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KR970003885A - 전력증폭모듈 - Google Patents

전력증폭모듈 Download PDF

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Publication number
KR970003885A
KR970003885A KR1019960023036A KR19960023036A KR970003885A KR 970003885 A KR970003885 A KR 970003885A KR 1019960023036 A KR1019960023036 A KR 1019960023036A KR 19960023036 A KR19960023036 A KR 19960023036A KR 970003885 A KR970003885 A KR 970003885A
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KR
South Korea
Prior art keywords
wiring board
power amplifier
package
module according
amplifier module
Prior art date
Application number
KR1019960023036A
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English (en)
Other versions
KR100203369B1 (ko
Inventor
켄이치로 마츠자키
가쿠 이시이
켄지 오토베
타츠야 하시나가
Original Assignee
쿠라우찌 노리타카
스미도모덴기고오교오 가부시기가이샤
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Publication of KR970003885A publication Critical patent/KR970003885A/ko
Application granted granted Critical
Publication of KR100203369B1 publication Critical patent/KR100203369B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Amplifiers (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

본 발명은, 반도체디바이스를 실장해서 전력증폭회로와 전기적으로 접속한 배선기판을, 패키지에 탑재해서 구성된 전력증폭모듈에 관한 것으로서, 파워앰프로부터 발생한 열을 외부에 고효율로 방출함으로써, 고성능화를 달성하는 것을 목적으로 하며, 그 구성에 있어서, 전력증폭모듈(10)은, 대략 평판형상의 패키지기체인 스템(30)과, 대략 사각형상자형상의 금속제 패키지덮개인 캡(40)을 접합해서 구성된 패키지(20)을 구비하고 있다. 스템(30)위에는, 대략 평판형상의 배선기판(50)이 설치되어 있고, 이 배선기판(50)은 캡(40)으로 덮여 있다. 배선기판(50)에는 2개의 도려낸 구멍(52a)(52b)이 형성되어 있고, 이 두려낸구멍(52a)(52b)으로부터 노출한 스템(30)위에는 각각 대략 평판형상의 2개의 히트스프레더(60a)(60b)가 설치되어 있다. 이들 히트스프레더(60a)(60b)의 각 표면위에는, 수지 등에 의해서 밀봉된 반도체디바이스(70a)(70b)가 각각 납땜등에 의해 설치 되어 있는 것을 특징으로 한 것이다.

Description

전력증폭모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시형태에 의한 전력증폭모드를 표시한 사시도.

Claims (8)

  1. 주면에 전자회로패턴이 형성되고, 또한 당해 주면 및 이면을 관통해서 적어도 1개의 도려낸 구멍이 형성된 배선기판과, 이 배선기판을 탑재하는 금속제의 패키지기체와, 이 패키지기체위에 탑재되고, 상기 배선기판에 형성된 도려낸 구멍으로부터 노출되는 적어도 1개의 히트스프레더와, 이 적어도 1개의 히트스프레더의 표면위에 탑재되고, 상기 배선기판의 전자회로패턴과 전기적으로 접속되어 전력증폭회로를 구성하는 적어도 1개의 반도체 디바이스와, 상기 배선기판을 내부에 수용해서 상기 패키지기체와 끼워맞춤되는 패키지덮개를 구비한 전력증폭모듈에 있어서, 상기 패키지기체 및 상기 적어도 1개의 히트스프레더는, 상기 배선기판의 구성재료보다도 큰 열전도율을 가진 재료로 각각 형성되어 있는 것을 특징으로 하는 전력증폭모듈.
  2. 제1항에 있어서, 히트스프레더의 높이는 배선기판의 두께와 거의 동등하게 한 것을 특징으로 하는 전력증폭모듈.
  3. 제1항에 있어서, 적어도 1개의 히트스트레더의 구성재료는 Cu 또는 CuW로 하는 것을 특징으로 하는 전력증폭모듈.
  4. 제1항에 있어서, 패키지기체의 구성재료는 Cu 또는 FeNi합금인 것을 특징으로 하는 전력증폭모듈.
  5. 제1항에 있어서, 반도체디바이스는, 전계효과형트랜지스터인 것을 특징으로 하는 전력증폭모듈.
  6. 제1항에 있어서, 배선기판의 단부에 고착되는 동시에, 상기 배선기판의 바닥면쪽에 구부려서 형성된 다리부를 가진 복수개의 리드단자를 또 구비하고, 패키지기체는, 상기 리드단자에 접촉하지 않도록 상기 배선기판에 밀착해서 맞대고, 또한, 상기 다리부의 구부림에 의해 상기 배선기판이 들뜨는 양이 상기 패키지기체의 두께와 동일한 것을 특징으로 하는 전력증폭모듈.
  7. 제1항에 있어서, 복수개의 리드단자는 배선기판의 한쪽의 측단부에 고착되어 있는 것을 특징으로 하는 전력증폭모듈.
  8. 제1항에 있어서, 복수개의 리드단자는 배선기판의 양쪽의 측단부에 고착되어 있는 것을 특징으로 하는 전력증폭모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960023036A 1995-06-22 1996-06-22 전력증폭모듈 KR100203369B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7156126A JPH098468A (ja) 1995-06-22 1995-06-22 モジュール電子部品
JP95-156126 1995-06-22

