KR970705590A - 에틸렌성 불포화 무수물과 비닐 화합물의 공중합체로 구성된 알릴-함유 에폭시 수지 조성물(allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound) - Google Patents
에틸렌성 불포화 무수물과 비닐 화합물의 공중합체로 구성된 알릴-함유 에폭시 수지 조성물(allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound) Download PDFInfo
- Publication number
- KR970705590A KR970705590A KR1019970701482A KR19970701482A KR970705590A KR 970705590 A KR970705590 A KR 970705590A KR 1019970701482 A KR1019970701482 A KR 1019970701482A KR 19970701482 A KR19970701482 A KR 19970701482A KR 970705590 A KR970705590 A KR 970705590A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- copolymer
- anhydride
- epoxy resin
- allyl
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract 11
- 229920000647 polyepoxide Polymers 0.000 title claims abstract 11
- 229920001577 copolymer Polymers 0.000 title claims abstract 8
- 150000008064 anhydrides Chemical class 0.000 title claims abstract 7
- -1 vinyl compound Chemical class 0.000 title claims abstract 6
- 229920002554 vinyl polymer Polymers 0.000 title claims abstract 5
- 239000000203 mixture Substances 0.000 title claims 4
- 239000011342 resin composition Substances 0.000 claims abstract 12
- 150000001875 compounds Chemical class 0.000 claims abstract 7
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims abstract 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract 6
- 239000003431 cross linking reagent Substances 0.000 claims abstract 6
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims abstract 3
- 229920005989 resin Polymers 0.000 claims abstract 3
- 239000011347 resin Substances 0.000 claims abstract 3
- 239000004593 Epoxy Substances 0.000 claims abstract 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 abstract 1
- 208000032225 Proximal spinal muscular atrophy type 1 Diseases 0.000 abstract 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 208000032471 type 1 spinal muscular atrophy Diseases 0.000 abstract 1
- 229920006163 vinyl copolymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
Claims (12)
- 에폭시 수지, 카르복실 무수물 형태의 에폭시 수지용 가교제, 및 적어도 하나의 알릴 네트워크 형성 화합물로 구성된 수지 조성물에 있어서, 상기 카르복실 무수물은 에틸렌성 불포화 무수물과 비닐 화합물의 공중합체인 것을 특징으로 하는 수지 조성물.
- 제1항에 있어서, 알릴 네트워크 형성 화합물로서 적어도 2중량%의 트리알릴 시아누레이트(TAC)가 존재하는 것을 특징으로 하는 수지 조성물.
- 제1항에 있어서, 적어도 10중량%의 알릴 네트워크 형성 화합물이 존재하는 것을 특징으로 하는 수지 조성물.
- 에폭시 수지, 에틸렌성 불포화 무수물과 비닐 화합물의 공중합체 형태인 에폭시 수지용 가교제로 구성된 수지 조성물에 있어서, 적당량의 라디칼 개시제 뿐 아니라 적어도 10중량%의 알릴 화합물이 상기 수지 조성물 내로 경합되는 것을 특징으로 하는 수지 조성물.
- 제4항에 있어서, 알릴 네트워크 형성 화합물로서 적어도 2중량%의 트리알릴 시아누레이트(TAC)가 존재하는 것을 특징으로 하는 수지 조성물.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 에폭시 수지용 가교제는 대략 1400 내지 대략 50000의 분자량 및 15 내지 60중량%의 무수물 함량을 갖는, 스티렌과 말레 무수물의 공중합체인 것을 특징으로 하는 수지 조성물.
- 제6항에 있어서, 상기 공중합체가 SMA1000, SMA2000, SMA3000, 및 그의 혼합물로부터 선택되는 것을 특징으로 하는 수지 조성물.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 공중합체는 에폭시에 대한 무수물의 당량비가 40 내지 110% 범위내로 사용되는 것을 특징으로 하는 수지 조성물.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 공중합성 가교제에 추가하여, 다가 페놀 가교제가 사용되는 것을 특징으로 하는 수지 조성물.
- 제1항 내지 제9항 중 어느 한 항에 있어서, 불꽃 지연성을 제공할 다량의 브롬이 에폭시 수지내로 결합되는 것을 특징으로 하는 수지 조성물.
