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KR970052554A - Wafer protective film coating equipment - Google Patents

Wafer protective film coating equipment Download PDF

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Publication number
KR970052554A
KR970052554A KR1019950046843A KR19950046843A KR970052554A KR 970052554 A KR970052554 A KR 970052554A KR 1019950046843 A KR1019950046843 A KR 1019950046843A KR 19950046843 A KR19950046843 A KR 19950046843A KR 970052554 A KR970052554 A KR 970052554A
Authority
KR
South Korea
Prior art keywords
filter
purge
pressure
pipe
needle valve
Prior art date
Application number
KR1019950046843A
Other languages
Korean (ko)
Other versions
KR0166855B1 (en
Inventor
최상숙
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019950046843A priority Critical patent/KR0166855B1/en
Publication of KR970052554A publication Critical patent/KR970052554A/en
Application granted granted Critical
Publication of KR0166855B1 publication Critical patent/KR0166855B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

본 발명은 웨이퍼의 표면에 보호막을 도포하는 웨이퍼의 보호막 도포장비에 관한 것으로써, 좀더 구체적으로는 써셉터(Susceptor)에 웨이퍼를 로딩하거나, 언로딩할 때 이들의 접촉에 따라 이물질이 발생되는 것을 미연에 방지함과 동시에 배기라인에 퇴적되는 부산물을 제거할 수 있도록 한 것이다.The present invention relates to a protective film coating equipment of a wafer for applying a protective film on the surface of the wafer, and more specifically, that foreign matters are generated when the wafer is loaded or unloaded in a susceptor. In addition to preventing in advance, it is possible to remove by-products deposited on the exhaust line.

이를 위해, 배기관(6)과 N2관(5)을 퍼지시키기 위해 본체(1)의 외부로부터 인입되어 각N2관에 설치된 필터(12)의 전방으로 연결되는 N2퍼지관(18)과, 상기 본체의 외부에 위치된 N2퍼지관상에 설치되는 압력조정기(20) 및 압력게이지(21) 그리고 필터(22)와, 상기 N2퍼지관의 연결부위에 설치되어 N2가스의 취입을 제어하는 수동밸브(23)와, 상기 각 배기관 및 N2퍼지관에 설치된 필터의 전방으로 설치되는 니이들밸브(24)(26)와, 상기 필터와 니이들밸브사이에 설치되어 니이들밸브의 조작에 따른 각 반응실의 배기압력 및 N2가스의 공급압력을 나타내는 압력센서(25)(27)로 구성하여서 된 것이다.To this end, the N 2 purge pipe 18 which is introduced from the outside of the main body 1 and connected to the front of the filter 12 installed in each N 2 pipe to purge the exhaust pipe 6 and the N 2 pipe 5 and , and the pressure regulator 20 and a pressure gauge 21 and filter 22 are installed on the N 2 purge tubular positioned in the outside of the body, is installed in the connection portion of the N 2 purge tube for the acceptance of the N 2 gas A manual valve 23 for controlling, needle valves 24 and 26 installed in front of the filters installed in the exhaust pipes and the N 2 purge pipes, and between the filter and the needle valves, the hayeoseo will consist of pressure sensors (25, 27) representing the supply pressure of the exhaust pressure and the N 2 gas in each reaction chamber in accordance with the operation.

Description

웨이퍼의 보호막 도포장비Wafer protective film coating equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명이 적용된 웨이퍼의 보호막 도포장비를 나타낸 구성도.2 is a block diagram showing a protective film coating equipment of the wafer to which the present invention is applied.

Claims (4)

배기관과 N2관을 퍼지시키기 위해 본체의 외부로부터 인입되어 각 N2관에 설치된 필터의 전방으로 연결되는 N2퍼지관과, 상기 본체 외부에 위치된 N2퍼지관상에 설치되는 압력조정기 및 압력게이지 그리고 필터와, 상기 N2퍼지관의 연결부위에 설치되어 N2가스의 취입을 제어하는 수동밸브로 구성됨을 특징으로 하는 웨이퍼의 보호막 도포장비.N 2 purge tube, and the pressure regulator and the pressure installed in the N 2 purge tubular positioned outside the body that are incoming from the outside of the body in order to purge the exhaust pipe with N 2 pipe connected to the front of the filter installed in each N 2 tube And a gauge and a filter, and a manual valve installed at a connection portion of the N 2 purge pipe to control the intake of N 2 gas. 제1항에 있어서, 상기 각 배기관에 설치된 필터의 전방으로 니이들밸브를 설치하고 필터와 니이들밸브사이에는 니이들밸브의 조작에 따른 각 반응실의 배기압력을 나타내는 압력센서를 설치함을 특징으로 하는 웨이퍼의 보호막 도포장비.The method of claim 1, wherein a needle valve is installed in front of the filter installed in each exhaust pipe, and a pressure sensor is installed between the filter and the needle valve indicating the exhaust pressure of each reaction chamber according to the operation of the needle valve. Wafer protective film coating equipment. 제1항에 있어서, 상기 각 N2관에 설치된 필터의 전방으로 니이들밸브를 설치하고 상기 필터와 니이들밸브사이에는 니이들밸브의 조작에 따른 각 반응실의 N2가스의 공급압력을 나타내는 압력센서를 설치함을 특징으로 하는 웨이퍼의 보호막 도포장비.The method of claim 1, wherein a needle valve is provided in front of a filter provided in each of the N 2 pipes, and between the filter and the needle valve, the supply pressure of N 2 gas in each reaction chamber according to the operation of the needle valve A protective film coating equipment for wafers, characterized in that the pressure sensor is installed. 제1항에 있어서, 상기 각 배기관 및 N2관에 설치된 필터의 전방으로 니이들밸브를 각각 설치하고 상기 필터와 니이들밸브사이에는 니이들밸브의 조작에 따른 각 반응실의 배기압력 및 N2가스의 공급압력을 나타내는 압력센서를 각각 설치함을 특징으로 하는 웨이퍼의 보호막 도포장비.The method of claim 1, wherein the needle valve is provided in front of the filter installed in each of the exhaust pipe and the N 2 pipe, and the exhaust pressure and N 2 of the reaction chamber according to the operation of the needle valve between the filter and the needle valve A protective film coating equipment for a wafer, characterized in that each pressure sensor for indicating the supply pressure of the gas is provided. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950046843A 1995-12-05 1995-12-05 Wafer protective film coating equipment KR0166855B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950046843A KR0166855B1 (en) 1995-12-05 1995-12-05 Wafer protective film coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950046843A KR0166855B1 (en) 1995-12-05 1995-12-05 Wafer protective film coating equipment

Publications (2)

Publication Number Publication Date
KR970052554A true KR970052554A (en) 1997-07-29
KR0166855B1 KR0166855B1 (en) 1999-02-01

Family

ID=19437884

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950046843A KR0166855B1 (en) 1995-12-05 1995-12-05 Wafer protective film coating equipment

Country Status (1)

Country Link
KR (1) KR0166855B1 (en)

Also Published As

Publication number Publication date
KR0166855B1 (en) 1999-02-01

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