KR0122609Y1 - Device for manufacturing a semiconductor device - Google Patents
Device for manufacturing a semiconductor deviceInfo
- Publication number
- KR0122609Y1 KR0122609Y1 KR2019940027525U KR19940027525U KR0122609Y1 KR 0122609 Y1 KR0122609 Y1 KR 0122609Y1 KR 2019940027525 U KR2019940027525 U KR 2019940027525U KR 19940027525 U KR19940027525 U KR 19940027525U KR 0122609 Y1 KR0122609 Y1 KR 0122609Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lock chamber
- nitrogen
- load lock
- atmospheric pressure
- tank
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 77
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 34
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000004891 communication Methods 0.000 claims abstract description 3
- 238000001514 detection method Methods 0.000 claims abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 반도체 제조용 식각공정의 로드락챔버의 대기압 일치장치에 관한 것이다.The present invention relates to an atmospheric pressure matching device of a load lock chamber of an etching process for semiconductor manufacturing.
본 고안은 질소가스 공급기 및 대기압 센서를 구비하며, 반도체 식각공정에 사용되는 로드락챔버에 설치되는 대기압 일치장치에 있어서, 상기 로드락챔버와 연통되어 있으며, 대기압과 동일한 압력의 질소가 충전된 별도의 질소탱크와, 상기 로드락챔버와 상기 질소탱크 사이에 설치되는 개폐밸브를 구비하여 상기 대기압 센서의 감지신호에 따라 상기 질소탱크내의 질소를 상기 로드락챔버내에 유입시킬 수 있도록 구성한 것을 특징으로 하는 반도체 제조용 로드락챔버의 대기압 일치장치를 요지로 한다.The present invention is provided with a nitrogen gas supply and an atmospheric pressure sensor, in the atmospheric pressure matching device installed in the load lock chamber used in the semiconductor etching process, in communication with the load lock chamber, a separate nitrogen filled with the same pressure as atmospheric pressure A nitrogen tank and an on / off valve installed between the load lock chamber and the nitrogen tank, the nitrogen in the nitrogen tank being introduced into the load lock chamber according to a detection signal of the atmospheric pressure sensor. The atmospheric pressure matching device of the load lock chamber for semiconductor manufacture is taken as a summary.
이에따라 웨이퍼의 이송을 위해 투출문이 열려도 외부공기중의 이물질이 웨이퍼에 유입되지 않아 웨이퍼의 품질향상에 기여하게 된다.Accordingly, even if the exit door is opened for the transfer of the wafer, foreign matter in the outside air does not flow into the wafer, thereby contributing to the improvement of the quality of the wafer.
Description
제 1 도는 종래의 로드락챔버의 개략적인 구성도.1 is a schematic configuration diagram of a conventional load lock chamber.
제 2 도는 본 고안에 따른 로드락챔버의 개략적인 구성도.2 is a schematic configuration diagram of a load lock chamber according to the present invention.
*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
1 : 로드락챔버 2 : 진공펌프1: load lock chamber 2: vacuum pump
3 : 투출문 5 : 챔버 압력감지기3: entrance door 5: chamber pressure sensor
4 : 대기압센서 10 : 질소탱크4: barometric pressure sensor 10: nitrogen tank
11 : 질소공급기 12 : 연장파이프11: nitrogen supply 12: extension pipe
13 : 개폐밸브 14 : 질소공급파이프13: on-off valve 14: nitrogen supply pipe
본 고안은 반도체 제조장비에 관한 것이며, 특히 식각장비중의 로드락챔버의 대기압 일치장치에 관한 것이다.The present invention relates to a semiconductor manufacturing equipment, and more particularly to an atmospheric pressure matching device of the load lock chamber in the etching equipment.
반도체 웨이퍼가공중 폴리(poly) 식각장비에 있어 웨이퍼를 진공상태에서 식각한 후 대기압에 맞추어 이송하기 위해 로드락챔버라는 장비가 사용되고 있다.In the poly etching equipment during semiconductor wafer processing, a device called a load lock chamber is used to transfer the wafer to atmospheric pressure after etching the wafer under vacuum.
제 1 도에 기존의 로드락챔버의 구성이 개략적으로 도시되어 있다.The construction of a conventional load lock chamber is schematically shown in FIG.
