NO174245C - Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav - Google Patents

Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav

Info

Publication number: NO174245C
Authority: NO; Norway
Prior art keywords: making; forming; circuit board; printed circuit; board substrate
Prior art date: 1988-09-23

Application number

NO893800A

Other languages

English (en)

Other versions

NO174245B (no

NO893800D0 (no

NO893800L (no

Inventor

George Martin Benedikt

David John Smith

Original Assignee

Goodrich Co B F

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-09-23

Filing date

1989-09-25

Publication date

1994-04-06

1989-09-25 Application filed by Goodrich Co B F filed Critical Goodrich Co B F

1989-09-25 Publication of NO893800D0 publication Critical patent/NO893800D0/no

1990-03-26 Publication of NO893800L publication Critical patent/NO893800L/no

1993-12-27 Publication of NO174245B publication Critical patent/NO174245B/no

1994-04-06 Publication of NO174245C publication Critical patent/NO174245C/no

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
- C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Reinforced Plastic Materials (AREA)
Laminated Bodies (AREA)
Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

NO893800A 1988-09-23 1989-09-25 Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav NO174245C (no)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US07/248,371 US5274026A (en)	1988-09-23	1988-09-23	Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made

Publications (4)

Publication Number	Publication Date
NO893800D0 NO893800D0 (no)	1989-09-25
NO893800L NO893800L (no)	1990-03-26
NO174245B NO174245B (no)	1993-12-27
NO174245C true NO174245C (no)	1994-04-06

Family

ID=22938806

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO893800A NO174245C (no)	1988-09-23	1989-09-25	Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav

Country Status (8)

Country	Link
US (1)	US5274026A (no)
EP (1)	EP0360295A3 (no)
JP (1)	JPH02198190A (no)
CN (1)	CN1042158A (no)
BR (1)	BR8904847A (no)
DK (1)	DK469489A (no)
MX (1)	MX170095B (no)
NO (1)	NO174245C (no)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5728785A (en) *	1995-07-07	1998-03-17	California Institute Of Technology	Romp polymerization in the presence of peroxide crosslinking agents to form high-density crosslinked polymers
WO1999063587A1 (en)	1998-06-05	1999-12-09	Georgia Tech Research Corporation	Porous insulating compounds and method for making same
MY139405A (en)	1998-09-28	2009-09-30	Ibiden Co Ltd	Printed circuit board and method for its production
WO2000018555A1 (en)	1998-10-01	2000-04-06	Airtech International, Inc.	Method of molding or curing a resin material at high temperatures using a multilayer release film
JP2001071416A (ja) *	1999-09-03	2001-03-21	Hitachi Chem Co Ltd	銅張り積層板の製造方法
FR2807521A1 (fr)	2000-04-07	2001-10-12	Bp Chemicals Snc	Methode de mesure de compressibilite a chaud de poudre
WO2002006377A1 (en) *	2000-07-19	2002-01-24	Dow Global Technologies Inc.	Spin-on-dielectric compositions with coating enhancer
MY128644A (en) *	2000-08-31	2007-02-28	Georgia Tech Res Inst	Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
US20040058106A1 (en) *	2002-09-17	2004-03-25	Leone Erlinda Dugaduga	Packaged solvent-containing cosmetic composition
EP1589054A4 (en) *	2003-01-31	2009-04-29	Zeon Corp	POLYMERIZABLE COMPOSITION, THERMOPLASTIC RESIN COMPOSITION, RETICULATED RESIN, AND COMPOSITE MATERIALS BASED ON RETICULATED RESIN
WO2005016991A1 (ja) *	2003-08-13	2005-02-24	Zeon Corporation	重合性組成物、及びそれを用いてなる成形体
US7364672B2 (en) *	2004-12-06	2008-04-29	Arlon, Inc.	Low loss prepregs, compositions useful for the preparation thereof and uses therefor
CN103124474B (zh) *	2006-04-25	2017-11-28	日立化成株式会社	带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板
US7648758B2 (en) *	2007-02-06	2010-01-19	Innegrity, Llc	Low dielectric loss composite material
JP2008294459A (ja) *	2008-07-11	2008-12-04	Ibiden Co Ltd	多層プリント配線板
JP5116857B2 (ja) *	2011-01-07	2013-01-09	イビデン株式会社	多層プリント配線板及び多層プリント配線板の製造方法
CN116239965B (zh) *	2023-02-10	2025-01-17	茂友木材股份有限公司	一种胶合板及提高胶合板胶层固化效率的加工方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3318758A (en) *	1963-02-18	1967-05-09	Tellite Corp	Method of making a printed circuit board which includes low temperature saturation and the product
US3508983A (en) *	1967-04-24	1970-04-28	Schjeldahl Co G T	Use of a silane coating to bond copper to plastic in making a printed circuit
US3558423A (en) *	1967-10-16	1971-01-26	Electronized Chem Corp	Low loss electrical printed circuit board comprising polyolefin,fiberglass and metallic foil
US4136247A (en) *	1977-12-05	1979-01-23	The B. F. Goodrich Company	Ring-opened iso-propylnorbornene copolymers
US4178424A (en) *	1977-12-05	1979-12-11	The Bf Goodrich Company	Cycloolefin copolymers
US4292106A (en) *	1978-07-11	1981-09-29	Clark-Schwebel Fiber Glass Corp.	Process of producing reinforced laminates from crosslinkable thermoplastic olefin polymer material
US4241132A (en) *	1978-08-17	1980-12-23	Castall Incorporated	Insulating boards
JPS5698136A (en) *	1980-01-08	1981-08-07	Kanegafuchi Chem Ind Co Ltd	Continuous manufacture of laminated substance
US4315970A (en) *	1980-02-11	1982-02-16	Dow Corning Corporation	Adhesion of metals to solid substrates
JPS61185994A (ja) *	1985-02-13	1986-08-19	信越化学工業株式会社	耐熱性フレキシブルプリント配線用基板およびその製造方法
JPS61296036A (ja) *	1985-06-24	1986-12-26	Hitachi Chem Co Ltd	積層板の製造法
JPH0641523B2 (ja) *	1985-08-08	1994-06-01	三井石油化学工業株式会社	環状オレフイン共重合体の架橋方法
US4701510A (en) *	1985-12-16	1987-10-20	The B.F. Goodrich Company	Polycycloolefins resistant to solvents
IN168456B (no) *	1985-12-16	1991-04-06	Goodrich Co B F
CA1339233C (en) *	1987-08-14	1997-08-05	Linwood P. Tenney	Bulk polymerized cycloolefin circuit boards
US4910077A (en) *	1988-08-04	1990-03-20	B.F. Goodrich Company	Polynorbornene laminates and method of making the same

