MX9200257A - Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion. - Google Patents
Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion.Info
- Publication number
- MX9200257A MX9200257A MX9200257A MX9200257A MX9200257A MX 9200257 A MX9200257 A MX 9200257A MX 9200257 A MX9200257 A MX 9200257A MX 9200257 A MX9200257 A MX 9200257A MX 9200257 A MX9200257 A MX 9200257A
- Authority
- MX
- Mexico
- Prior art keywords
- polysilicio
- thin film
- prtransistor
- occess
- manufacture
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/3003—Hydrogenation or deuterisation, e.g. using atomic hydrogen from a plasma
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64852991A | 1991-01-30 | 1991-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9200257A true MX9200257A (es) | 1992-10-01 |
Family
ID=24601152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9200257A MX9200257A (es) | 1991-01-30 | 1992-01-21 | Transistor de pelicula delgada de polisilicio y prtransistor de pelicula delgada de polisilicio y proceso para su fabricacion. oceso para su fabricacion. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5534445A (es) |
EP (1) | EP0569470B1 (es) |
JP (1) | JPH06505362A (es) |
KR (1) | KR930703707A (es) |
CA (1) | CA2100065A1 (es) |
DE (1) | DE69228868D1 (es) |
MX (1) | MX9200257A (es) |
WO (1) | WO1992014268A1 (es) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5719065A (en) * | 1993-10-01 | 1998-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device with removable spacers |
JP2738315B2 (ja) * | 1994-11-22 | 1998-04-08 | 日本電気株式会社 | 薄膜トランジスタおよびその製造方法 |
US6933182B1 (en) | 1995-04-20 | 2005-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device and manufacturing system thereof |
US6444506B1 (en) * | 1995-10-25 | 2002-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing silicon thin film devices using laser annealing in a hydrogen mixture gas followed by nitride formation |
US5808318A (en) * | 1996-03-03 | 1998-09-15 | Ag Technology Co., Ltd. | Polycrystalline semiconductor thin film for semiconductor TFT on a substrate having a mobility in a longitudinal direction greater than in a width direction |
US5744202A (en) * | 1996-09-30 | 1998-04-28 | Xerox Corporation | Enhancement of hydrogenation of materials encapsulated by an oxide |
US5707895A (en) * | 1996-10-21 | 1998-01-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thin film transistor performance enhancement by water plasma treatment |
TW386238B (en) | 1997-01-20 | 2000-04-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
JP4401448B2 (ja) * | 1997-02-24 | 2010-01-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JPH10275913A (ja) * | 1997-03-28 | 1998-10-13 | Sanyo Electric Co Ltd | 半導体装置、半導体装置の製造方法及び薄膜トランジスタの製造方法 |
US6057182A (en) * | 1997-09-05 | 2000-05-02 | Sarnoff Corporation | Hydrogenation of polysilicon thin film transistors |
JPH11111991A (ja) | 1997-09-30 | 1999-04-23 | Sanyo Electric Co Ltd | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
JP3599972B2 (ja) * | 1997-09-30 | 2004-12-08 | 三洋電機株式会社 | 薄膜トランジスタの製造方法 |
JPH11111994A (ja) * | 1997-10-03 | 1999-04-23 | Sanyo Electric Co Ltd | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
JPH11111998A (ja) | 1997-10-06 | 1999-04-23 | Sanyo Electric Co Ltd | 薄膜トランジスタの製造方法 |
US7053002B2 (en) * | 1998-12-04 | 2006-05-30 | Applied Materials, Inc | Plasma preclean with argon, helium, and hydrogen gases |
KR100390822B1 (ko) * | 1999-12-28 | 2003-07-10 | 주식회사 하이닉스반도체 | 이미지센서에서의 암전류 감소 방법 |
JP2001313384A (ja) * | 2000-04-28 | 2001-11-09 | Shimadzu Corp | 放射線検出器 |
GB0017471D0 (en) * | 2000-07-18 | 2000-08-30 | Koninkl Philips Electronics Nv | Thin film transistors and their manufacture |
JP2002280550A (ja) * | 2001-03-22 | 2002-09-27 | Mitsubishi Electric Corp | 半導体装置の製造方法及び半導体装置 |
TW200304227A (en) * | 2002-03-11 | 2003-09-16 | Sanyo Electric Co | Top gate type thin film transistor |
JP3989761B2 (ja) | 2002-04-09 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
US7038239B2 (en) | 2002-04-09 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
US7256421B2 (en) | 2002-05-17 | 2007-08-14 | Semiconductor Energy Laboratory, Co., Ltd. | Display device having a structure for preventing the deterioration of a light emitting device |
NL1020634C2 (nl) * | 2002-05-21 | 2003-11-24 | Otb Group Bv | Werkwijze voor het passiveren van een halfgeleider substraat. |
GB0222450D0 (en) * | 2002-09-27 | 2002-11-06 | Koninkl Philips Electronics Nv | Method of manufacturing an electronic device comprising a thin film transistor |
