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MX9200257A - Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion. - Google Patents

Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion.

Info

Publication number
MX9200257A
MX9200257A MX9200257A MX9200257A MX9200257A MX 9200257 A MX9200257 A MX 9200257A MX 9200257 A MX9200257 A MX 9200257A MX 9200257 A MX9200257 A MX 9200257A MX 9200257 A MX9200257 A MX 9200257A
Authority
MX
Mexico
Prior art keywords
polysilicio
thin film
prtransistor
occess
manufacture
Prior art date
Application number
MX9200257A
Other languages
English (en)
Inventor
Nang T Tran Nang T Tran
Michael P Keyes Michael Keyes
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MX9200257A publication Critical patent/MX9200257A/es

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6731Top-gate only TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/3003Hydrogenation or deuterisation, e.g. using atomic hydrogen from a plasma
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0314Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Formation Of Insulating Films (AREA)
MX9200257A 1991-01-30 1992-01-21 Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion. MX9200257A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64852991A 1991-01-30 1991-01-30

Publications (1)

Publication Number Publication Date
MX9200257A true MX9200257A (es) 1992-10-01

Family

ID=24601152

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9200257A MX9200257A (es) 1991-01-30 1992-01-21 Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion.

Country Status (8)

Country Link
US (1) US5534445A (es)
EP (1) EP0569470B1 (es)
JP (1) JPH06505362A (es)
KR (1) KR930703707A (es)
CA (1) CA2100065A1 (es)
DE (1) DE69228868D1 (es)
MX (1) MX9200257A (es)
WO (1) WO1992014268A1 (es)

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US6933182B1 (en) 1995-04-20 2005-08-23 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device and manufacturing system thereof
US6444506B1 (en) * 1995-10-25 2002-09-03 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing silicon thin film devices using laser annealing in a hydrogen mixture gas followed by nitride formation
US5808318A (en) * 1996-03-03 1998-09-15 Ag Technology Co., Ltd. Polycrystalline semiconductor thin film for semiconductor TFT on a substrate having a mobility in a longitudinal direction greater than in a width direction
US5744202A (en) * 1996-09-30 1998-04-28 Xerox Corporation Enhancement of hydrogenation of materials encapsulated by an oxide
US5707895A (en) * 1996-10-21 1998-01-13 Taiwan Semiconductor Manufacturing Company, Ltd. Thin film transistor performance enhancement by water plasma treatment
TW386238B (en) 1997-01-20 2000-04-01 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
JP4401448B2 (ja) * 1997-02-24 2010-01-20 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH10275913A (ja) * 1997-03-28 1998-10-13 Sanyo Electric Co Ltd 半導体装置、半導体装置の製造方法及び薄膜トランジスタの製造方法
US6057182A (en) * 1997-09-05 2000-05-02 Sarnoff Corporation Hydrogenation of polysilicon thin film transistors
JPH11111991A (ja) 1997-09-30 1999-04-23 Sanyo Electric Co Ltd 薄膜トランジスタ及び薄膜トランジスタの製造方法
JP3599972B2 (ja) * 1997-09-30 2004-12-08 三洋電機株式会社 薄膜トランジスタの製造方法
JPH11111994A (ja) * 1997-10-03 1999-04-23 Sanyo Electric Co Ltd 薄膜トランジスタ及び薄膜トランジスタの製造方法
JPH11111998A (ja) 1997-10-06 1999-04-23 Sanyo Electric Co Ltd 薄膜トランジスタの製造方法
US7053002B2 (en) * 1998-12-04 2006-05-30 Applied Materials, Inc Plasma preclean with argon, helium, and hydrogen gases
KR100390822B1 (ko) * 1999-12-28 2003-07-10 주식회사 하이닉스반도체 이미지센서에서의 암전류 감소 방법
JP2001313384A (ja) * 2000-04-28 2001-11-09 Shimadzu Corp 放射線検出器
GB0017471D0 (en) * 2000-07-18 2000-08-30 Koninkl Philips Electronics Nv Thin film transistors and their manufacture
JP2002280550A (ja) * 2001-03-22 2002-09-27 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体装置
TW200304227A (en) * 2002-03-11 2003-09-16 Sanyo Electric Co Top gate type thin film transistor
JP3989761B2 (ja) 2002-04-09 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
US7038239B2 (en) 2002-04-09 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
US7256421B2 (en) 2002-05-17 2007-08-14 Semiconductor Energy Laboratory, Co., Ltd. Display device having a structure for preventing the deterioration of a light emitting device
NL1020634C2 (nl) * 2002-05-21 2003-11-24 Otb Group Bv Werkwijze voor het passiveren van een halfgeleider substraat.
GB0222450D0 (en) * 2002-09-27 2002-11-06 Koninkl Philips Electronics Nv Method of manufacturing an electronic device comprising a thin film transistor
US6841431B2 (en) * 2003-01-29 2005-01-11 Chunghwa Picture Tubes, Ltd. Method for reducing the contact resistance
TWI221320B (en) * 2003-05-08 2004-09-21 Toppoly Optoelectronics Corp Process for passivating polysilicon and process for fabricating polysilicon thin film transistor
US7507618B2 (en) * 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
JP3986544B2 (ja) * 2006-12-11 2007-10-03 株式会社半導体エネルギー研究所 半導体の作製方法
US8861909B2 (en) 2011-02-17 2014-10-14 Cornell University Polysilicon photodetector, methods and applications
DE112015000352B4 (de) 2014-03-11 2024-06-06 Fuji Electric Co., Ltd. Verfahren zum Herstellen einer Siliciumcarbid-Halbleitervorrichtung und Siliciumcarbid-Halbleitervorrichtung
CN103985637B (zh) * 2014-04-30 2017-02-01 京东方科技集团股份有限公司 低温多晶硅薄膜晶体管及其制作方法和显示装置
US9793252B2 (en) 2015-03-30 2017-10-17 Emagin Corporation Method of integrating inorganic light emitting diode with oxide thin film transistor for display applications
US10490689B1 (en) * 2018-01-31 2019-11-26 Hrl Laboratories, Llc Grain boundary passivation of polycrystalline materials

