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NL7605270A - Werkwijze en inrichting voor het vormen van een electrisch geleidende verbinding tussen componen- ten en/of schakelingen van kleine afmetingen. - Google Patents

Werkwijze en inrichting voor het vormen van een electrisch geleidende verbinding tussen componen- ten en/of schakelingen van kleine afmetingen.

Info

Publication number
NL7605270A
NL7605270A NL7605270A NL7605270A NL7605270A NL 7605270 A NL7605270 A NL 7605270A NL 7605270 A NL7605270 A NL 7605270A NL 7605270 A NL7605270 A NL 7605270A NL 7605270 A NL7605270 A NL 7605270A
Authority
NL
Netherlands
Prior art keywords
wire
forming
ball
circuits
components
Prior art date
Application number
NL7605270A
Other languages
English (en)
Original Assignee
Welding Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Welding Inst filed Critical Welding Inst
Publication of NL7605270A publication Critical patent/NL7605270A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Spark Plugs (AREA)
NL7605270A 1975-05-15 1976-05-17 Werkwijze en inrichting voor het vormen van een electrisch geleidende verbinding tussen componen- ten en/of schakelingen van kleine afmetingen. NL7605270A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB20701/75A GB1536872A (en) 1975-05-15 1975-05-15 Electrical inter-connection method and apparatus

Publications (1)

Publication Number Publication Date
NL7605270A true NL7605270A (nl) 1976-11-17

Family

ID=10150248

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7605270A NL7605270A (nl) 1975-05-15 1976-05-17 Werkwijze en inrichting voor het vormen van een electrisch geleidende verbinding tussen componen- ten en/of schakelingen van kleine afmetingen.

