[go: up one dir, main page]

MX9709974A - Improved method and apparatus for a surface-mounted fuse device. - Google Patents

Improved method and apparatus for a surface-mounted fuse device.

Info

Publication number
MX9709974A
MX9709974A MX9709974A MX9709974A MX9709974A MX 9709974 A MX9709974 A MX 9709974A MX 9709974 A MX9709974 A MX 9709974A MX 9709974 A MX9709974 A MX 9709974A MX 9709974 A MX9709974 A MX 9709974A
Authority
MX
Mexico
Prior art keywords
improved method
fuse device
protective layer
supporting substrate
subassembly includes
Prior art date
Application number
MX9709974A
Other languages
Spanish (es)
Other versions
MXPA97009974A (en
Inventor
Vladimir Blecha
Katherine M Mcguire
Andrew J Neuhalfen
Daniel B Onken
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/482,829 external-priority patent/US5943764A/en
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Publication of MX9709974A publication Critical patent/MX9709974A/en
Publication of MXPA97009974A publication Critical patent/MXPA97009974A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046Fuses formed as printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02Manufacture of fuses
    • H01H69/022Manufacture of fuses of printed circuit fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411Miniature fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05Component parts thereof
    • H01H85/055Fusible members
    • H01H85/08Fusible members characterised by the shape or form of the fusible member
    • H01H85/11Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lock And Its Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A thin film surface-mount fuse (58) having two material subassemblies. The first subassembly includes a fusible link (42), its supporting substrate (13) and terminal pads (34, 36). The second subassembly includes a protective layer (56) which overlies the fusible link (42) so as to provide protection from impacts and oxidation. The protective layer (56) is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
MXPA/A/1997/009974A 1995-06-07 1997-12-08 Method and improved apparatus for a superfield fused device MXPA97009974A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US47256395A 1995-06-07 1995-06-07
US08/482,829 US5943764A (en) 1994-05-27 1995-06-07 Method of manufacturing a surface-mounted fuse device
US472563 1995-06-07
US08482829 1995-06-07

Publications (2)

Publication Number Publication Date
MX9709974A true MX9709974A (en) 1998-06-28
MXPA97009974A MXPA97009974A (en) 1998-10-30

Family

ID=

Also Published As

Publication number Publication date
WO1996041359A1 (en) 1996-12-19
ATE173355T1 (en) 1998-11-15
CN1191624A (en) 1998-08-26
CA2224070A1 (en) 1996-12-19
DE69600974D1 (en) 1998-12-17
AU6154796A (en) 1996-12-30
ES2124634T3 (en) 1999-02-01
JPH10512094A (en) 1998-11-17
EP0830704A1 (en) 1998-03-25
DK0830704T3 (en) 1999-07-26
EP0830704B1 (en) 1998-11-11
DE69600974T2 (en) 1999-06-10

Similar Documents

Publication Publication Date Title
AU5136498A (en) Semiconductor device, method for manufacture thereof, circuit board, and electronic equipment
AU6154796A (en) Improved method and apparatus for a surface-mounted fuse dev ice
IL132432A0 (en) An exposure apparatus exposure method using the same and method of manufacture of circuit device
GB2303208B (en) Viscous liquid exothermic composition,exothermic device made thereof and manufacturing method of exothermic device
IL83325A (en) Circuit package attachment apparatus and method
AU3209895A (en) Solder pad for printed circuit boards
EP0650314A3 (en) Method and apparatus for manufacture of printed circuit cards.
EP0749079A3 (en) Terminal device
GB9512101D0 (en) Circuit board test apparatus and method
FR2547155B1 (en) METHOD AND DEVICE FOR SERIGRAPHIC PRINTING; ELECTRICAL CIRCUIT THUS OBTAINED
EP0422919A3 (en) Antistatic adhesive tape
SG65735A1 (en) Carrier film and integrated circuit device using the same and method of making the same
AU8161994A (en) IC card having an electronic apparatus
FR2737068B1 (en) COMMUNICATION APPARATUS WITH ELECTROSTATIC PROTECTION
EP0633478A3 (en) Method and device for testing electronic circuit boards.
SG72904A1 (en) Semiconductor device method of fabricating the same film carrier tape circuit board and electronic apparatus
DK490186D0 (en) PROCEDURE FOR MANUFACTURING PREPRAGES AND METAL Cached BASIC MATERIAL FOR PRINTED CIRCUIT CARDS AND APPARATUS FOR PRESENTING THE PROCEDURE
SG69984A1 (en) Circuit-forming substrate and circuit substrate
AU3496284A (en) Polymer coated reactive metal electrode
IL111589A0 (en) Integrated circuit test apparatus
AU2720784A (en) Printed circuit board testing apparatus
AU5536394A (en) Method and apparatus for soldering circuit boards
EP0618453A3 (en) Method of testing circuit boards and device for carrying out the method.
GB9623740D0 (en) Assembled printed circuit board and method for the manufacture thereof, as well as for desoldering components
FR2726151B1 (en) METHOD AND DEVICE FOR HERMETIC PROTECTION OF ELECTRONIC CIRCUIT

Legal Events

Date Code Title Description
FA Abandonment or withdrawal