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US4226898A (en) * 1978-03-16 1980-10-07 Energy Conversion Devices, Inc. Amorphous semiconductors equivalent to crystalline semiconductors produced by a glow discharge process
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JPS6016462A (ja) * 1983-07-08 1985-01-28 Seiko Epson Corp 半導体装置の製造方法
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US4769338A (en) * 1984-05-14 1988-09-06 Energy Conversion Devices, Inc. Thin film field effect transistor and method of making same
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US4751196A (en) * 1985-04-01 1988-06-14 Motorola Inc. High voltage thin film transistor on PLZT and method of manufacture thereof
JPS6251264A (ja) * 1985-08-30 1987-03-05 Hitachi Ltd 薄膜トランジスタの製造方法
US4851363A (en) * 1986-07-11 1989-07-25 General Motors Corporation Fabrication of polysilicon fets on alkaline earth alumino-silicate glasses
JPH0752772B2 (ja) * 1986-11-22 1995-06-05 ヤマハ株式会社 半導体装置の製法
JPH0687503B2 (ja) * 1987-03-11 1994-11-02 株式会社日立製作所 薄膜半導体装置
JP2764395B2 (ja) * 1987-04-20 1998-06-11 セイコーエプソン株式会社 薄膜トランジスタの製造方法
JPH0640550B2 (ja) * 1987-06-09 1994-05-25 沖電気工業株式会社 薄膜トランジスタの製造方法
US4857976A (en) * 1987-06-30 1989-08-15 California Institute Of Technology Hydrogen-stabilized semiconductor devices
JPS6461062A (en) * 1987-09-01 1989-03-08 Ricoh Kk Manufacture of thin film transistor
JP2589327B2 (ja) * 1987-11-14 1997-03-12 株式会社リコー 薄膜トランジスタの製造方法
GB2215126B (en) * 1988-02-19 1990-11-14 Gen Electric Co Plc Process for manufacturing a thin film transistor
JPH01275745A (ja) * 1988-04-27 1989-11-06 Tosoh Corp 窒化シリコン系薄膜及びその製造方法
JP3055782B2 (ja) * 1988-09-19 2000-06-26 セイコーエプソン株式会社 薄膜トランジスタの製造方
DE69030822T2 (de) * 1989-02-14 1997-11-27 Seiko Epson Corp Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US5273910A (en) * 1990-08-08 1993-12-28 Minnesota Mining And Manufacturing Company Method of making a solid state electromagnetic radiation detector

Also Published As

Publication number Publication date
WO1992014268A1 (en) 1992-08-20
EP0569470A1 (en) 1993-11-18
CA2100065A1 (en) 1992-07-31
US5534445A (en) 1996-07-09
EP0569470B1 (en) 1999-04-07
DE69228868D1 (de) 1999-05-12
JPH06505362A (ja) 1994-06-16
KR930703707A (ko) 1993-11-30

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Legal Events

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MM Annulment or lapse due to non-payment of fees