웨이퍼는 진공상태의 공정챔버인 로드락챔버(1)의 투입문(7)을 통하여 로드락챔버(1)내로 이송되어진다. 로드락챔버(1)는 웨이퍼가 이송되는 시점에는 진공압을 유지하게 되나, 이송된 웨이퍼를 다음공정으로 이송하기 위하여 투출문(3)이 개방되어질 경우 외부 대기압과 챔버내부의 압력차이로 인하여 불순물이 챔버(1)내부로 유입된다. 이로인해 로드락챔버(1)내부에 위치하는 웨이퍼 표면에 불순물이 흡착되는 문제점이 있다.The wafer is transferred into the load lock chamber 1 through an input door 7 of the load lock chamber 1 which is a vacuum process chamber. The load lock chamber 1 maintains a vacuum pressure at the time the wafer is transferred, but when the exit door 3 is opened to transfer the transferred wafer to the next process, impurities are caused by an external atmospheric pressure and a pressure difference inside the chamber. This chamber 1 is introduced into the chamber. This causes a problem in that impurities are adsorbed onto the wafer surface located inside the load lock chamber 1.
따라서, 로드락챔버(1)내의 웨이퍼를 다음공정으로 이송시키기 직전에 질소가스 공급기(8)을 사용해 질소가스를 챔버(1)내로 공급하여 챔버내부의 압력을 외부압력과 동일한 수준으로 조절한 후 웨이퍼를 이송시키게 된다.Therefore, immediately before the wafer in the load lock chamber 1 is transferred to the next process, the nitrogen gas is supplied into the chamber 1 using the nitrogen gas supply 8 to adjust the pressure inside the chamber to the same level as the external pressure. The wafer is transferred.
이때 챔버(1)내부가 대기압과 일치하는지를 감지하기 위한 대기압센서(4)가 챔버(1)에 설치되어 챔버(1)내의 압력이 대기압과 일치할 때 신호를 보내어 투출문(3)이 열리게 한다. 한편, 챔버내의 압력은 챔버 압력감지기(5)에 의하여 감지된다.At this time, an atmospheric pressure sensor 4 is installed in the chamber 1 to detect whether the inside of the chamber 1 matches the atmospheric pressure, and sends a signal when the pressure in the chamber 1 matches the atmospheric pressure to open the discharge door 3. . On the other hand, the pressure in the chamber is sensed by the chamber pressure sensor (5).
하지만 실제의 사용에 있어서 대기압센서(4)의 감도가정확하지 않아 챔버(1)내부와 외부의 압력에 차이가 있게되어 투출문(3)이 열릴때 이물질이 웨이퍼에 유입되는 일이 빈번하여 웨이퍼의 품질을 떨어트리는 한 요인으로 인식되어 왔다.However, in actual use, the sensitivity of the atmospheric pressure sensor 4 is not accurate, so there is a difference in the pressure between the chamber 1 and the outside, so that foreign matter enters the wafer frequently when the exit door 3 is opened. Has been recognized as a factor in the quality of the product.
따라서, 본 고안은 대기중의 압력과 로드락챔버 내의 압력을 동일하게 유지시킨 후 투출문을 개방 함으로서, 상기한 단점을 해결할 수 있는 로드락챔버의 대기압 일치장치를 제공하는 데 그 목적이 있다.Accordingly, an object of the present invention is to provide an atmospheric pressure coincidence device of a load lock chamber which can solve the above disadvantages by keeping the pressure in the atmosphere and the pressure in the load lock chamber the same and then opening the discharge door.
상술한 목적을 달성하기 위한 본 발명은 로드락챔버와 연통되어 있으며, 대기압과 동일한 압력의 질소가 충전된 별도의 질소탱크와, 상기 로드락챔버와 상기 질소탱크 사이에 설치되는 개폐밸브를 구비하여 상기 대기압 센서의 감지신호에 따라 상기 질소탱크내의 질소를 상기 로드락챔버 내로 유입 되도록 구성된 것을 특징으로 한다.The present invention for achieving the above object is in communication with the load lock chamber, and provided with a separate nitrogen tank filled with nitrogen of the same pressure as the atmospheric pressure, and an on-off valve installed between the load lock chamber and the nitrogen tank According to the detection signal of the atmospheric pressure sensor is characterized in that it is configured to introduce nitrogen in the nitrogen tank into the load lock chamber.