- 합성층과 금속층으로 적어도 구성된 적층물에 있어서, 상기 합성층은 제1항 내지 제10항 중 어느 한 항에 따라, 파이버로 강화되거나 되지 않은 수지로 구성되는 것을 특징으로 하는 적층물.
- 제11항에 따른 적층물로 구성된 인쇄 배선판(PWB).※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9401461 | 1994-09-08 | ||
NL9401461 | 1994-09-08 | ||
PCT/EP1995/003523 WO1996007683A1 (en) | 1994-09-08 | 1995-09-07 | Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970705590A true KR970705590A (ko) | 1997-10-09 |
Family
ID=19864629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970701482A KR970705590A (ko) | 1994-09-08 | 1995-09-07 | 에틸렌성 불포화 무수물과 비닐 화합물의 공중합체로 구성된 알릴-함유 에폭시 수지 조성물(allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound) |
Country Status (11)
Country | Link |
---|---|
US (1) | US5821305A (ko) |
EP (1) | EP0779902B1 (ko) |
JP (1) | JPH10505376A (ko) |
KR (1) | KR970705590A (ko) |
CN (1) | CN1062874C (ko) |
AT (1) | ATE172210T1 (ko) |
CA (1) | CA2199390A1 (ko) |
DE (1) | DE69505410T2 (ko) |
ES (1) | ES2124588T3 (ko) |
TW (1) | TW290574B (ko) |
WO (1) | WO1996007683A1 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2270208C (en) * | 1996-10-29 | 2004-09-14 | Akzo Nobel Nv | Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent |
ATE273348T1 (de) † | 1997-01-21 | 2004-08-15 | Dow Global Technologies Inc | Latente katalysatoren für epoxidharz- härtungssysteme |
US6613839B1 (en) * | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
US6191952B1 (en) * | 1998-04-28 | 2001-02-20 | International Business Machines Corporation | Compliant surface layer for flip-chip electronic packages and method for forming same |
KR100792099B1 (ko) * | 2001-01-30 | 2008-01-04 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물 및 그의 용도 |
TWI278481B (en) | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
US6734259B1 (en) * | 2002-10-24 | 2004-05-11 | International Business Machines Corporation | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom |
US20040101689A1 (en) * | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
JP4662533B2 (ja) * | 2003-08-26 | 2011-03-30 | 日東電工株式会社 | 電池用セパレータのための反応性ポリマー担持多孔質フィルムとそれを用いる電池の製造方法 |
US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
JP4526352B2 (ja) * | 2004-11-08 | 2010-08-18 | 日東電工株式会社 | 電池用セパレータのための反応性ポリマー担持多孔質フィルムとそれを用いた電池の製造方法 |
US8941293B2 (en) | 2006-05-11 | 2015-01-27 | Samsung Electronics Co., Ltd. | Solid state lighting devices comprising quantum dots |
US20080173886A1 (en) * | 2006-05-11 | 2008-07-24 | Evident Technologies, Inc. | Solid state lighting devices comprising quantum dots |
CN102558505A (zh) | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
CN101481490B (zh) * | 2009-01-19 | 2014-01-15 | 东莞联茂电子科技有限公司 | 一种热固性树脂组合物及应用 |
TWI400267B (zh) * | 2009-03-06 | 2013-07-01 | Nanya Plastics Corp | Modified maleic anhydride and epoxy resin |
US20120083564A1 (en) * | 2009-06-22 | 2012-04-05 | Dow Global Technologies Llc | Hardener composition for epoxy resins |
DE102011015071A1 (de) * | 2011-03-24 | 2012-09-27 | Thyssenkrupp Steel Europe Ag | Verbundwerkstoff und Strukturbauteil für ein Kraftfahrzeug |
TWI449722B (zh) * | 2011-04-12 | 2014-08-21 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
CN102492100B (zh) * | 2011-12-05 | 2013-04-17 | 江苏柏鹤涂料有限公司 | 水分散型含氟羟基丙烯酸-环氧酯杂化体树脂及其涂料 |
RU2650683C2 (ru) | 2012-05-07 | 2018-04-17 | Мерсен Лабс Аб | Способ и составы для производства изделий и композиционных материалов с покрытием |
JP5738261B2 (ja) | 2012-05-16 | 2015-06-17 | 株式会社日立産機システム | エポキシ‐ビニル共重合型液状樹脂組成物、その硬化物、製造方法及び硬化物を用いた絶縁材料、電子・電気機器 |
