 are formed on one surface and disposed in close contact with the back surface of the graphite conductive plate 40 and having a plurality of heat dissipation fins 54 placed on the other side thereof; 상기 마그네슘 방열판(50)이 지지 설치되는 등커버(60)를 포함하는 것을 특징으로 하는 냉각장치가 구비된 고효율 파워 엘이디 조명등.High efficiency power LED lamp having a cooling device, characterized in that it comprises a back cover 60, the magnesium heat sink 50 is supported. 제 1항에 있어서,The method of claim 1, 상기 방열핀(52)은 그 표면에 코팅된 카본 나노 튜브 코팅층이 더 형성되어 있는 것을 특징으로 하는 냉각장치가 구비된 고효율 파워 엘이디 조명등.The heat dissipation fin 52 is a high efficiency power LED lamp having a cooling device, characterized in that the carbon nanotube coating layer is further formed on the surface of the coating. 제 1항에 있어서,The method of claim 1, 상기 등커버(60)는,The back cover 60, 상기 마그네슘 방열판(50)의 방열핀(54)을 삽통시키는 방열구멍(62a)과 방열 구멍(62a)의 둘레에 마그네슘 방열판(50)을 지지시켜 놓기 위한 상부 견착부(62b)와 상부 견착부(62b)에 설치된 방수용 패킹(63)을 갖는 상부 덮개(62)와;Upper adhesion part 62b and upper adhesion part 62b for supporting the magnesium heat dissipation plate 50 around the heat dissipation hole 62a through which the heat dissipation fin 54 of the magnesium heat dissipation plate 50 is inserted and the heat dissipation hole 62a. A top cover 62 having a watertight packing 63 installed at the bottom); 상기 배광렌즈(30)를 노출시키는 렌즈개구부(64a)과 상기 상부 견착부(62b)에 대응되는 하부 견착부(64b)와 상기 하부 견착부(64b)에 설치된 방수용 패킹(65)을 갖고 상기 상부 덮개(62)에 결합되는 하부 덮개(64)가 포함된 것을 특징으로 하는 냉각장치가 구비된 고효율 파워 엘이디 조명등.The upper portion has a lens opening 64a exposing the light distribution lens 30, a lower adhesion portion 64b corresponding to the upper adhesion portion 62b, and a waterproof packing 65 installed at the lower adhesion portion 64b. High efficiency power LED lamp having a cooling device, characterized in that it comprises a lower cover (64) coupled to the cover (62).
KR1020090097541A 2009-10-14 2009-10-14 High efficiency power LED light with cooling KR20110040324A (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102182951A (en) * 2011-05-10 2011-09-14 广州大学 Light emitting diode (LED) high-power lighting lamp of novel radiating device
CN102313196A (en) * 2011-04-27 2012-01-11 东莞勤上光电股份有限公司 Lamp holder and light source module of a modular intelligent street lamp
CN102313198A (en) * 2011-04-27 2012-01-11 东莞勤上光电股份有限公司 A modular intelligent street lamp and its lamp holder
CN102313197A (en) * 2011-04-27 2012-01-11 东莞勤上光电股份有限公司 Lamp holder of a modular intelligent street lamp and its module fixing mechanism
KR101273430B1 (en) * 2012-11-19 2013-06-11 (주)프로맥엘이디 Led light apparatus having a high heat radiation
CN103307573A (en) * 2012-03-13 2013-09-18 欧司朗股份有限公司 Radiator and illuminating device provided with same
CN103968277A (en) * 2013-02-04 2014-08-06 铼钻科技股份有限公司 Light-emitting diode bulb
KR101448379B1 (en) * 2013-03-20 2014-10-07 호서대학교 산학협력단 Light emitting module having carbon layer for light device and Light device having the same
KR101512074B1 (en) * 2013-07-31 2015-04-14 (주)비젼테크 Light having advertising display
KR101512075B1 (en) * 2013-07-31 2015-04-14 (주)비젼테크 Tunnel Light having advertising display
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102313196A (en) * 2011-04-27 2012-01-11 东莞勤上光电股份有限公司 Lamp holder and light source module of a modular intelligent street lamp
CN102313198A (en) * 2011-04-27 2012-01-11 东莞勤上光电股份有限公司 A modular intelligent street lamp and its lamp holder
CN102313197A (en) * 2011-04-27 2012-01-11 东莞勤上光电股份有限公司 Lamp holder of a modular intelligent street lamp and its module fixing mechanism
CN102313197B (en) * 2011-04-27 2013-09-18 东莞勤上光电股份有限公司 Lamp holder of modularization intelligence street lamp and module fixed establishment thereof
CN102182951A (en) * 2011-05-10 2011-09-14 广州大学 Light emitting diode (LED) high-power lighting lamp of novel radiating device
CN103307573A (en) * 2012-03-13 2013-09-18 欧司朗股份有限公司 Radiator and illuminating device provided with same
KR101273430B1 (en) * 2012-11-19 2013-06-11 (주)프로맥엘이디 Led light apparatus having a high heat radiation
CN103968277A (en) * 2013-02-04 2014-08-06 铼钻科技股份有限公司 Light-emitting diode bulb
KR101448379B1 (en) * 2013-03-20 2014-10-07 호서대학교 산학협력단 Light emitting module having carbon layer for light device and Light device having the same
KR101512074B1 (en) * 2013-07-31 2015-04-14 (주)비젼테크 Light having advertising display
KR101512075B1 (en) * 2013-07-31 2015-04-14 (주)비젼테크 Tunnel Light having advertising display
KR20230152237A (en) 2022-04-27 2023-11-03 안희태 Welding machine capable of AC power or battery power

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