이하 첨부도면을 참조하여 본 고안을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
제 2 도에 본 고안에 따른 대기압 일치장치가 부설된 로드락챔버의 구성의 개략적으로 도시되어 있다.2 schematically shows the configuration of a load lock chamber equipped with an atmospheric pressure matching device according to the present invention.
본 고안은 기존의 로드락챔버(1)에 별도의 질소탱크(10)를 부설하여 구성된다. 로드락챔버(1)로부터 질소탱크(10)와의 사이에 개폐밸브(13)가 부착되어 대기압센서(4)가 대기압일치를 감지하면 투출문(3)이 열리기전에 개폐밸브(13)가 먼저 개방되고 질소탱크(10)로 부터 대기압과 일치하는 질소가스가 압력차를 보상하도록 챔버(1)내로 유입되어 대기압과의 차이를 없애게 된다. 질소탱크(10)내의 압력이 작업장내의 압력(대기압)과 일치하도록 질소공급 파이프(14)는 질소탱크(10)에서 연장된 개방된 연장파이프(12)내에 틈을 가진채 삽입되어 있다. 이에따라 탱크(10)내의 압력은 언제나 작업장 내의 대기압과 일치하도록 유지된다. 한편 질소공급기(11)는 질소탱크(10)에 접속되며, 질소탱크(10)내로 주위의 공기와 오염물질이 유입되는 것을 막고, 로드락챔버(1)내로의 유동을 주며, 또한 질소가스를 보충하기 위해 소량의 질소가스를 느린속도로 탱크(10)내로 공급하게 된다.The present invention is constructed by laying a separate nitrogen tank 10 in the existing load lock chamber (1). When the on-off valve 13 is attached between the load lock chamber 1 and the nitrogen tank 10 so that the atmospheric pressure sensor 4 senses the atmospheric pressure match, the on-off valve 13 opens first before the exit door 3 opens. In addition, nitrogen gas corresponding to the atmospheric pressure from the nitrogen tank 10 is introduced into the chamber 1 to compensate the pressure difference, thereby eliminating the difference from the atmospheric pressure. The nitrogen supply pipe 14 is inserted with a gap in the open extension pipe 12 extending from the nitrogen tank 10 so that the pressure in the nitrogen tank 10 matches the pressure (atmospheric pressure) in the workplace. Accordingly, the pressure in the tank 10 is always maintained to match the atmospheric pressure in the workplace. On the other hand, the nitrogen supply 11 is connected to the nitrogen tank 10, prevents the surrounding air and contaminants from flowing into the nitrogen tank 10, provides flow into the load lock chamber 1, and also provides nitrogen gas. To replenish a small amount of nitrogen gas into the tank 10 at a slow rate.
따라서 대기압센서(4)가 대기압 일치신호를 보내면 개폐밸브(13)가 열리어 챔버(1)내로 질소가스를 유입시켜 작업장내의 대기압과의 차이를 보상하게 된다. 이 후 투출문(3)이 열리게 되어 웨이퍼로 이물질 유입이 현저히 감소함으로서 웨이퍼의 품질향상에 기여하게 된다.Therefore, when the atmospheric pressure sensor 4 sends an atmospheric pressure coincidence signal, the opening / closing valve 13 introduces nitrogen gas into the rear chamber 1 to compensate for the difference from the atmospheric pressure in the workplace. After that, the discharge door 3 is opened, which significantly reduces the inflow of foreign substances into the wafer, thereby contributing to the improvement of the quality of the wafer.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940027525U KR0122609Y1 (en) | 1994-10-21 | 1994-10-21 | Device for manufacturing a semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940027525U KR0122609Y1 (en) | 1994-10-21 | 1994-10-21 | Device for manufacturing a semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960015585U KR960015585U (en) | 1996-05-17 |
| KR0122609Y1 true KR0122609Y1 (en) | 1998-08-17 |
Family
ID=19396030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940027525U KR0122609Y1 (en) | 1994-10-21 | 1994-10-21 | Device for manufacturing a semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0122609Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100725090B1 (en) * | 2000-12-01 | 2007-06-04 | 삼성전자주식회사 | Apparatus to remove gas fume and thereof method |
-
1994
- 1994-10-21 KR KR2019940027525U patent/KR0122609Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960015585U (en) | 1996-05-17 |
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