KR970077159A - Semiconductor Low Pressure Chemical Vapor Deposition Device - Google Patents
Semiconductor Low Pressure Chemical Vapor Deposition Device Download PDFInfo
- Publication number
- KR970077159A KR970077159A KR1019960015059A KR19960015059A KR970077159A KR 970077159 A KR970077159 A KR 970077159A KR 1019960015059 A KR1019960015059 A KR 1019960015059A KR 19960015059 A KR19960015059 A KR 19960015059A KR 970077159 A KR970077159 A KR 970077159A
- Authority
- KR
- South Korea
- Prior art keywords
- vacuum chamber
- chemical vapor
- vapor deposition
- pressure chemical
- wafer
- Prior art date
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Abstract
본 발명은 반도체 저압화학기상증착장치에 관한 것으로, 종래에는 증착공정을 진행하기 위하여 웨이퍼가 수납된 보트를 내, 외측튜브의 내부로 이동시 웨이퍼에 산화막이 발생하여 실리콘 막의 질이 저하되는 문제점이 있었다. 본 발명 반도체 저압화학기상증착장치는 내, 외측튜브의 하부에 튜브셔터(TUBE SHUTTER)를 복개가능하도록 설치하여 내, 외측튜브의 내부에 존재하는 잔류산소 또는 습기 등을 제거하고, 내,외측튜브의 하부에는 튜브셔터, 보트, 플랜지를 감싸도록 진공챔버를 설치하여 펌핑수단으로 진공챔버의 내부에 존재하는 잔류산소 또는 습기 등을 제거할 수 있도록 함으로서, 웨이퍼의 산화막 증착을 방지하게되어 산화막 증착으로 인한 웨이퍼의 품질저하를 방지하는 효과가 있다.The present invention relates to a semiconductor low-pressure chemical vapor deposition apparatus, and in the related art, there is a problem that an oxide film is formed on a wafer when a boat containing a wafer is moved to the inside of an outer tube to perform a deposition process, . In the semiconductor low-pressure chemical vapor deposition apparatus according to the present invention, a tube shutter is installed in a lower portion of inner and outer tubes to remove residual oxygen or moisture existing inside the outer tube, A vacuum chamber is provided at a lower portion of the vacuum chamber so as to enclose the tube shutter, the boat, and the flange, so that residual oxygen or moisture existing in the vacuum chamber can be removed by the pumping means, It is possible to prevent deterioration of the quality of the wafer caused by the wafer.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도는 본 발명 반도체 저압화학기상증착장치의 구성을 보인 개략구성도.FIG. 2 is a schematic view showing the structure of a semiconductor low-pressure chemical vapor deposition apparatus according to the present invention. FIG.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960015059A KR970077159A (en) | 1996-05-08 | 1996-05-08 | Semiconductor Low Pressure Chemical Vapor Deposition Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960015059A KR970077159A (en) | 1996-05-08 | 1996-05-08 | Semiconductor Low Pressure Chemical Vapor Deposition Device |
Publications (1)
Publication Number | Publication Date |
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KR970077159A true KR970077159A (en) | 1997-12-12 |
Family
ID=66219285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960015059A KR970077159A (en) | 1996-05-08 | 1996-05-08 | Semiconductor Low Pressure Chemical Vapor Deposition Device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970077159A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100926994B1 (en) * | 2001-05-14 | 2009-11-17 | 셈코 엔지니어링 에스에이 | Silicon Wafer Processing Method And Apparatus |
-
1996
- 1996-05-08 KR KR1019960015059A patent/KR970077159A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100926994B1 (en) * | 2001-05-14 | 2009-11-17 | 셈코 엔지니어링 에스에이 | Silicon Wafer Processing Method And Apparatus |
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Patent event date: 19990429 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19981224 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |