KR970046734U - 웨이퍼 연마장치 - Google Patents
웨이퍼 연마장치Info
- Publication number
- KR970046734U KR970046734U KR2019950052643U KR19950052643U KR970046734U KR 970046734 U KR970046734 U KR 970046734U KR 2019950052643 U KR2019950052643 U KR 2019950052643U KR 19950052643 U KR19950052643 U KR 19950052643U KR 970046734 U KR970046734 U KR 970046734U
- Authority
- KR
- South Korea
- Prior art keywords
- polishing machine
- wafer polishing
- wafer
- machine
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950052643U KR200173174Y1 (ko) | 1995-12-29 | 1995-12-29 | 웨이퍼 연마장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950052643U KR200173174Y1 (ko) | 1995-12-29 | 1995-12-29 | 웨이퍼 연마장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970046734U true KR970046734U (ko) | 1997-07-31 |
| KR200173174Y1 KR200173174Y1 (ko) | 2000-03-02 |
Family
ID=19441826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950052643U KR200173174Y1 (ko) | 1995-12-29 | 1995-12-29 | 웨이퍼 연마장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200173174Y1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100414741B1 (ko) * | 1996-06-29 | 2004-03-30 | 주식회사 하이닉스반도체 | 반도체소자의제조방법 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100841094B1 (ko) | 2005-12-20 | 2008-06-25 | 주식회사 실트론 | 실리콘 웨이퍼 연마장치, 이에 이용되는 리테이닝어셈블리, 및 이를 이용한 실리콘 웨이퍼 평평도 보정방법 |
-
1995
- 1995-12-29 KR KR2019950052643U patent/KR200173174Y1/ko not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100414741B1 (ko) * | 1996-06-29 | 2004-03-30 | 주식회사 하이닉스반도체 | 반도체소자의제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200173174Y1 (ko) | 2000-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19951229 |
|
| UG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| UA0201 | Request for examination |
Patent event date: 19970827 Patent event code: UA02012R01D Comment text: Request for Examination of Application Patent event date: 19951229 Patent event code: UA02011R01I Comment text: Application for Utility Model Registration |
|
| E701 | Decision to grant or registration of patent right | ||
| UE0701 | Decision of registration |
Patent event date: 19990927 Comment text: Decision to Grant Registration Patent event code: UE07011S01D |
|
| REGI | Registration of establishment | ||
| UR0701 | Registration of establishment |
Patent event date: 19991217 Patent event code: UR07011E01D Comment text: Registration of Establishment |
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| UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 3 Payment date: 19991218 |
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| UG1601 | Publication of registration | ||
| UR1001 | Payment of annual fee |
Payment date: 20021120 Start annual number: 4 End annual number: 4 |
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| UR1001 | Payment of annual fee |
Payment date: 20031119 Start annual number: 5 End annual number: 5 |
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| UR1001 | Payment of annual fee |
Payment date: 20041119 Start annual number: 6 End annual number: 6 |
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| UR1001 | Payment of annual fee |
Payment date: 20051116 Start annual number: 7 End annual number: 7 |
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| UR1001 | Payment of annual fee |
Payment date: 20061122 Start annual number: 8 End annual number: 8 |
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| UR1001 | Payment of annual fee |
Payment date: 20071120 Start annual number: 9 End annual number: 9 |
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| UR1001 | Payment of annual fee |
Payment date: 20081125 Start annual number: 10 End annual number: 10 |
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| FPAY | Annual fee payment |
Payment date: 20091126 Year of fee payment: 11 |
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| UR1001 | Payment of annual fee |
Payment date: 20091126 Start annual number: 11 End annual number: 11 |
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| EXPY | Expiration of term |