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US (1) US4098447A (nl)
JP (1) JPS51147174A (nl)
DE (1) DE2621138A1 (nl)
FR (1) FR2311430A1 (nl)
GB (1) GB1536872A (nl)
NL (1) NL7605270A (nl)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
JPS54160540A (en) * 1978-06-09 1979-12-19 Toshiba Corp Bonding of aluminium wire
US4242790A (en) * 1978-09-28 1981-01-06 The Bendix Corporation Method of making an electrical connector contact
US4489231A (en) * 1980-09-19 1984-12-18 Teltec Inc. Method for preparing electrical conductor
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
JPS5789232A (en) * 1980-11-26 1982-06-03 Hitachi Ltd Forming device of spherical lump
US4388512A (en) 1981-03-09 1983-06-14 Raytheon Company Aluminum wire ball bonding apparatus and method
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
EP0061852A3 (en) * 1981-03-30 1983-08-24 Texas Instruments Incorporated Self starting current controlled discharge bonding wire ball maker
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
JPS57118649A (en) * 1981-07-27 1982-07-23 Hitachi Ltd Device with which tip of metal wire is spherically formed
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
JPS5863142A (ja) * 1981-10-12 1983-04-14 Toshiba Corp ボンデイズグワイヤおよびボンデイング方法
JPS58131743A (ja) * 1982-01-29 1983-08-05 Shinkawa Ltd ワイヤボンダにおけるボ−ル形成方法及びその装置
JPS58169918A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd ワイヤボンダ
JPS5926246U (ja) * 1982-08-10 1984-02-18 海上電機株式会社 アルミボ−ル成形用スパ−ク電極
JPS5973998A (ja) * 1982-10-08 1984-04-26 ラ−デナ−・マシ−ネンフアブリツク・アウグスト・コルブス・ゲ−エムベ−ハ−・ウント・コンパニ・カ−ゲ− 無線とじ製本機械の挾み装置へのブツクブロツク送給装置
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4555052A (en) * 1983-02-28 1985-11-26 Fairchild Camera & Instrument Corporation Lead wire bond attempt detection
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4482794A (en) * 1983-11-28 1984-11-13 Fairchild Camera & Instrument Corporation Pulse-width control of bonding ball formation
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US4597519A (en) * 1984-02-27 1986-07-01 Fairchild Camera & Instrument Corporation Lead wire bonding with increased bonding surface area
US4523071A (en) * 1984-05-14 1985-06-11 Hughes Aircraft Company Method and apparatus for forming a ball at the end of a wire
DE3447657A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Drahtklemmvorrichtung
DE3447587A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses
JPS61296731A (ja) * 1985-06-26 1986-12-27 Toshiba Corp ワイヤボンデイング装置
US4674671A (en) * 1985-11-04 1987-06-23 Olin Corporation Thermosonic palladium lead wire bonding
GB9100225D0 (en) * 1991-01-05 1991-02-20 Emhart Inc Bonding head
US5255834A (en) * 1991-12-13 1993-10-26 Ero Industries Article carriers with incorporated three-dimensional graphical display panels
US6001724A (en) * 1996-01-29 1999-12-14 Micron Technology, Inc. Method for forming bumps on a semiconductor die using applied voltage pulses to an aluminum wire
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
US20040124545A1 (en) * 1996-12-09 2004-07-01 Daniel Wang High density integrated circuits and the method of packaging the same
US6180891B1 (en) 1997-02-26 2001-01-30 International Business Machines Corporation Control of size and heat affected zone for fine pitch wire bonding
US6234376B1 (en) 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding
KR100762873B1 (ko) * 2003-06-10 2007-10-08 주식회사 하이닉스반도체 내부 전압 발생기
US20050067382A1 (en) * 2003-09-26 2005-03-31 Gary Gillotti Fine pitch electronic flame-off wand electrode
US7411157B2 (en) 2003-09-26 2008-08-12 Kulicke And Soffa Industries, Inc. Electronic flame-off electrode with ball-shaped tip
US8357998B2 (en) * 2009-02-09 2013-01-22 Advanced Semiconductor Engineering, Inc. Wirebonded semiconductor package
US8096461B2 (en) * 2009-09-03 2012-01-17 Advanced Semiconductor Engineering, Inc. Wire-bonding machine with cover-gas supply device
CN102248279B (zh) * 2011-07-01 2012-12-12 中国电子科技集团公司第二研究所 共晶压力精确调节机构
CN103993312B (zh) * 2013-12-16 2016-09-14 湖北工业大学 旋转体表面电火花熔敷改性工艺及装置
US10391574B2 (en) * 2013-12-16 2019-08-27 Huys Industries Limited Welding method and apparatus therefor
CN104476071B (zh) * 2014-11-18 2017-02-08 珠海格力电器股份有限公司 焊接分线装置
CN105977750B (zh) * 2016-07-01 2018-09-25 潍坊路加精工有限公司 焊接装置
CA3181027A1 (en) 2020-04-14 2021-10-21 Stephen PETERKIN Welded assembly and method of welding using electro-spark discharge

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2679570A (en) * 1951-08-18 1954-05-25 Bell Telephone Labor Inc Formation of electrode tip by electric current heating
US3950631A (en) * 1970-06-19 1976-04-13 U.S. Philips Corporation Device for welding a wire by means of thermo-compression bonding
FR2094394A5 (nl) * 1970-06-19 1972-02-04 Radiotechnique Compelec
US3819102A (en) * 1971-05-07 1974-06-25 Tokyo Sokuhan Kk Loop height adjusting device for a supersonic wire bonder
US3826000A (en) * 1972-05-18 1974-07-30 Essex International Inc Terminating of electrical conductors
JPS539951B2 (nl) * 1974-04-26 1978-04-10
US3934108A (en) * 1974-09-16 1976-01-20 Uthe Technology, Inc. Lead bonding method and apparatus

Also Published As

Publication number Publication date
GB1536872A (en) 1978-12-20
DE2621138A1 (de) 1976-12-02
FR2311430B1 (nl) 1980-09-12
FR2311430A1 (fr) 1976-12-10
US4098447A (en) 1978-07-04
JPS51147174A (en) 1976-12-17

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