US6841431B2 (en) * | 2003-01-29 | 2005-01-11 | Chunghwa Picture Tubes, Ltd. | Method for reducing the contact resistance |
TWI221320B (en) * | 2003-05-08 | 2004-09-21 | Toppoly Optoelectronics Corp | Process for passivating polysilicon and process for fabricating polysilicon thin film transistor |
US7507618B2 (en) * | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
JP3986544B2 (ja) * | 2006-12-11 | 2007-10-03 | 株式会社半導体エネルギー研究所 | 半導体の作製方法 |
US8861909B2 (en) | 2011-02-17 | 2014-10-14 | Cornell University | Polysilicon photodetector, methods and applications |
DE112015000352B4 (de) | 2014-03-11 | 2024-06-06 | Fuji Electric Co., Ltd. | Verfahren zum Herstellen einer Siliciumcarbid-Halbleitervorrichtung und Siliciumcarbid-Halbleitervorrichtung |
CN103985637B (zh) * | 2014-04-30 | 2017-02-01 | 京东方科技集团股份有限公司 | 低温多晶硅薄膜晶体管及其制作方法和显示装置 |
US9793252B2 (en) | 2015-03-30 | 2017-10-17 | Emagin Corporation | Method of integrating inorganic light emitting diode with oxide thin film transistor for display applications |
US10490689B1 (en) * | 2018-01-31 | 2019-11-26 | Hrl Laboratories, Llc | Grain boundary passivation of polycrystalline materials |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4226898A (en) * | 1978-03-16 | 1980-10-07 | Energy Conversion Devices, Inc. | Amorphous semiconductors equivalent to crystalline semiconductors produced by a glow discharge process |
JPH0658966B2 (ja) * | 1982-05-17 | 1994-08-03 | キヤノン株式会社 | 半導体素子 |
JPS6016462A (ja) * | 1983-07-08 | 1985-01-28 | Seiko Epson Corp | 半導体装置の製造方法 |
CA1218470A (en) * | 1983-12-24 | 1987-02-24 | Hisayoshi Yamoto | Semiconductor device with polycrystalline silicon active region and ic including semiconductor device |
US4769338A (en) * | 1984-05-14 | 1988-09-06 | Energy Conversion Devices, Inc. | Thin film field effect transistor and method of making same |
JPH0656856B2 (ja) * | 1984-08-10 | 1994-07-27 | ソニー株式会社 | 半導体装置の製造方法 |
US4751196A (en) * | 1985-04-01 | 1988-06-14 | Motorola Inc. | High voltage thin film transistor on PLZT and method of manufacture thereof |
JPS6251264A (ja) * | 1985-08-30 | 1987-03-05 | Hitachi Ltd | 薄膜トランジスタの製造方法 |
US4851363A (en) * | 1986-07-11 | 1989-07-25 | General Motors Corporation | Fabrication of polysilicon fets on alkaline earth alumino-silicate glasses |
JPH0752772B2 (ja) * | 1986-11-22 | 1995-06-05 | ヤマハ株式会社 | 半導体装置の製法 |
JPH0687503B2 (ja) * | 1987-03-11 | 1994-11-02 | 株式会社日立製作所 | 薄膜半導体装置 |
JP2764395B2 (ja) * | 1987-04-20 | 1998-06-11 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
JPH0640550B2 (ja) * | 1987-06-09 | 1994-05-25 | 沖電気工業株式会社 | 薄膜トランジスタの製造方法 |
US4857976A (en) * | 1987-06-30 | 1989-08-15 | California Institute Of Technology | Hydrogen-stabilized semiconductor devices |
JPS6461062A (en) * | 1987-09-01 | 1989-03-08 | Ricoh Kk | Manufacture of thin film transistor |
JP2589327B2 (ja) * | 1987-11-14 | 1997-03-12 | 株式会社リコー | 薄膜トランジスタの製造方法 |
GB2215126B (en) * | 1988-02-19 | 1990-11-14 | Gen Electric Co Plc | Process for manufacturing a thin film transistor |
JPH01275745A (ja) * | 1988-04-27 | 1989-11-06 | Tosoh Corp | 窒化シリコン系薄膜及びその製造方法 |
JP3055782B2 (ja) * | 1988-09-19 | 2000-06-26 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方 |
DE69030822T2 (de) * | 1989-02-14 | 1997-11-27 | Seiko Epson Corp | Halbleitervorrichtung und Verfahren zu ihrer Herstellung |
US5273910A (en) * | 1990-08-08 | 1993-12-28 | Minnesota Mining And Manufacturing Company | Method of making a solid state electromagnetic radiation detector |
-
1992
- 1992-01-08 EP EP92904576A patent/EP0569470B1/en not_active Expired - Lifetime
- 1992-01-08 JP JP4504511A patent/JPH06505362A/ja active Pending
- 1992-01-08 WO PCT/US1992/000210 patent/WO1992014268A1/en active IP Right Grant
- 1992-01-08 DE DE69228868T patent/DE69228868D1/de not_active Expired - Lifetime
- 1992-01-08 KR KR1019930702249A patent/KR930703707A/ko not_active IP Right Cessation
- 1992-01-08 CA CA002100065A patent/CA2100065A1/en not_active Abandoned
- 1992-01-21 MX MX9200257A patent/MX9200257A/es not_active IP Right Cessation
-
1995
- 1995-05-23 US US08/447,926 patent/US5534445A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1992014268A1 (en) | 1992-08-20 |
EP0569470A1 (en) | 1993-11-18 |
CA2100065A1 (en) | 1992-07-31 |
US5534445A (en) | 1996-07-09 |
EP0569470B1 (en) | 1999-04-07 |
DE69228868D1 (de) | 1999-05-12 |
JPH06505362A (ja) | 1994-06-16 |
KR930703707A (ko) | 1993-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration | ||
MM | Annulment or lapse due to non-payment of fees |