NL280849A - - Google Patents
Info
- Publication number
- NL280849A NL280849A NL280849DA NL280849A NL 280849 A NL280849 A NL 280849A NL 280849D A NL280849D A NL 280849DA NL 280849 A NL280849 A NL 280849A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/104—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/4816—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
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- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2524361A GB968106A (en) | 1961-07-12 | 1961-07-12 | Improvements in or relating to semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
NL280849A true NL280849A (de) | 1900-01-01 |
Family
ID=10224528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL280849D NL280849A (de) | 1961-07-12 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3361943A (de) |
DE (1) | DE1212215C2 (de) |
GB (1) | GB968106A (de) |
NL (1) | NL280849A (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3484660A (en) * | 1963-09-20 | 1969-12-16 | Gen Electric | Sealed electrical device |
FR1466427A (fr) * | 1965-12-03 | 1967-01-20 | Comp Generale Electricite | Capot étanche pour dispositif semi-conducteur |
DE1589496A1 (de) * | 1967-01-26 | 1970-03-26 | Bbc Brown Boveri & Cie | Halbleiterelement mit abgeschraegter Seitenflaeche und Verfahren zum Herstellen |
US3643136A (en) * | 1970-05-22 | 1972-02-15 | Gen Electric | Glass passivated double beveled semiconductor device with partially spaced preform |
DE2358937C3 (de) * | 1973-11-27 | 1976-07-15 | Licentia Gmbh | Thyristor fuer hochspannung im kilovoltbereich |
DE2537984C3 (de) * | 1975-08-26 | 1981-07-16 | Siemens AG, 1000 Berlin und 8000 München | Thyristor |
JPS5624972A (en) * | 1979-08-07 | 1981-03-10 | Mitsubishi Electric Corp | Thyristor |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA509126A (en) * | 1949-05-28 | 1955-01-11 | Western Electric Company, Incorporated | Semiconductor translating devices |
GB774388A (en) * | 1954-01-28 | 1957-05-08 | Marconi Wireless Telegraph Co | Improvements in or relating to semi-conducting amplifiers |
DE1073632B (de) * | 1956-06-18 | 1960-01-21 | Radio Corporation Of America, New York, N. Y. (V. St. A.) | Drift-Transistor mit einer Zonenfolge P-N-P bzw. N-P-N und Verfahren zu seiner Herstellung |
US2927011A (en) * | 1956-07-26 | 1960-03-01 | Texas Instruments Inc | Etching of semiconductor materials |
US2980830A (en) * | 1956-08-22 | 1961-04-18 | Shockley William | Junction transistor |
US2878152A (en) * | 1956-11-28 | 1959-03-17 | Texas Instruments Inc | Grown junction transistors |
NL113266C (de) * | 1957-01-18 | |||
US2929859A (en) * | 1957-03-12 | 1960-03-22 | Rca Corp | Semiconductor devices |
US2879190A (en) * | 1957-03-22 | 1959-03-24 | Bell Telephone Labor Inc | Fabrication of silicon devices |
US3007090A (en) * | 1957-09-04 | 1961-10-31 | Ibm | Back resistance control for junction semiconductor devices |
FR73531E (fr) * | 1958-04-30 | 1960-08-22 | Telecommunications Sa | Réalisation d'un transistron au germanium obtenu par la méthode de double diffusion |
FR1197172A (fr) * | 1958-05-28 | 1959-11-27 | Telecommunications Sa | Procédé de fabrication applicable aux transistrons par diffusion utilisables en basse fréquence |
NL240714A (de) * | 1958-07-02 | |||
US2951191A (en) * | 1958-08-26 | 1960-08-30 | Rca Corp | Semiconductor devices |
NL242556A (de) * | 1958-08-27 | |||
NL243218A (de) * | 1958-12-24 | |||
FR1228285A (fr) * | 1959-03-11 | 1960-08-29 | Structures à semi-conducteurs pour amplificateur paramétrique à micro-ondes | |
NL125412C (de) * | 1959-04-15 | |||
FR1273633A (fr) * | 1959-11-21 | 1961-10-13 | Siemens Ag | Procédé d'obtention d'éléments semi-conducteurs |
DE1839161U (de) * | 1960-09-20 | 1961-10-12 | Telefunken Patent | Halbleiteranordnung. |
BE615177A (de) * | 1961-03-17 | |||
US3255055A (en) * | 1963-03-20 | 1966-06-07 | Hoffman Electronics Corp | Semiconductor device |
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0
- NL NL280849D patent/NL280849A/xx unknown
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1961
- 1961-07-12 GB GB2524361A patent/GB968106A/en not_active Expired
-
1962
- 1962-07-10 US US20887162 patent/US3361943A/en not_active Expired - Lifetime
- 1962-07-11 DE DE19621212215 patent/DE1212215C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3361943A (en) | 1968-01-02 |
DE1212215C2 (de) | 1974-03-28 |
DE1212215B (de) | 1974-03-28 |
GB968106A (en) | 1964-08-26 |