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KR970030250A - Waste-liquid treatment device generated during the manufacturing process of semiconductor devices - Google Patents

Waste-liquid treatment device generated during the manufacturing process of semiconductor devices Download PDF

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Publication number
KR970030250A
KR970030250A KR1019950045811A KR19950045811A KR970030250A KR 970030250 A KR970030250 A KR 970030250A KR 1019950045811 A KR1019950045811 A KR 1019950045811A KR 19950045811 A KR19950045811 A KR 19950045811A KR 970030250 A KR970030250 A KR 970030250A
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KR
South Korea
Prior art keywords
waste liquid
discharge pipe
treatment apparatus
liquid treatment
discharge
Prior art date
Application number
KR1019950045811A
Other languages
Korean (ko)
Inventor
최영만
유동준
이유인
정창용
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950045811A priority Critical patent/KR970030250A/en
Publication of KR970030250A publication Critical patent/KR970030250A/en

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Abstract

본 발명은 반도체장치의 제조과정에서 발생되는 폐액처리장치에 관해 개시한다. 본 발명에 의한 폐액처리장치는 폐액이 흘러들어오는 배출관의 시작부분과 폐액처리장치의 바닥이 접속되는 부분의 둘레에 용법부분을 갖는 폐액이 흘러들어오는 배출관의 시작부분과 폐액처리장치의 바닥이 접속되는 부분의 둘레에 용접부분을 갖는 폐액베출관을 구비하는 폐액처리장치에 있어서,The present invention relates to a waste liquid treatment apparatus generated in the manufacturing process of a semiconductor device. The waste liquid treatment apparatus according to the present invention is connected to the bottom of the waste tube and the start of the discharge tube flows waste liquid having a usage portion around the start portion of the discharge pipe through which the waste liquid flows and the bottom of the waste liquid treatment apparatus is connected. In the waste liquid treatment apparatus provided with the waste liquid discharge pipe which has a welded part around a part,

상기 배출관을 제1배출관이라 할때 상기 제1 배출관으로부터 누출된 폐액이 배출관밖으로 흘러가는 것을 방지하는 수단을 구비한다.When said discharge pipe is called a first discharge pipe, it is provided with the means which prevents the waste liquid which leaked from the said 1st discharge pipe from flowing out of a discharge pipe.

따라서, 본 발명에 의한 반도체장치의 제조과정에서 발생되는 폐액처리장치를 이용하여 폐액을 처리할 경우 폐액을 배출시키기 위한 배출관을 폐액의 유입이 시작되는 부분에서 제1 및 제2 배출관으로 구성되는 2중 배출관으로 구성하므로서, 종래 기술에 의한 1차 배출관으로부터 폐액이 누출되더라도 상기 폐액을 상기 배출관 내로 한정할 수 있다. 따라서 반도체 제조장치와 관련된 설비의 부식을 방지하여 반도체 제조장치의 생산성을 높일 수 있을 뿐만 아니라 작업자의 건강과 주위의 자연환경을 폐액으로부터 안전하게 보호할 수 있다.Therefore, when the waste liquid is processed using the waste liquid treatment apparatus generated in the manufacturing process of the semiconductor device according to the present invention, a discharge tube for discharging the waste liquid is composed of two first and second discharge tubes at the portion where the waste liquid is introduced. By configuring the heavy discharge pipe, even if the waste liquid leaks from the primary discharge pipe according to the prior art, it is possible to limit the waste liquid into the discharge pipe. Therefore, it is possible to prevent the corrosion of the equipment related to the semiconductor manufacturing apparatus to increase the productivity of the semiconductor manufacturing apparatus, and to protect the worker's health and the surrounding natural environment from waste liquid.

Description

반도체장치의 제조과정에서 발생되는 폐액처리장치Waste-liquid treatment device generated during the manufacturing process of semiconductor devices

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 반도체장치의 제조과정에서 발생되는 폐액처리장치의 일 부분을 나타낸 도면이다.2 is a view showing a part of the waste liquid treatment apparatus generated in the manufacturing process of the semiconductor device according to the present invention.

Claims (8)

폐액이 흘러들어오는 배출관의 시작부분과 폐액처리장치의 바닥이 접속되는 부분의 둘레에 용접부분을 갖는 폐액배출관을 구비하는 폐액처리장치에 있어서, 상기 배출관을 제1 배출관이라 할 때 상기, 제1 배출관으로부터 누출된 폐액이 배출관밖으로 흘러가는 것을 방지하는 수단을 구비하는 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.A waste liquid treatment apparatus comprising a waste liquid discharge tube having a welded portion around a start portion of a discharge tube into which waste liquid flows and a bottom portion of a waste liquid treatment apparatus connected thereto, wherein the discharge tube is a first discharge tube. And a means for preventing the waste liquid leaking out from flowing out of the discharge pipe. 제1항에 있어서, 상기 수단은 상기 제1 배출관의 시작부분 둘레에 형성된 용접부분과 상기 제1 배출관을 완전히 포함하는 제2 배출관인 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus according to claim 1, wherein the means is a second discharge tube including a welded portion formed around the start of the first discharge tube and the first discharge tube completely. 제2항에 있어서, 상기 제1 배출관은 상기 폐액의 주 배출관인 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus of claim 2, wherein the first discharge tube is a main discharge tube of the waste liquid. 제2항에 있어서, 상기 제2 배출관은 관의 시작부분과 종단 부분의 직경이 다른 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus of claim 2, wherein the second discharge pipe has a diameter different from a diameter of a start portion and an end portion of the tube. 제4항에 있어서, 상기 제2 배출관은 관의 시작부분의 직경이 종단부분의 직경보다 넓은 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus of claim 4, wherein the second discharge pipe has a diameter larger than a diameter of an end of the tube. 제4항에 있어서, 상기 제2 배출관의 직경이 서로 다른 부분이 이어지는 부분의 관의 직경은 완만한 직경의 기울기를 갖는 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus of claim 4, wherein a diameter of a tube of a portion of the second discharge tube in which portions having different diameters are continuous has a slope of a gentle diameter. 제2항에 있어서, 상기 제1배출관은 상기 폐액이 유입되는 부분에만 일정길이 형성되어 있고 전체적인 관의 길이는 상기 제2 배출관보다 짧은 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus of claim 2, wherein the first discharge pipe has a predetermined length only at a portion into which the waste liquid flows, and an overall length of the tube is shorter than that of the second discharge pipe. 제5항에 있어서, 상기 제2 배출관의 좁은 부분의 직경은 적어도 상기 제1 배출관의 직경과 동일한 것을 특징으로 하는 반도체장치의 제조과정에서 발생되는 폐액처리장치.The waste liquid treatment apparatus of claim 5, wherein a diameter of the narrow portion of the second discharge pipe is at least equal to a diameter of the first discharge pipe.
KR1019950045811A 1995-11-30 1995-11-30 Waste-liquid treatment device generated during the manufacturing process of semiconductor devices KR970030250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950045811A KR970030250A (en) 1995-11-30 1995-11-30 Waste-liquid treatment device generated during the manufacturing process of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950045811A KR970030250A (en) 1995-11-30 1995-11-30 Waste-liquid treatment device generated during the manufacturing process of semiconductor devices

Publications (1)

Publication Number Publication Date
KR970030250A true KR970030250A (en) 1997-06-26

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KR1019950045811A KR970030250A (en) 1995-11-30 1995-11-30 Waste-liquid treatment device generated during the manufacturing process of semiconductor devices

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KR (1) KR970030250A (en)

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951130

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