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MXPA05004469A - Tarjeta inteligente que comprende un componente saliente y metodo de fabricacion. - Google Patents

Tarjeta inteligente que comprende un componente saliente y metodo de fabricacion.

Info

Publication number
MXPA05004469A
MXPA05004469A MXPA05004469A MXPA05004469A MXPA05004469A MX PA05004469 A MXPA05004469 A MX PA05004469A MX PA05004469 A MXPA05004469 A MX PA05004469A MX PA05004469 A MXPA05004469 A MX PA05004469A MX PA05004469 A MXPA05004469 A MX PA05004469A
Authority
MX
Mexico
Prior art keywords
protruding component
smart card
component
making same
microcircuit
Prior art date
Application number
MXPA05004469A
Other languages
English (en)
Inventor
Venambre Jacques
Original Assignee
Oberthur Card System S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card System S A filed Critical Oberthur Card System S A
Publication of MXPA05004469A publication Critical patent/MXPA05004469A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)
  • Ceramic Capacitors (AREA)
  • Details Of Resistors (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

La invencion se refiere a una tarjeta inteligente que comprende un microcircuito, al menos otro componente incluyendo un componente saliente y contactos externos en un sujetador de tarjeta. La invencion se caracteriza porque el microcircuito (1), el componente saliente (2) y los contactos externos (12) forman parte de un sub-ensamble (S1) fijo en un alojamiento (C1+C2+C3) proporcionado en parte del espesor del sujetador de tarjeta, dicho sub-ensamble incluyendo una pelicula de soporte (10) llevando en una superficie interior el microcircuito (1) y al menos el componente saliente (2) y en la otra superficie los contactos externos (12), una ventana (11 ) instalandose en dicha parte opuesta de pelicula del componente saliente.
MXPA05004469A 2002-10-28 2003-10-23 Tarjeta inteligente que comprende un componente saliente y metodo de fabricacion. MXPA05004469A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0213465A FR2846446B1 (fr) 2002-10-28 2002-10-28 Carte a puce comportant un composant debouchant et un procede de fabrication
PCT/FR2003/003139 WO2004040507A1 (fr) 2002-10-28 2003-10-23 Carte a puce comportant un composant debouchant et un procede de fabrication

Publications (1)

Publication Number Publication Date
MXPA05004469A true MXPA05004469A (es) 2005-11-23

Family

ID=32088335

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05004469A MXPA05004469A (es) 2002-10-28 2003-10-23 Tarjeta inteligente que comprende un componente saliente y metodo de fabricacion.

Country Status (12)

Country Link
US (1) US9792541B2 (es)
EP (1) EP1556832B1 (es)
JP (1) JP4287378B2 (es)
CN (1) CN100424722C (es)
AT (1) ATE349049T1 (es)
AU (1) AU2003285440A1 (es)
CA (1) CA2503688C (es)
DE (1) DE60310599T2 (es)
ES (1) ES2276132T3 (es)
FR (1) FR2846446B1 (es)
MX (1) MXPA05004469A (es)
WO (1) WO2004040507A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2428445B (en) 2005-07-20 2009-01-28 Multiclip Co Ltd Device, method and apparatus for lifting a railway rail
FR2997535B1 (fr) 2012-10-30 2016-07-08 Oberthur Technologies Procede de fabrication d'une carte a puce a plusieurs composants et carte ainsi obtenue
WO2014159026A1 (en) * 2013-03-14 2014-10-02 X-Card Holdings, Llc Information carrying card for displaying one time passcodes, and method of making the same
US10789524B2 (en) 2013-09-08 2020-09-29 Amatech Group Limited Smartcard with a booster antenna and a wireless connection between modules
US11410010B2 (en) 2014-08-21 2022-08-09 Amatech Group Limiied Smartcard with a coupling frame and a wireless connection between modules
FR3115904B1 (fr) 2020-10-30 2023-11-17 Linxens Holding Procédé de fabrication d’un module de carte à puce avec composant électronique soudé
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61157990A (ja) * 1984-12-29 1986-07-17 Kyodo Printing Co Ltd Ｉｃカ−ド
EP0234954A3 (en) * 1986-02-28 1988-04-27 Intellicard International, Inc. Magnetic card with identification code
JPH0437596A (ja) * 1990-06-01 1992-02-07 Toshiba Corp 配線基板装置
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
DE19805282A1 (de) * 1998-02-10 1999-08-19 Siemens Ag Flächiger Träger mit einer Anzeigeeinrichtung
FR2776796B1 (fr) * 1998-03-31 2000-12-01 Gemplus Card Int Procede de fabrication de cartes a puce
US6239976B1 (en) * 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
FR2789505B1 (fr) * 1999-02-08 2001-03-09 Gemplus Card Int Procede de fabrication de support de memorisation portable de type carte a puce

Also Published As

Publication number Publication date
DE60310599T2 (de) 2007-10-25
JP2006504193A (ja) 2006-02-02
ES2276132T3 (es) 2007-06-16
CA2503688A1 (fr) 2004-05-13
US20060237542A1 (en) 2006-10-26
CA2503688C (fr) 2011-06-28
ATE349049T1 (de) 2007-01-15
US9792541B2 (en) 2017-10-17
WO2004040507A1 (fr) 2004-05-13
CN1708770A (zh) 2005-12-14
FR2846446A1 (fr) 2004-04-30
FR2846446B1 (fr) 2005-02-18
DE60310599D1 (de) 2007-02-01
JP4287378B2 (ja) 2009-07-01
AU2003285440A1 (en) 2004-05-25
EP1556832B1 (fr) 2006-12-20
WO2004040507A8 (fr) 2005-05-19
CN100424722C (zh) 2008-10-08
EP1556832A2 (fr) 2005-07-27

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