1988
- 1988-09-23 US US07/248,371 patent/US5274026A/en not_active Expired - Lifetime
1989
- 1989-09-22 DK DK469489A patent/DK469489A/da not_active Application Discontinuation
- 1989-09-22 MX MX017654A patent/MX170095B/es unknown
- 1989-09-23 EP EP19890117623 patent/EP0360295A3/en not_active Withdrawn
- 1989-09-23 CN CN89108178A patent/CN1042158A/zh active Pending
- 1989-09-25 BR BR898904847A patent/BR8904847A/pt not_active Application Discontinuation
- 1989-09-25 NO NO893800A patent/NO174245C/no unknown
- 1989-09-25 JP JP1248983A patent/JPH02198190A/ja active Pending

Also Published As

Publication number	Publication date
MX170095B (es)	1993-08-06
NO174245B (no)	1993-12-27
JPH02198190A (ja)	1990-08-06
NO893800D0 (no)	1989-09-25
US5274026A (en)	1993-12-28
CN1042158A (zh)	1990-05-16
DK469489D0 (da)	1989-09-22
NO893800L (no)	1990-03-26
EP0360295A2 (en)	1990-03-28
DK469489A (da)	1990-03-24
EP0360295A3 (en)	1992-02-26
BR8904847A (pt)	1990-05-08

Publication	Publication Date	Title
NO174245C (no)	1994-04-06	Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav
DE69008963D1 (de)	1994-06-23	Elektronisches Schaltungssubstrat.
DE69204516D1 (de)	1995-10-12	Leiterplatte mit Lötüberzug und Verfahren zu ihrer Herstellung.
DE69019030D1 (de)	1995-06-08	Gedruckte Leiterplatte.
DE3784760D1 (de)	1993-04-22	Substrat fuer gedruckte schaltungsplatte.
DE3880385D1 (de)	1993-05-27	Gedruckte leiterplatte.
DE3784213D1 (de)	1993-03-25	Elektronischer apparat mit einem keramischen substrat.
GB2203906B (en)	1992-03-25	Tested printed circuit boards.
DE3775625D1 (de)	1992-02-13	Gedruckte leiterplatte.
DE68922118D1 (de)	1995-05-18	Schaltungsplatte.
DE68923207D1 (de)	1995-08-03	Schaltung zur Verhinderung eines metastabilen Zustandes.
EP0361195A3 (en)	1990-08-22	Printed circuit board with moulded substrate
DE3784137D1 (de)	1993-03-25	Elektronische schreibmaschine mit wort-korrekturfaehigkeit.
DE3669431D1 (de)	1990-04-12	Gedruckte schaltungsplatte mit hoher dichte.
DE69020204D1 (de)	1995-07-27	Mehrschichtige gedruckte Leiterplatte.
DE68921666D1 (de)	1995-04-20	Anordnung zum Löten von gedruckten Schaltungen.
EP0663707A3 (en)	1996-01-31	Locking device for a printed circuit board edge connector.
KR900702760A (ko)	1990-12-08	인쇄회로기판
DE3771707D1 (de)	1991-08-29	Gedruckte leiterplatte.
DE3689005D1 (de)	1993-10-14	Vorrichtung zum Löten von gedruckten Schaltungen.
DE3789990D1 (de)	1994-07-14	Elektronisches Druckverfahren.
DE3679627D1 (de)	1991-07-11	Mehrschichtige gedruckte schaltungsplatte.
DE68906160D1 (de)	1993-05-27	Gedruckte schaltungsplatte.
FR2525849B1 (fr)	1985-08-09	Substrat de circuit imprime
KR900007287A (ko)	1990-05-09	인쇄회로 및 그 제조공정