OA01425A - Perfectionnements à la réalisation des circuits électriques du genre dit " imprimé ". - Google Patents
Perfectionnements à la réalisation des circuits électriques du genre dit " imprimé ".Info
- Publication number
- OA01425A OA01425A OA51942A OA51942A OA01425A OA 01425 A OA01425 A OA 01425A OA 51942 A OA51942 A OA 51942A OA 51942 A OA51942 A OA 51942A OA 01425 A OA01425 A OA 01425A
- Authority
- OA
- OAPI
- Prior art keywords
- printed
- called
- production
- type
- electrical circuits
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
- H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49009—Dynamoelectric machine
- Y10T29/49012—Rotor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR818137A FR1256632A (fr) | 1960-02-09 | 1960-02-09 | Perfectionnements à la réalisation des circuits électriques du genre dit imprimé |
Publications (1)
Publication Number | Publication Date |
---|---|
OA01425A true OA01425A (fr) | 1969-07-04 |
Family
ID=8725027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
OA51942A OA01425A (fr) | 1960-02-09 | 1964-12-31 | Perfectionnements à la réalisation des circuits électriques du genre dit " imprimé ". |
Country Status (6)
Country | Link |
---|---|
US (1) | US3397452A (fr) |
CH (1) | CH370834A (fr) |
DE (1) | DE1160519B (fr) |
FR (1) | FR1256632A (fr) |
GB (1) | GB973417A (fr) |
OA (1) | OA01425A (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3264402A (en) * | 1962-09-24 | 1966-08-02 | North American Aviation Inc | Multilayer printed-wiring boards |
US3335489A (en) * | 1962-09-24 | 1967-08-15 | North American Aviation Inc | Interconnecting circuits with a gallium and indium eutectic |
US3374129A (en) * | 1963-05-02 | 1968-03-19 | Sanders Associates Inc | Method of producing printed circuits |
US3200298A (en) * | 1963-05-27 | 1965-08-10 | United Aircraft Corp | Multilayer ceramic circuitry |
US3210829A (en) * | 1964-11-02 | 1965-10-12 | Avco Corp | Method of making a switch stator |
US3243498A (en) * | 1964-12-24 | 1966-03-29 | Ibm | Method for making circuit connections to internal layers of a multilayer circuit card and circuit card produced thereby |
US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
DE1590615B1 (de) * | 1966-08-10 | 1970-10-01 | Standard Elek K Lorenz Ag | Verfahren zur Herstellung kreuzungsfreier,gedruckter Schaltungen |
US3491275A (en) * | 1967-05-02 | 1970-01-20 | Sprague Electric Co | Flat capacitor |
JPS61132053A (ja) * | 1984-11-30 | 1986-06-19 | Fanuc Ltd | Acモ−タのデイスク形ステ−タとその製造方法 |
DE3639402A1 (de) * | 1986-11-18 | 1988-05-19 | Siemens Ag | Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte |
US6411002B1 (en) * | 1996-12-11 | 2002-06-25 | Smith Technology Development | Axial field electric machine |
WO2012105709A2 (fr) * | 2011-01-31 | 2012-08-09 | Hitachi Koki Co., Ltd. | Moteur à disques, outil électrique comportant un moteur à disques et procédé de fabrication dudit moteur |
DE102015211852A1 (de) * | 2015-06-25 | 2016-12-29 | Schaeffler Technologies AG & Co. KG | Multilayer-Platine und Verfahren zu deren Herstellung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2502291A (en) * | 1946-02-27 | 1950-03-28 | Lawrence H Taylor | Method for establishing electrical connections in electrical apparatus |
US2907925A (en) * | 1955-09-29 | 1959-10-06 | Gertrude M Parsons | Printed circuit techniques |
US3102213A (en) * | 1960-05-13 | 1963-08-27 | Hazeltine Research Inc | Multiplanar printed circuits and methods for their manufacture |
-
1960
- 1960-02-09 FR FR818137A patent/FR1256632A/fr not_active Expired
-
1961
- 1961-01-30 CH CH109061A patent/CH370834A/fr unknown
- 1961-02-03 DE DES72369A patent/DE1160519B/de active Pending
- 1961-02-08 GB GB4727/61A patent/GB973417A/en not_active Expired
-
1964
- 1964-12-31 OA OA51942A patent/OA01425A/fr unknown
-
1966
- 1966-09-09 US US578412A patent/US3397452A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB973417A (en) | 1964-10-28 |
US3397452A (en) | 1968-08-20 |
DE1160519B (de) | 1964-01-02 |
FR1256632A (fr) | 1961-03-24 |
CH370834A (fr) | 1963-07-31 |
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