CN108957954A (zh) * | 2018-08-03 | 2018-12-07 | 广东泰亚达光电有限公司 | 一种新型激光直描成像干膜及其制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US2707177A (en) * | 1952-11-29 | 1955-04-26 | Gen Electric | Ethoxyline-triallyl cyanurate resinous compositions |
GB994484A (en) * | 1960-10-10 | 1965-06-10 | Carborundum Co | Coated abrasive products |
BE627887A (fr) * | 1962-02-03 | 1963-02-28 | Bayer Ag | Procédé de durcissement de résines époxy. |
US4056506A (en) * | 1975-06-26 | 1977-11-01 | Gulf Oil Corporation | Homogeneous polyepoxide-polyanhydride compositions |
SU1165703A1 (ru) * | 1983-06-06 | 1985-07-07 | Научно-производственное объединение "Камень и силикаты" | Клей |
CA1276358C (en) * | 1984-01-31 | 1990-11-13 | Dieter H. Klein | Epoxy resin for preparing electric laminates |
JPS612725A (ja) * | 1984-06-15 | 1986-01-08 | Mitsubishi Electric Corp | 熱硬化性樹脂組成物 |
US4604317A (en) * | 1984-10-05 | 1986-08-05 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
JPS645211A (en) * | 1987-06-29 | 1989-01-10 | Matsushita Electric Ind Co Ltd | Mixer device |
US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
ATE97923T1 (de) * | 1989-09-15 | 1993-12-15 | Akzo Nv | Chemisch verankertes interpenetrierendes netzwerk. |
JP2766373B2 (ja) * | 1990-05-08 | 1998-06-18 | 昭和電工株式会社 | 樹脂組成物 |
JPH0444287A (ja) * | 1990-06-07 | 1992-02-14 | Showa Denko Kk | フレキシブルプリント基板 |
CN1036402C (zh) * | 1991-01-11 | 1997-11-12 | 旭化成工业株式会社 | 可固化的聚苯氧树脂组合物及由它制成的薄膜 |
ATE139240T1 (de) * | 1991-11-27 | 1996-06-15 | Akzo Nobel Nv | Phosphor enthaltende harz |
CA2170033A1 (en) * | 1993-08-23 | 1995-03-02 | Jan Andre Jozef Schutyser | Allyl-epoxy ipn |
-
1995
- 1995-09-07 WO PCT/EP1995/003523 patent/WO1996007683A1/en not_active Application Discontinuation
- 1995-09-07 JP JP8509222A patent/JPH10505376A/ja active Pending
- 1995-09-07 ES ES95932007T patent/ES2124588T3/es not_active Expired - Lifetime
- 1995-09-07 EP EP95932007A patent/EP0779902B1/en not_active Expired - Lifetime
- 1995-09-07 DE DE69505410T patent/DE69505410T2/de not_active Expired - Fee Related
- 1995-09-07 CN CN95195558A patent/CN1062874C/zh not_active Expired - Fee Related
- 1995-09-07 CA CA002199390A patent/CA2199390A1/en not_active Abandoned
- 1995-09-07 KR KR1019970701482A patent/KR970705590A/ko not_active Application Discontinuation
- 1995-09-07 US US08/776,753 patent/US5821305A/en not_active Expired - Fee Related
- 1995-09-07 AT AT95932007T patent/ATE172210T1/de not_active IP Right Cessation
- 1995-10-12 TW TW084110736A patent/TW290574B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP0779902B1 (en) | 1998-10-14 |
DE69505410D1 (de) | 1998-11-19 |
US5821305A (en) | 1998-10-13 |
JPH10505376A (ja) | 1998-05-26 |
WO1996007683A1 (en) | 1996-03-14 |
DE69505410T2 (de) | 1999-05-20 |
ATE172210T1 (de) | 1998-10-15 |
CN1160407A (zh) | 1997-09-24 |
TW290574B (ko) | 1996-11-11 |
EP0779902A1 (en) | 1997-06-25 |
CN1062874C (zh) | 2001-03-07 |
CA2199390A1 (en) | 1996-03-14 |
ES2124588T3 (es) | 1999-02-01 |
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Legal Events
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PA0105 | International application |
Patent event date: 19970307 Patent event code: PA01051R01D Comment text: International Patent Application |
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PG1501 | Laying open of application | ||
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