Publications (2)

Publication Number Publication Date
KR970003885A true KR970003885A (ko) 1997-01-29
KR100203369B1 KR100203369B1 (ko) 1999-06-15

Family

ID=15620900

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960023036A KR100203369B1 (ko) 1995-06-22 1996-06-22 전력증폭모듈

Country Status (4)

Country Link
US (1) US5835352A (ko)
JP (1) JPH098468A (ko)
KR (1) KR100203369B1 (ko)
TW (1) TW304322B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210043181A (ko) * 2019-10-11 2021-04-21 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

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JP2000208905A (ja) * 1999-01-14 2000-07-28 Nec Corp プリント基板
KR20010055094A (ko) * 1999-12-09 2001-07-02 조덕수 단말기용 고출력 하이브리드 증폭기 모듈 및 그 제조 방법
US6407931B1 (en) * 2000-07-11 2002-06-18 Cardiac Pacemakers, Inc. DC to DC converter
US7215204B2 (en) * 2004-12-29 2007-05-08 Agere Systems Inc. Intelligent high-power amplifier module
US7433192B2 (en) * 2004-12-29 2008-10-07 Agere Systems Inc. Packaging for electronic modules
TWI281736B (en) * 2005-10-26 2007-05-21 Delta Electronics Inc Power module fabrication method and structure thereof
JP5150076B2 (ja) * 2006-09-15 2013-02-20 株式会社豊田自動織機 表面実装用電子部品の表面実装構造
TW200836044A (en) * 2007-02-16 2008-09-01 Delta Electronics Thailand Public Co Ltd Heat-dissipating module
JP6477373B2 (ja) * 2015-09-11 2019-03-06 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
US9654060B1 (en) 2015-11-13 2017-05-16 International Business Machines Corporation Signal amplification using a reference plane with alternating impedance
US20230319995A1 (en) * 2022-04-01 2023-10-05 Macom Technology Solutions Holdings, Inc. Rf power pallet with management daugther board

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US4135168A (en) * 1978-02-02 1979-01-16 Microwave Semiconductor Corporation Reverse channel GaAsFET oscillator
US4227036A (en) * 1978-09-18 1980-10-07 Microwave Semiconductor Corp. Composite flanged ceramic package for electronic devices
EP0117434A1 (en) * 1983-01-28 1984-09-05 Microwave Semiconductor Corp. Hybrid microwave subsystem
US5041943A (en) * 1989-11-06 1991-08-20 Allied-Signal Inc. Hermetically sealed printed circuit board
CA2089435C (en) * 1992-02-14 1997-12-09 Kenzi Kobayashi Semiconductor device
KR100307465B1 (ko) * 1992-10-20 2001-12-15 야기 추구오 파워모듈

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210043181A (ko) * 2019-10-11 2021-04-21 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

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Publication number Publication date
TW304322B (ko) 1997-05-01
US5835352A (en) 1998-11-10
KR100203369B1 (ko) 1999-06-15
JPH098468A (ja) 1997-01-10

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