NO307488B1 - Flersjiktstransduser med põsveisete kontaktforbindelser - Google Patents
Flersjiktstransduser med põsveisete kontaktforbindelser Download PDFInfo
- Publication number
- NO307488B1 NO307488B1 NO903622A NO903622A NO307488B1 NO 307488 B1 NO307488 B1 NO 307488B1 NO 903622 A NO903622 A NO 903622A NO 903622 A NO903622 A NO 903622A NO 307488 B1 NO307488 B1 NO 307488B1
- Authority
- NO
- Norway
- Prior art keywords
- contact areas
- transducer
- electrically conductive
- side surfaces
- layer end
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims 1
- 238000005246 galvanizing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000009718 spray deposition Methods 0.000 claims 1
- 238000005019 vapor deposition process Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Sensors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Measuring Fluid Pressure (AREA)
- Electrodes Of Semiconductors (AREA)
- Multi-Conductor Connections (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Light Receiving Elements (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI893874A FI893874A (fi) | 1989-08-17 | 1989-08-17 | Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO903622D0 NO903622D0 (no) | 1990-08-16 |
| NO903622L NO903622L (no) | 1991-02-18 |
| NO307488B1 true NO307488B1 (no) | 2000-04-10 |
Family
ID=8528855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO903622A NO307488B1 (no) | 1989-08-17 | 1990-08-16 | Flersjiktstransduser med põsveisete kontaktforbindelser |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5083234A (fi) |
| JP (1) | JP2866167B2 (fi) |
| CH (1) | CH681581A5 (fi) |
| DE (1) | DE4023776C2 (fi) |
| ES (1) | ES2023345A6 (fi) |
| FI (1) | FI893874A (fi) |
| FR (1) | FR2651069B1 (fi) |
| GB (1) | GB2235090B (fi) |
| IT (1) | IT1241544B (fi) |
| NO (1) | NO307488B1 (fi) |
| SE (1) | SE508914C2 (fi) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR930011143A (ko) * | 1991-11-14 | 1993-06-23 | 김광호 | 반도체장치 및 그 제조방법 |
| CA2115947A1 (en) * | 1993-03-03 | 1994-09-04 | Gregory C. Smith | Wafer-like processing after sawing dmds |
| DE4321804A1 (de) * | 1993-06-30 | 1995-01-12 | Ranco Inc | Verfahren zur Herstellung von Kleinbauelementen |
| US5912796A (en) * | 1996-11-15 | 1999-06-15 | Illinois Tool Works, Inc. | Metallized film capacitor and manufacturing process |
| DE10309869A1 (de) * | 2003-03-06 | 2004-09-23 | Infineon Technologies Ag | Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip |
| DE10321214A1 (de) * | 2003-05-12 | 2004-12-30 | Infineon Technologies Ag | Verfahren zum Aufbringen elektrischer Kontaktierungselemente auf einen Chip eines Chip-Wafers und Chip |
| DE10326804A1 (de) * | 2003-06-13 | 2004-11-18 | Infineon Technologies Ag | Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip |
| DE10334634B3 (de) * | 2003-07-29 | 2005-01-13 | Infineon Technologies Ag | Verfahren zum seitlichen Kontaktieren eines Halbleiterchips |
| DE10334633A1 (de) * | 2003-07-29 | 2004-10-07 | Infineon Technologies Ag | Verfahren zur Herstellung einer Anordnung mit zwei Halbleiterchips und Anordnung mit zwei Halbleiterchips |
| TWI559349B (zh) * | 2014-10-28 | 2016-11-21 | 鈺邦科技股份有限公司 | 導電端子改良之固態電解電容器封裝結構之製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL128146C (fi) * | 1963-03-05 | |||
| GB1115259A (en) * | 1966-05-20 | 1968-05-29 | Gen Dynamics Corp | Load measuring system |
| GB1342468A (en) * | 1969-10-16 | 1974-01-03 | Chubb Alarms Mfg Ltd | Security detection systems |
| GB1533191A (en) * | 1977-03-30 | 1978-11-22 | G Ni I P I Redkometallich Prom | Pressure-sensitive semiconductor bodies and pressure-sensitive devices including such bodies |
| US4267634A (en) * | 1978-04-05 | 1981-05-19 | American Components Inc. | Method for making a chip circuit component |
| US4386453A (en) * | 1979-09-04 | 1983-06-07 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
| JPS58159360A (ja) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | 半導体装置 |
| DE3378393D1 (en) * | 1982-05-11 | 1988-12-08 | Nec Corp | Multilayer electrostrictive element which withstands repeated application of pulses |
