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MY183619A - Universal surface-mount semiconductor package - Google Patents

Universal surface-mount semiconductor package

Info

Publication number
MY183619A
MY183619A MYPI2018700123A MYPI2018700123A MY183619A MY 183619 A MY183619 A MY 183619A MY PI2018700123 A MYPI2018700123 A MY PI2018700123A MY PI2018700123 A MYPI2018700123 A MY PI2018700123A MY 183619 A MY183619 A MY 183619A
Authority
MY
Malaysia
Prior art keywords
packages
laser beam
plastic
leadframe
die pads
Prior art date
Application number
MYPI2018700123A
Inventor
Keng-Hung Lin
Richard K Williams
Original Assignee
Adventive Tech Ltd
Richard K Williams
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/797,056 external-priority patent/US9576932B2/en
Application filed by Adventive Tech Ltd, Richard K Williams filed Critical Adventive Tech Ltd
Publication of MY183619A publication Critical patent/MY183619A/en

Links

Classifications

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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

In the fabrication of semiconductor packages, a leadframe is formed by masking and etching a metal sheet from both sides, and a plastic block is formed over a plurality of dice attached to die pads (1C; 10; 33B; 34D; 34O; 34R; 34S) in the leadframe. A laser beam (198A; 199A) is used to form individual plastic capsules (127B; 127C) for each package, and a second laser beam (198A; 199A) is used to singulate the packages by severing the metal conductors (128A), tie bars and rails between the packages. A wide variety of different types of packages, from gull-wing footed packages to leadless packages, with either exposed or isolated die pads (1C; 10; 33B; 34D; 34O; 34R; 34S), may be fabricated merely by varying the patterns of the openings in the mask layers and the width of the plastic trenches created by the first laser beam (198A; 199A).
MYPI2018700123A 2015-07-10 2016-07-06 Universal surface-mount semiconductor package MY183619A (en)

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US14/797,056 US9576932B2 (en) 2013-03-09 2015-07-10 Universal surface-mount semiconductor package
PCT/US2016/041169 WO2017011246A1 (en) 2015-07-10 2016-07-06 Universal surface-mount semiconductor package

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TWI810380B (en) * 2019-02-22 2023-08-01 南韓商愛思開海力士有限公司 System-in-packages including a bridge die
TWI690039B (en) * 2019-07-03 2020-04-01 矽品精密工業股份有限公司 Electronic package and manufacturing method thereof
CN111432554B (en) * 2020-03-13 2021-08-10 清华大学 Micro-system architecture
TWI736409B (en) * 2020-03-27 2021-08-11 美商矽成積體電路股份有限公司 Package structure
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US6909178B2 (en) * 2000-09-06 2005-06-21 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing the same
US7588999B2 (en) * 2005-10-28 2009-09-15 Semiconductor Components Industries, Llc Method of forming a leaded molded array package
DE102006034679A1 (en) * 2006-07-24 2008-01-31 Infineon Technologies Ag Semiconductor module with power semiconductor chip and passive component and method for producing the same
US8071427B2 (en) * 2009-01-29 2011-12-06 Semiconductor Components Industries, Llc Method for manufacturing a semiconductor component and structure therefor
US20110115069A1 (en) * 2009-11-13 2011-05-19 Serene Seoh Hian Teh Electronic device including a packaging substrate and an electrical conductor within a via and a process of forming the same
US8575006B2 (en) * 2009-11-30 2013-11-05 Alpha and Omega Semiconducotr Incorporated Process to form semiconductor packages with external leads
CN101719759B (en) * 2009-12-04 2011-12-14 武汉盛华微系统技术股份有限公司 Method for adhering components and parts to packaging surface
US9831393B2 (en) * 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
KR101698932B1 (en) * 2010-08-17 2017-01-23 삼성전자 주식회사 Semiconductor Package And Method For Manufacturing The Same
US8513787B2 (en) * 2011-08-16 2013-08-20 Advanced Analogic Technologies, Incorporated Multi-die semiconductor package with one or more embedded die pads
JP6095997B2 (en) * 2013-02-13 2017-03-15 エスアイアイ・セミコンダクタ株式会社 Manufacturing method of resin-encapsulated semiconductor device

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TW201712826A (en) 2017-04-01
CN109478544A (en) 2019-03-15
TWI640071B (en) 2018-11-01
WO2017011246A1 (en) 2017-01-19
CN109478544B (en) 2023-05-26

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