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FR1276972A - Perfectionnements à la fabrication des circuits électriques imprimés - Google Patents

Perfectionnements à la fabrication des circuits électriques imprimés

Info

Publication number
FR1276972A
FR1276972A FR848239A FR848239A FR1276972A FR 1276972 A FR1276972 A FR 1276972A FR 848239 A FR848239 A FR 848239A FR 848239 A FR848239 A FR 848239A FR 1276972 A FR1276972 A FR 1276972A
Authority
FR
France
Prior art keywords
manufacture
electrical circuits
printed electrical
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR848239A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US862569A external-priority patent/US3143484A/en
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Priority to FR848239A priority Critical patent/FR1276972A/fr
Application granted granted Critical
Publication of FR1276972A publication Critical patent/FR1276972A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR848239A 1959-12-29 1960-12-28 Perfectionnements à la fabrication des circuits électriques imprimés Expired FR1276972A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR848239A FR1276972A (fr) 1959-12-29 1960-12-28 Perfectionnements à la fabrication des circuits électriques imprimés

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US862569A US3143484A (en) 1959-12-29 1959-12-29 Method of making plated circuit boards
FR848239A FR1276972A (fr) 1959-12-29 1960-12-28 Perfectionnements à la fabrication des circuits électriques imprimés

Publications (1)

Publication Number Publication Date
FR1276972A true FR1276972A (fr) 1961-11-24

Family

ID=26188742

Family Applications (1)

Application Number Title Priority Date Filing Date
FR848239A Expired FR1276972A (fr) 1959-12-29 1960-12-28 Perfectionnements à la fabrication des circuits électriques imprimés

Country Status (1)

Country Link
FR (1) FR1276972A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1271235B (de) * 1963-12-23 1968-06-27 Ibm Verfahren zur Herstellung von leitenden Verbindungen zwischen den leitenden Schichten einer elektrischen Schaltungsplatte
DE1665029B1 (de) * 1966-01-25 1970-01-29 Siemag Siegener Maschb Gmbh Verfahren zur Vorbehandlung bei der Herstellung von Leiterplatten

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1271235B (de) * 1963-12-23 1968-06-27 Ibm Verfahren zur Herstellung von leitenden Verbindungen zwischen den leitenden Schichten einer elektrischen Schaltungsplatte
DE1665029B1 (de) * 1966-01-25 1970-01-29 Siemag Siegener Maschb Gmbh Verfahren zur Vorbehandlung bei der Herstellung von Leiterplatten

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