| FI842307A (fi) * | 1984-06-07 | 1985-12-08 | Vaisala Oy | Foerfarande foer aostadkommande av genomfoering i en mikromekanisk konstruktion. |
| JPS6127688A (ja) * | 1984-07-02 | 1986-02-07 | Nec Corp | 電歪効果素子およびその製造方法 |
| IL82960A0 (en) * | 1986-06-30 | 1987-12-20 | Rosemount Inc | Differential pressure sensor |
| JPS63149531A (ja) * | 1986-12-12 | 1988-06-22 | Fuji Electric Co Ltd | 静電容量式圧力センサ |
| JPH061228B2 (ja) * | 1987-08-13 | 1994-01-05 | 富士電機株式会社 | 静電容量式圧力検出器 |
| DE3727142C2 (de) * | 1987-08-14 | 1994-02-24 | Kernforschungsz Karlsruhe | Verfahren zur Herstellung von Mikrosensoren mit integrierter Signalverarbeitung |
| FI78784C (fi) * | 1988-01-18 | 1989-09-11 | Vaisala Oy | Tryckgivarkonstruktion och foerfarande foer framstaellning daerav. |
-
1989
- 1989-08-17 FI FI893874A patent/FI893874A/fi not_active Application Discontinuation
-
1990
- 1990-07-18 US US07/553,597 patent/US5083234A/en not_active Expired - Lifetime
- 1990-07-26 DE DE4023776A patent/DE4023776C2/de not_active Expired - Lifetime
- 1990-08-02 ES ES9002096A patent/ES2023345A6/es not_active Expired - Fee Related
- 1990-08-03 GB GB9017035A patent/GB2235090B/en not_active Expired - Fee Related
- 1990-08-09 CH CH2599/90A patent/CH681581A5/de not_active IP Right Cessation
- 1990-08-14 FR FR9010329A patent/FR2651069B1/fr not_active Expired - Fee Related
- 1990-08-14 IT IT48226A patent/IT1241544B/it active IP Right Grant
- 1990-08-15 SE SE9002663A patent/SE508914C2/sv unknown
- 1990-08-16 NO NO903622A patent/NO307488B1/no not_active IP Right Cessation
- 1990-08-17 JP JP2217992A patent/JP2866167B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| IT9048226A0 (it) | 1990-08-14 |
| NO903622L (no) | 1991-02-18 |
| JPH03104167A (ja) | 1991-05-01 |
| NO903622D0 (no) | 1990-08-16 |
| ES2023345A6 (es) | 1992-01-01 |
| FI893874A (fi) | 1991-02-18 |
| US5083234A (en) | 1992-01-21 |
| JP2866167B2 (ja) | 1999-03-08 |
| CH681581A5 (fi) | 1993-04-15 |
| SE9002663D0 (sv) | 1990-08-15 |
| DE4023776C2 (de) | 2003-07-03 |
| FR2651069A1 (fr) | 1991-02-22 |
| IT9048226A1 (it) | 1992-02-14 |
| DE4023776A1 (de) | 1991-02-21 |
| FR2651069B1 (fr) | 1998-04-03 |
| SE9002663L (sv) | 1991-02-18 |
| FI893874A0 (fi) | 1989-08-17 |
| GB2235090A (en) | 1991-02-20 |
| SE508914C2 (sv) | 1998-11-16 |
| GB2235090B (en) | 1993-11-17 |
| GB9017035D0 (en) | 1990-09-19 |
| IT1241544B (it) | 1994-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210336234A1 (en) | Flexible display substrate and method for manufacturing the same | |
| US6759309B2 (en) | Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates | |
| CN101013686B (zh) | 互连衬底、半导体器件及其制造方法 | |
| US6046410A (en) | Interface structures for electronic devices | |
| US7019402B2 (en) | Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor | |
| KR101148127B1 (ko) | 방열회로기판 및 그 제조방법 | |
| US8248803B2 (en) | Semiconductor package and method of manufacturing the same | |
| TWI313075B (en) | Method for producing a semiconductor component with a planar contact and the semiconductor component | |
| NO307488B1 (no) | Flersjiktstransduser med põsveisete kontaktforbindelser | |
| US9287468B2 (en) | LED submount with integrated interconnects | |
| EP0987768A1 (en) | Solar cell | |
| US20110291153A1 (en) | Chip submount, chip package, and fabrication method thereof | |
| US3647533A (en) | Substrate bonding bumps for large scale arrays | |
| JPWO2018043184A1 (ja) | 貫通電極基板、貫通電極基板の製造方法及び実装基板 | |
| JP2015185820A (ja) | 配線基板および電子装置 | |
| CN104541335A (zh) | 组件装置 | |
| US11270934B2 (en) | Semiconductor device and method for manufacturing same | |
| TWI738712B (zh) | 貫通電極基板及其製造方法 | |
| US6188013B1 (en) | Solar cell | |
| US10660202B1 (en) | Carrier structure and manufacturing method thereof | |
| CN109967763A (zh) | 表面包覆切削工具 | |
| CN207868201U (zh) | 影像传感芯片的封装结构 | |
| KR100445409B1 (ko) | 반도체소자의금속배선형성방법 | |
| RU2680868C1 (ru) | Герметичный сборочный модуль для монтажа микрорадиоэлектронной аппаратуры, выполненный групповым методом с последующей резкой на модули | |
| CN111415587B (zh) | 一种显示基板及其制备方法和显示面板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK1K | Patent expired |