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ATE173355T1 - IMPROVED METHOD AND APPARATUS FOR SURFACE MOUNT SECURITY DEVICE - Google Patents

IMPROVED METHOD AND APPARATUS FOR SURFACE MOUNT SECURITY DEVICE

Info

Publication number
ATE173355T1
ATE173355T1 AT96919129T AT96919129T ATE173355T1 AT E173355 T1 ATE173355 T1 AT E173355T1 AT 96919129 T AT96919129 T AT 96919129T AT 96919129 T AT96919129 T AT 96919129T AT E173355 T1 ATE173355 T1 AT E173355T1
Authority
AT
Austria
Prior art keywords
security device
improved method
surface mount
protective layer
supporting substrate
Prior art date
Application number
AT96919129T
Other languages
German (de)
Inventor
Vladimir Blecha
Katherine M Mcguire
Andrew J Neuhalfen
Daniel B Onken
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/482,829 external-priority patent/US5943764A/en
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Application granted granted Critical
Publication of ATE173355T1 publication Critical patent/ATE173355T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lock And Its Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A thin film surface-mount fuse (58) having two material subassemblies. The first subassembly includes a fusible link (42), its supporting substrate (13) and terminal pads (34, 36). The second subassembly includes a protective layer (56) which overlies the fusible link (42) so as to provide protection from impacts and oxidation. The protective layer (56) is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
AT96919129T 1995-06-07 1996-06-06 IMPROVED METHOD AND APPARATUS FOR SURFACE MOUNT SECURITY DEVICE ATE173355T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47256395A 1995-06-07 1995-06-07
US08/482,829 US5943764A (en) 1994-05-27 1995-06-07 Method of manufacturing a surface-mounted fuse device

Publications (1)

Publication Number Publication Date
ATE173355T1 true ATE173355T1 (en) 1998-11-15

Family

ID=27043825

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96919129T ATE173355T1 (en) 1995-06-07 1996-06-06 IMPROVED METHOD AND APPARATUS FOR SURFACE MOUNT SECURITY DEVICE

Country Status (10)

Country Link
EP (1) EP0830704B1 (en)
JP (1) JPH10512094A (en)
CN (1) CN1191624A (en)
AT (1) ATE173355T1 (en)
AU (1) AU6154796A (en)
CA (1) CA2224070A1 (en)
DE (1) DE69600974T2 (en)
DK (1) DK0830704T3 (en)
ES (1) ES2124634T3 (en)
WO (1) WO1996041359A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
EP1074034B1 (en) 1998-04-24 2002-03-06 Wickmann-Werke GmbH Electrical fuse element
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
GB0001573D0 (en) 2000-01-24 2000-03-15 Welwyn Components Ltd Printed circuit board with fuse
WO2002103735A1 (en) * 2001-06-11 2002-12-27 Wickmann-Werke Gmbh Fuse component
US7551048B2 (en) * 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
CN101197351B (en) * 2006-12-05 2010-09-01 邱鸿智 Chip slow-fusing fuse structure and manufacturing method
CN101894717B (en) * 2009-05-21 2012-10-24 邱鸿智 Fuse structure with drilling electrode and die coating and manufacturing method thereof
US9117615B2 (en) 2010-05-17 2015-08-25 Littlefuse, Inc. Double wound fusible element and associated fuse
JP5505142B2 (en) * 2010-07-06 2014-05-28 富士通株式会社 Fuse and manufacturing method thereof
CN101964287B (en) * 2010-10-22 2013-01-23 广东风华高新科技股份有限公司 Film chip fuse and preparation method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164725A (en) * 1977-08-01 1979-08-14 Wiebe Gerald L Three-piece solderless plug-in electrically conducting component
GB1604820A (en) * 1978-05-30 1981-12-16 Laur Knudson Nordisk Elektrici Electrical safety fuses
DE3044711A1 (en) * 1980-11-27 1982-07-01 Wickmann-Werke GmbH, 5810 Witten FUSE PROTECTION
DE3530354A1 (en) * 1985-08-24 1987-03-05 Opel Adam Ag ELECTRICAL FUSE ARRANGEMENT
JPH0831303B2 (en) * 1986-12-01 1996-03-27 オムロン株式会社 Chip type fuse
ATE113755T1 (en) * 1990-03-13 1994-11-15 Morrill Glasstek Inc ELECTRICAL COMPONENT (FUSE) AND ITS MANUFACTURING PROCESS.
JPH0433230A (en) * 1990-05-29 1992-02-04 Mitsubishi Materials Corp Chip type fuse
JPH04248221A (en) * 1991-01-23 1992-09-03 Hitachi Chem Co Ltd Manufacture of chip type fuse
JPH04245132A (en) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd Base for chip fuse and chip fuse using it
JPH04245129A (en) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd Chip type fuse
JPH04255627A (en) * 1991-02-08 1992-09-10 Hitachi Chem Co Ltd Manufacture of chip-type fuse
JPH05166454A (en) * 1991-12-11 1993-07-02 Hitachi Chem Co Ltd Chip type fuse
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
JPH0636672A (en) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd Card type fuse and manufacture thereof
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device

Also Published As

Publication number Publication date
ES2124634T3 (en) 1999-02-01
CA2224070A1 (en) 1996-12-19
DK0830704T3 (en) 1999-07-26
DE69600974D1 (en) 1998-12-17
DE69600974T2 (en) 1999-06-10
AU6154796A (en) 1996-12-30
JPH10512094A (en) 1998-11-17
WO1996041359A1 (en) 1996-12-19
CN1191624A (en) 1998-08-26
EP0830704B1 (en) 1998-11-11
MX9709974A (en) 1998-06-28
EP0830704A1 (en) 1998-03-25

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee