[go: up one dir, main page]

MX9701909A - Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductora. - Google Patents

Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductora.

Info

Publication number
MX9701909A
MX9701909A MX9701909A MX9701909A MX9701909A MX 9701909 A MX9701909 A MX 9701909A MX 9701909 A MX9701909 A MX 9701909A MX 9701909 A MX9701909 A MX 9701909A MX 9701909 A MX9701909 A MX 9701909A
Authority
MX
Mexico
Prior art keywords
conductive plate
construction means
electronic construction
fixtures
precise positioning
Prior art date
Application number
MX9701909A
Other languages
English (en)
Other versions
MXPA97001909A (es
Inventor
Ralf-Dieter Busse
Carsten Storbeck
Thomas Lade
Original Assignee
Krone Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19610586A external-priority patent/DE19610586B4/de
Priority claimed from DE1996111631 external-priority patent/DE19611631C1/de
Priority claimed from DE19620340A external-priority patent/DE19620340C1/de
Application filed by Krone Ag filed Critical Krone Ag
Publication of MX9701909A publication Critical patent/MX9701909A/es
Publication of MXPA97001909A publication Critical patent/MXPA97001909A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Thermistors And Varistors (AREA)
  • Structure Of Printed Boards (AREA)
  • Resistance Welding (AREA)
  • Fuses (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

La invencion se refiere a una placa conductora (1) y a un procedimiento para el posicionamiento preciso de los elementos de construccion electronicos en la superficie (12) de la placa conductora (1), en cuyo caso los elementos de construccion electronicos han de ser unidos de forma eléctricamente conductiva y estable en la placa conductora (1), mediante la técnica de soldadura Reflow. Para ello, se emplea una placa conductora (1) que dispone de zonas (2, 3), por lo menos parcialmente adaptadas a los elementos de construccion electronicos en la superficie (12) del contorno exterior, para el alojamiento de los elementos de construccion electronicos. Estas zonas que están configuradas como contornos de hendidura (3) o como ranuras elaboradas (2), aseguran que los elementos de construccion electronicos colocados quedan sujetados en la posicion deseada, después de la aplicacion de la pasta de soldar y antes de la propia realizacion de soldadura. Adicionalmente se puede empalmar la placa conductora equipada, con una caja consistente en los aditamentos de configuracion abovedada de un material por lo menos parcialmente conformable. Los aditamentos, atravesando la placa conductora, se introducen en las escotaduras (14, 15 o 17) elaboradas en ella y así se consigue una union contundente en forma y/o fuerza entre la caja y la placa conductora mediante la conformacion de los aditamentos (14). Además se puede colocar un enchufe de proteccion contra sobretensiones para las regletas de la técnica de telecomunicacion con un descargador de sobretension (4), que une las dos funciones de "contacto a tierra" y "contacto fail-safe" en una misma pieza y por lo tanto, se puede realizar un equipamiento con un montaje con costes y esfuerzos reducidos.
MXPA/A/1997/001909A 1996-03-18 1997-03-13 Placa conductora y procedimiento para elposicionamiento preciso de los equipos y soldadurade los elementos de construccion electronicos enlas superficies de la placa conductora MXPA97001909A (es)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
DE19610586A DE19610586B4 (de) 1996-03-18 1996-03-18 Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE19610586.2 1996-03-18
DE19610586,2 1996-03-18
DE19611631.7 1996-03-25
DE1996111631 DE19611631C1 (de) 1996-03-25 1996-03-25 Modul mit einem Gehäuse und einer Grundplatte
DE19611631,7 1996-03-25
DE19620340,6 1996-05-21
DE19620340A DE19620340C1 (de) 1996-05-21 1996-05-21 Überspannungs - Schutzstecker
DE19620340.6 1996-05-21

Publications (2)

Publication Number Publication Date
MX9701909A true MX9701909A (es) 1997-09-30
MXPA97001909A MXPA97001909A (es) 1998-07-03

Family

ID=

Also Published As

Publication number Publication date
KR19990008482A (ko) 1999-02-05
BG62425B1 (bg) 1999-10-29
AR006169A1 (es) 1999-08-11
CZ292485B6 (cs) 2003-10-15
CO4560406A1 (es) 1998-02-10
CA2199898A1 (en) 1997-09-18
UY24454A1 (es) 1997-03-04
EP0797379A3 (de) 1998-01-07
SI0797379T1 (en) 2003-04-30
AU1251397A (en) 1997-09-25
DK0797379T3 (da) 2003-01-06
AU713077B2 (en) 1999-11-25
ES2183993T3 (es) 2003-04-01
NO970383D0 (no) 1997-01-29
JPH104250A (ja) 1998-01-06
HUP9700597A3 (en) 2000-04-28
TR199700165A2 (xx) 1997-10-21
US5999412A (en) 1999-12-07
PL318893A1 (en) 1997-09-29
NO970383L (no) 1997-09-19
PT797379E (pt) 2003-02-28
PL182659B1 (pl) 2002-02-28
SG52925A1 (en) 1998-09-28
YU48977B (sh) 2003-02-28
CZ71697A3 (en) 1997-10-15
EP0797379B1 (de) 2002-09-18
CN1168078A (zh) 1997-12-17
NZ314160A (en) 1998-09-24
BG101319A (en) 1997-09-30
UA42784C2 (uk) 2001-11-15
HU9700597D0 (en) 1997-05-28
YU9197A (sh) 2000-10-30
EP0797379A2 (de) 1997-09-24
HUP9700597A1 (en) 1997-12-29
ID16239A (id) 1997-09-11
BR9701324A (pt) 1998-09-08
DE59708222D1 (de) 2002-10-24
IL120102A (en) 1997-04-15
ATE224634T1 (de) 2002-10-15

Similar Documents

Publication Publication Date Title
CA2194427A1 (en) Telephone connector
AU2618395A (en) Processible electrically conducting polyaniline compositions and processes for the preparation thereof
EP0918376A3 (en) Modular connectors
GB9704724D0 (en) An electrode assembly
EP0879470A4 (en) OVERVOLTAGE PROTECTION DEVICE AND MANUFACTURING METHOD
EP0497478A3 (en) Low impedance, high voltage protection circuit
CA2295231A1 (en) Connector
ZA973974B (en) A circuit for the protected power supply of an electrical load.
EP0656627A3 (en) An adjustable threshold voltage circuit.
AU5505290A (en) Copper doped low melt solder for component assembly and rework
EP0614250A3 (en) On-board electrical connector for a printed circuit board.
CA2325268A1 (en) Imageable seam intermediate transfer belt
DE60025590D1 (de) Anordnung mit einem elektroakustischen wandler dessen anschlusskontakte sich in der richtung der wandlerachse erstrecken und mit einer gedruckten leiterplatte mit passenden steckkontakten
EP0639871A3 (en) Surface mountable electrical connector and contact clamp.
CA2307922A1 (en) Surface-mount electrical connection device
MX9701909A (es) Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construccion electronicos en las superficies de la placa conductora.
AU6480398A (en) Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices
EP1070369A4 (en) LASER WITH ELECTRODE ARRANGEMENT INCLUDING ARC suppressant
AU7116596A (en) Solid-state high voltage crowbar circuit
MY140266A (en) Protected electrical interconnect assemblies
GB9825185D0 (en) Boardlock for an electrical connector
GB2220805B (en) Mounting arrangement for an electrical connector.
TW348333B (en) Ground device, particularly for clean room region
FR2693845B1 (fr) Connecteur electrique blinde perfectionne.
GB9403463D0 (en) An electrical earth leakage circuit